TC1270/TC1271
DS21381D-page 8 © 2007 Microchip Technology Inc.
4-Lead Plastic Small Outline Transistor (RC) [SOT-143]
Notes:
1. § Significant Characteristic.
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 4
Pitch e 1.92 BSC
Pin1 Offset e1 0.20 BSC
Overall Height A 0.80 – 1.22
Molded Package Thickness A2 0.75 0.90 1.07
Standoff § A1 0.01 – 0.15
Overall Width E 2.10 – 2.64
Molded Package Width E1 1.20 1.30 1.40
Overall Length D 2.67 2.90 3.05
Foot Length L 0.13 0.50 0.60
Footprint L1 0.54 REF
Foot Angle φ 0° – 8°
Lead Thickness c 0.08 – 0.20
Lead 1 Width b1 0.76 – 0.94
Leads 2, 3 & 4 Width b 0.30 – 0.54
D
e
e/2
N
E
E1
21
e1
A
A1
b2
A2
3X
b
c
L
L1
φ
Microchip Technology Drawing C04-031B
