(0.80 mm) .0315"
BTE, BSE SERIES
BTE–040–02–L–D–A
BTE–060–02–F–D–A
BSE–020–01–F–D–A
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
For complete specifications and
recommended PCB layouts see
www.samtec.com?BTE or
www.samtec.com?BSE
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating: Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating: 2 A per pin
(1 pin powered per row)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating: 225 VAC with
5 mm Stack Height
Max Cycles: 100
RoHS Compliant: Ye s
Mates with:
BTE
BSE
NO. OF POSITIONS
PER ROW
D
PLATING
OPTION
–020, –040, –060,
–080, –100, –120
–F
= Gold Flash on contact,
Matte Tin on tail
–L
= 10 µ" (0.25 µm) Gold on contact,
Matte Tin on tail
–C*
= Electro-Polished Selective
50 µ" (1.27 µm) min Au over
150 µ" (3.81 µm) Ni on Signal Pins in
contact area, Matte Tin over
50 µ" (1.27 µm) min Ni on all solder tails
OTHER
OPTION
A
–K
= (7.00 mm)
.275" DIA
Polyimide
Film Pick
& Place Pad
–TR
= Tape & Reel
(60 positions
maximum)
01
Mates with:
BSE
BTE
NO. OF POSITIONS
PER ROW
D
PLATING
OPTION
–020, –040, –060,
–080, –100, –120
OTHER
OPTION
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
A
–F
= Gold Flash on contact,
Matte Tin on tail
–L
= 10 µ" (0.25 µm) Gold on contact,
Matte Tin on tail
–C*
= Electro-Polished Selective
50 µ" (1.27 µm) min Au over
150 µ" (3.81 µm) Ni on
Signal Pins in contact area,
Matte Tin over 50 µ" (1.27 µm) min
Ni on all solder tails
No. of positions x (0.80) .0315
+ (4.00) .1575
(0.20)
.008
(5.97)
.235
(0.80) .0315
A
(3.94)
.155
01
02
(0.89)
.035
DIA
(7.11)
.280
(0.76)
.030
–TR
= Tape & Reel
(80 positions
maximum)
No. of positions x (0.80) .0315
+ (5.27) .2075
(6.22)
.245
(7.24)
.285
(3.81)
.150
(0.80) .0315
02
01
(0.15)
.006
(3.05)
.120
(0.76)
.030
(7.49)
.295
(1.78)
.070
(3.25)
.128
(0.89)
.035
DIA
*Note: –C Plating passes
10 year MFG testing
*Note: –C Plating passes 10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
SPECIFICATIONS
BASIC BLADE & BEAM HEADER & SOCKET
• Passes
10 year MFG
F-217
For complete scope
of recognitions see
www.samtec.com/quality
RECOGNITIONS
ALSO AVAILABLE
(MOQ Required)
MATED HEIGHT
• 30 µ" (0.76 µm) Gold
• Edge Mount Capability
• Friction Lock option
• 11 mm, 14 mm, 16.10 mm,
19.10 mm, 22 mm, 25 mm and
30 mm Stack Height (Caution:
Some automatic placement/
inspection machines may have
component height restrictions.
Please consult machinery
specifications.)
Contact Samtec.
LEAD
STYLE
MATED
HEIGHT*
–01
(5.00) .197
–02
(8.00) .315
*Processing conditions will
affect mated height.
PROCESSING
Lead-Free Solderable: Ye s
SMT Lead Coplanarity:
(0.10 mm) .004" max (020-080)
(0.15 mm) .006" max (100-120)
Board Stacking:
For applications requiring more
than two connectors per board
or 80 positions or higher,
contact ipg@samtec.com
EXTENDED LIFE
PRODUCT
10 YEAR MFG
WITH 50 µ" GOLD
HIGH MATING
CYCLES
LEAD
STYLE
A
–01
(4.27)
.168
–02
(7.21)
.284
