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CMF-SDP25A-2

P1-P3
Features
n Two resistance-matched PTCs in a
plastic housing
n Narrow resistance tolerance
n RoHS compliant*
Applications
Used as a secondary overcurrent protection
device in:
n Customer Premise Equipment (CPE)
n Central Office (CO)
n Access equipment
CMF-SDP Series - Telecom CPTC Resettable Fuses
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Test Procedures And Requirements For Model CMF-SDP Series
Primary
Test Protection Test Condition Requirements
Mains Power Contact - ITU-T K.20, K.21 .... None .............. 230 V rms, 10 ohms, 15 Min. ..................................................... (Ri-Rf) / Ri < ±10 %
Power Induction - ITU-T K.20, K.21 ............. None .............. 600V rms, 600 ohms, 0.2 seconds, 10 cycles, every 1 Min. ...... (Ri-Rf) / Ri < ±10 %
Power Induction - ITU-T K.20, K.21 ............. GDT ............... 600 V rms, 600 ohms, 1 second, 10 cycles, every 1 Min. ......... (Ri-Rf) / Ri < ±10 %
Power Induction - ITU-T K.20, K.21 ............. GDT ............... 600 V rms, 200 ohms, 1 second, 10 cycles, every 1 Min. ......... (Ri-Rf) / Ri < ±10 %
Lightning Surge - ITU-T K.20, K.21 ..................................... 10/700 μs, 25 ohms, 1.0 kV, 10 Tests, every 1 Min. ................ (Ri-Rf) / Ri < ±10 %
Lightning Surge ................................................................... 10/1000 μs, 60 ohms, 1.5 kV, 30 Tests, every 3 Min. ............... (Ri-Rf) / Ri < ±10 %
Ri = R initial
Rf = R nal
Electrical Characteristics
Model
Induction
Voltage
Withstand
Rated
Voltage
Rated
Resistance
(RN)
Resistance
Matching in
Housing
Hold
Current
Trip
Current
Imax @
230 VAC
Typ. Time
to Trip @
Imax / 230
VAC
VAC Volts Ohms Tolerance Ohms Amps @ 25 °C Amps @ 25 °C Amps Seconds
CMF-SDP07 250 230 7 ±20 % <=1.0 0.080 0.200 3.0 0.45
CMF-SDP10 250 230 10 ±20 % <=1.0 0.180 0.360 1.0 3.8
CMF-SDP10A 250 230 10 ±20 % <=1.0 0.150 0.360 1.0 3.8
CMF-SDP25 250 230 25 ±20 % <=1.0 0.130 0.260 2.8 0.2
CMF-SDP25A 250 230 25 ±20 % <=1.0 0.130 0.260 2.8 0.3
CMF-SDP35 600 230 35 +15/-20 % <=1.0 0.110 0.230 4.6 0.06
CMF-SDP35A 600 230 35 +15/-20 % <=1.0 0.110 0.230 2.5 0.2
CMF-SDP50 600 230 50 ±15 % <=1.0 0.090 0.190 2.5 0.13
CMF-SDP50A 600 230 50 ±15 % <=1.0 0.090 0.190 2.5 0.2
CMF-SDP75 600 230 75 ±20 % <=2.0 0.070 0.150 2.5 0.12
How to Order
CMF - SD P 35 A -XX - 2
Product Designator
Style
SD = Surface Mount
Dual Pkg.
Housing
P = Plastic
Rated Resistance (RN)
7-75 (7-75 Ohms)
Footprint and Height Option
Blank = Standard Product
A = Reduced Footprint and Height
Resistance Tolerance Option
Blank = Standard
-XX = XX %; e.g. -10 = ±10 %
Packaging
- 2 = Tape & Reel
Typical Part Marking
Represents total content. Layout may vary.
*RoHS COMPLIANT
LEAD FREE
*RoHS COMPLIANT
VERSIONS
AVAILABLE
LEAD FREE
VERSIONS ARE
RoHS COMPLIANT*
Operating Temperature Range: -40 °C to +125 °C.
35P8G
MANUFACTURER'S
TRADEMARK
PART
IDENTIFICATION:
07P = CMF-SDP07
10P = CMF-SDP10
10PA = CMF-SDP10A
25P = CMF-SDP25
25PA = CMF-SDP25A
35P = CMF-SDP35
35PA = CMF-SDP35A
50P = CMF-SDP50
50PA = CMF-SDP50A
75P = CMF-SDP75
YEAR CODE:
8 = 2008
BI-WEEKLY
DATE CODE:
WEEK 13-14 = G
Asia-Pacic:
Tel: +886-2 2562-4117
Email: asiacus@bourns.com
Europe:
Tel: +36 88 520 390
Email: eurocus@bourns.com
The Americas:
Tel: +1-951 781-5500
Email: americus@bourns.com
www.bourns.com
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
CMF-SDP Series - Telecom CPTC Resettable Fuses
CMF-SDP SERIES, REV. E, 07/16
Product Dimensions
Solder Reow Recommendations
160–220
300
250
200
150
100
50
0
10–20
Temperature (ϒC)
120
Preheating Soldering Cooling
Time (seconds)
Solder reow
• Recommended reow methods: IR, vapor phase oven, hot air oven.
• Devices are not designed to be wave soldered to the bottom side of the
board.
• Gluing the devices is not recommended.
• Recommended maximum paste thickness is 0.25 mm (.010 inch).
• Devices can be cleaned using standard industry methods and solvents.
Note:
• If reow temperatures exceed the recommended prole, devices may not
meet the performance requirements.
Rework
• A device should not be reworked.
8.75
(.344)
MAX.
MAX.
MAX.
7.2
(.283)
7.2
(.283)
MAX.
8.75
(.344)
MAX.
3.2
(.126)
2.0
(.079)
2.4
(.094)
6.3
(.248)
3.9
(.154)
8.2
(.323)
3.9
(.154)
0.5
(.020)
2 PLCS.
10.2
(402)
2.4
(.094)
9.0
(.354)
10.0
(.394)
3.2
(.126)
2.0
(.079)
2.6
(.102)
7.6
(.299)
11.0
(.433)
5.0
(.197)
5.0
(.197)
11.0
(.433)
MAX.
9.0
(.354)
MAX.
11.5
(.453)
MAX.
2.6
(.102)
CMF-SDP10A, 25A, 35A, 50A & 75A
CMF-SDP05, 07, 10, 25, 35, 50 & 75
8.75
(.344)
MAX.
MAX.
MAX.
7.2
(.283)
7.2
(.283)
MAX.
8.75
(.344)
MAX.
3.2
(.126)
2.0
(.079)
2.4
(.094)
6.3
(.248)
3.9
(.154)
8.2
(.323)
3.9
(.154)
0.5
(.020)
2 PLCS.
10.2
(402)
2.4
(.094)
9.0
(.354)
10.0
(.394)
3.2
(.126)
2.0
(.079)
2.6
(.102)
7.6
(.299)
11.0
(.433)
5.0
(.197)
5.0
(.197)
11.0
(.433)
MAX.
9.0
(.354)
MAX.
11.5
(.453)
MAX.
2.6
(.102)
CMF-SDP10A, 25A, 35A, 50A & 75A
CMF-SDP05, 07, 10, 25, 35, 50 & 75
Recommended Pad Layout
8.75
(.344)
MAX.
MAX.
MAX.
7.2
(.283)
7.2
(.283)
MAX.
8.75
(.344)
MAX.
3.2
(.126)
2.0
(.079)
2.4
(.094)
6.3
(.248)
3.9
(.154)
8.2
(.323)
3.9
(.154)
0.5
(.020)
2 PLCS.
10.2
(402)
2.4
(.094)
9.0
(.354)
10.0
(.394)
3.2
(.126)
2.0
(.079)
2.6
(.102)
7.6
(.299)
11.0
(.433)
5.0
(.197)
5.0
(.197)
11.0
(.433)
MAX.
9.0
(.354)
MAX.
11.5
(.453)
MAX.
2.6
(.102)
CMF-SDP10A, 25A, 35A, 50A & 75A CMF-SDP05, 07, 10, 25, 35, 50 & 75
8.75
(.344)
MAX.
MAX.
MAX.
7.2
(.283)
7.2
(.283)
MAX.
8.75
(.344)
MAX.
3.2
(.126)
2.0
(.079)
2.4
(.094)
6.3
(.248)
3.9
(.154)
8.2
(.323)
3.9
(.154)
0.5
(.020)
2 PLCS.
10.2
(402)
2.4
(.094)
9.0
(.354)
10.0
(.394)
3.2
(.126)
2.0
(.079)
2.6
(.102)
7.6
(.299)
11.0
(.433)
5.0
(.197)
5.0
(.197)
11.0
(.433)
MAX.
9.0
(.354)
MAX.
11.5
(.453)
MAX.
2.6
(.102)
CMF-SDP10A, 25A, 35A, 50A & 75A CMF-SDP05, 07, 10, 25, 35, 50 & 75
DIMENSIONS:
MM
(INCHES)
Packaging - Tape and Reel: 350 pcs. per reel
Packaging - Tape and Reel: 350 pcs. per reel
DIMENSIONS:
MM
(INCHES)
Tape Dimensions per EIA 481-2 CMF-SDP10-2, CMF-SDP25-2,
CMF-SDP-35-2, CMF-SDP50-2, CMF-SDP10A-2, CMF-SDP25A-2,
CMF-SDP75-2 CMF-SDP35A-2, CMF-SDP50A-2
W
24.0 ±0.5 24.0 ±0.5
(0.945 ±0.020) (0.945 ±0.020)
P
0
4.0 4.0
(0.157) (0.157)
P
16.0 16.0
(0.630) (0.630)
P
2
2.0 2.0
(0.079) (0.079)
A
0
9.2 ± 0.2 7.5 ± 0.2
(0.362 ± 0.008) (0.295 ± 0.008)
B
0
11.0 ± 0.2 9.0 ± 0.2
(0.441 ± 0.008) (0.354 ± 0.008)
D
1.5 1.5
(0.059) (0.059)
F
11.5 11.5
(0.453) (0.453)
E
1.75 1.75
(0.069) (0.069)
t
0.5 ± 0.15 0.5 ± 0.15
(0.020 ± 0.006) (0.020 ± 0.006)
K
0
11.5 ± 0.2 10.0 ± 0.2
(0.453 ± 0.008) (0.394 ± 0.008)
CMF-SDP Series Tape and Reel Specifications
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
A
0
P
P
0
T
K
0
B
0
F
E
W
P
2
-0.4
(-.016)
D
13.2 +0.2/-0
(.520 +.008/-0
100 ± 1.5
(3.94 ± .059)
DIA.
24.4
(.961)
30.4
(1.197)
MAX.
MIN.
330 -2/+0
(12.99 -.079/+0)
DIA.
DIMENSIONS:
MM
(INCHES)
P1-P3

CMF-SDP25A-2

Mfr. #:
Buy CMF-SDP25A-2
Manufacturer:
Bourns
Description:
Resettable Fuses - PPTC Ceramic PTC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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