ADP196 Data Sheet
Rev. 0 | Page 12 of 12
OUTLINE DIMENSIONS
11-08-2012-B
A
B
C
0.675
0.595
0.515
0.380
0.355
0.330
0.270
0.240
0.210
1.000
0.950
0.900
1.500
1.450
1.400
12
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
SIDE VIEW
0.345
0.295
0.245
1.00
REF
0.50
BSC
BALL A1
IDENTIFIER
SEATING
PLANE
0.50 BSC
COPLANARITY
0.075
Figure 28. 6-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-6-2)
Dimensions shown in millimeters
1.70
1.60
1.50
0.425
0.350
0.275
TOP VIEW
6
1
4
3
0.35
0.30
0.25
BOTTOM VIEW
PIN 1 INDEX
AREA
SEATING
PLANE
0.60
0.55
0.50
1.10
1.00
0.90
0.20 REF
0.05 MAX
0.02 NOM
0.65 BSC
EXPOSED
PAD
PIN 1
INDICATOR
(R 0.15)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
02-06-2013-D
0.15 REF
2.10
2.00 SQ
1.90
0.20 MIN
Figure 29. 6-Lead Lead Frame Chip Scale Package [LFCSP_UD]
2.00 mm × 2.00 mm Body, Ultra Thin, Dual Lead
(CP-6-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Branding
ADP196ACBZ-R7 −40°C to +85°C 6-Ball Wafer Level Chip Scale Package [WLCSP] CB-6-2 AW
ADP196ACPZN-R7 −40°C to +85°C 6-Lead Lead Frame Chip Scale Package [LFCSP_UD] CP-6-3 AW
ADP196ACBZ-01-R7 −40°C to +85°C 6-Ball Wafer Level Chip Scale Package [WLCSP],
Quick Output Discharge Option
CB-6-2 BK
ADP196ACPZN-01-R7 −40°C to +85°C 6-Lead Lead Frame Chip Scale Package [LFCSP_UD],
Quick Output Discharge Option
CP-6-3 BK
ADP196CP-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.
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registered trademarks are the property of their respective owners.
D10704-0-3/13(0)
