UJA1079_2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 27 May 2010 25 of 45
NXP Semiconductors
UJA1079
LIN core system basis chip
7. Limiting values
Table 8. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
x
voltage on pin x DC value
pins V1 and INTN 0.3 7 V
pins EN, SDI, SDO, SCK, SCSN, TXDL, RXDL,
RSTN and WDOFF
0.3 V
V1
+ 0.3 V
pin VEXCC V
V1
0.3 V
V1
+ 0.35 V
pins WAKE1, WAKE2, WBIAS and LIN;
with respect to any other pin
58 +58 V
pin LIMP and BAT 0.3 +40 V
pin VEXCTRL 0.3 V
BAT
+ 0.3 V
pin DLIN; with respect to any other pin V
BAT
0.3 +58 V
I
R(V1-BAT)
reverse current from
pin V1 to pin BAT
V
V1
5V
[1]
- 250 mA
I
DLIN
current on pin DLIN 65 0 mA
V
trt
transient voltage on pins
BAT: via reverse polarity diode/capacitor
LIN: coupling via 1 nF capacitor
DLIN: via 1 kW resistor
[2]
150 +100 V
V
ESD
electrostatic
discharge voltage
IEC 61000-4-2
[3]
pins BAT with capacitor and LIN; via a series
resistor on pins DLIN, WAKE1, WAKE2, LIMP and
WBIAS; via transistor on pin VEXCTRL
[4]
6+6kV
HBM
[5]
pins LIN, DLIN, WAKE1 and WAKE2
[6]
8+8kV
pin BAT; referenced to ground 4+4kV
pin TEST2; referenced to pin BAT 1.25 +2 kV
pin TEST2; referenced to other reference pins 2+2kV
any other pin 2+2kV
MM
[7]
any pin 300 +300 V
CDM
[8]
corner pins 750 +750 V
any other pin 500 +500 V
T
vj
virtual junction
temperature
[9]
40 +150 °C
T
stg
storage temperature 55 +150 °C
UJA1079_2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 27 May 2010 26 of 45
NXP Semiconductors
UJA1079
LIN core system basis chip
[1] A reverse diode connected between V1 (anode) and BAT (cathode) limits the voltage drop voltage from V1(+) to BAT ().
[2] Verified by an external test house to ensure pins can withstand ISO 7637 part 2 automotive transient test pulses 1, 2a, 3a and 3b.
[3] IEC 61000-4-2 (150 pF, 330 Ω).
[4] ESD performance according to IEC 61000-4-2 (150 pF, 330 Ω) has been verified by an external test house for pins BAT, LIN, WAKE1
and WAKE2. The result is equal to or better than ±6 kV.
[5] Human Body Model (HBM): according to AEC-Q100-002 (100 pF, 1.5 kΩ).
[6] V1 and BAT connected to GND, emulating application circuit.
[7] Machine Model (MM): according to AEC-Q100-003 (200 pF, 0.75 μH, 10 Ω).
[8] Charged Device Model (CDM): according to AEC-Q100-011 (field Induced charge; 4 pF).
[9] In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: T
vj
=T
amb
+P× R
th(vj-a)
, where R
th(vj-a)
is a
fixed value to be used for the calculation of T
vj
. The rating for T
vj
limits the allowable combinations of power dissipation (P) and ambient
temperature (T
amb
).
T
amb
ambient
temperature
40 +125 °C
Table 8. Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
UJA1079_2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 27 May 2010 27 of 45
NXP Semiconductors
UJA1079
LIN core system basis chip
8. Thermal characteristics
Layout conditions for R
th(j-a)
measurements: board finish thickness 1.6 mm ±10 %, board double
layer, board dimensions 129 mm × 60 mm, board Material FR4, Cu thickness 0.070 mm, thermal
via separation 1.2 mm, thermal via diameter 0.3 mm ±0.08 mm, Cu thickness on vias 0.025 mm.
Optional heat sink top layer of 3.5 mm × 25 mm will reduce thermal resistance (see Figure 12
).
Fig 11. HTSSOP PCB
PCB copper area:
(bottom layer)
2 cm
2
PCB copper area:
(bottom layer)
8 cm
2
optional heatsink top layer
optional heatsink top layer
optional heatsink top layer

UJA1079TW/5V0,112

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC SBC LINE 5V 32HTSSOP
Lifecycle:
New from this manufacturer.
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