NXP Semiconductors
BT236X-600
4Q Triac
BT236X-600 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet 1 May 2015 6 / 13
8. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
full or half cycle; without heatsink
compound; Fig. 6
- - 4.5 K/WR
th(j-h)
thermal resistance
from junction to
heatsink
full or half cycle; with heatsink
compound; Fig. 6
- - 6.5 K/W
R
th(j-a)
thermal resistance
from junction to
ambient
in free air - 55 - K/W
003aab331
t
p
(s)
10
-5
1 1010
-1
10
-2
10
-4
10
-3
1
10
-1
10
Z
th(j-h)
10
-2
(K/W)
(1)
(2)
(3)
(4)
t
p
P
t
(1) Unidirectional (half cycle) without heatsink compound
(2) Unidirectional (half cycle) with heatsink compound
(3) Bidirectional (full cycle) without heatsink compound
(4) Bidirectional (full cycle) with heatsink compound
Fig. 6. Transient thermal impedance from junction to heatsink as a function of pulse width
9. Isolation characteristics
Table 6. Isolation characteristics
Symbol Parameter Conditions Min Typ Max Unit
V
isol(RMS)
RMS isolation voltage from all terminals to external heatsink;
sinusoidal waveform; clean and dust
free; 50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %;
T
h
= 25 °C
- - 2500 V
C
isol
isolation capacitance from main terminal 2 to external
heatsink; f = 1 MHz; T
h
= 25 °C
- 10 - pF
NXP Semiconductors
BT236X-600
4Q Triac
BT236X-600 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet 1 May 2015 7 / 13
10. Characteristics
Table 7. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
D
= 12 V; I
T
= 0.1 A; T2+ G+;
T
j
= 25 °C; Fig. 7
- 5 35 mA
V
D
= 12 V; I
T
= 0.1 A; T2+ G-;
T
j
= 25 °C; Fig. 7
- 8 35 mA
V
D
= 12 V; I
T
= 0.1 A; T2- G-;
T
j
= 25 °C; Fig. 7
- 11 35 mA
I
GT
gate trigger current
V
D
= 12 V; I
T
= 0.1 A; T2- G+;
T
j
= 25 °C; Fig. 7
- 30 70 mA
V
D
= 12 V; I
G
= 0.1 A; T2+ G+;
T
j
= 25 °C; Fig. 8
- 7 30 mA
V
D
= 12 V; I
G
= 0.1 A; T2+ G-;
T
j
= 25 °C; Fig. 8
- 16 45 mA
V
D
= 12 V; I
G
= 0.1 A; T2- G-;
T
j
= 25 °C; Fig. 8
- 5 30 mA
I
L
latching current
V
D
= 12 V; I
G
= 0.1 A; T2- G+;
T
j
= 25 °C; Fig. 8
- 7 45 mA
I
H
holding current V
D
= 12 V; T
j
= 25 °C; Fig. 9 - 5 20 mA
V
T
on-state voltage I
T
= 10 A; T
j
= 25 °C; Fig. 10 - 1.3 1.65 V
V
D
= 12 V; I
T
= 0.1 A; T
j
= 25 °C;
Fig. 11
- 0.7 1 VV
GT
gate trigger voltage
V
D
= 400 V; I
T
= 0.1 A; T
j
= 125 °C;
Fig. 11
0.25 0.4 - V
I
D
off-state current V
D
= 600 V; T
j
= 125 °C - 0.1 0.5 mA
Dynamic characteristics
dV
D
/dt rate of rise of off-state
voltage
V
DM
= 402 V; T
j
= 125 °C; (V
DM
= 67%
of V
DRM
); exponential waveform; gate
open circuit
100 250 - V/µs
dV
com
/dt rate of change of
commutating voltage
V
D
= 400 V; T
j
= 95 °C; dI
com
/dt = 3.6 A/
ms; I
T
= 6 A; gate open circuit
- 20 - V/µs
t
gt
gate-controlled turn-on
time
I
TM
= 12 A; V
D
= 600 V; I
G
= 0.1 A; dI
G
/
dt = 5 A/µs
- 2 - µs
NXP Semiconductors
BT236X-600
4Q Triac
BT236X-600 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet 1 May 2015 8 / 13
001aae042
T
j
(°C)
-50 1501000 50
1
2
3
I
GT
I
GT(25°C)
0
(1)
(2)
(3)
(4)
(3)
(4)
(2)
(1)
(1) T2- G-
(2) T2+ G-
(3) T2+ G+
(4) T2- G+
Fig. 7. Normalized gate trigger current as a function of
junction temperature
T
j
(°C)
-50 1501000 50
001aab100
1
2
3
0
I
L
I
L(25°C)
Fig. 8. Normalized latching current as a function of
junction temperature
T
j
(°C)
-50 1501000 50
001aab099
1
2
3
0
I
H
I
H(25°C)
Fig. 9. Normalized holding current as a function of
junction temperature
0
03aa
b311
0
5
1
0
1
5
2
0
2
5
0
1
2
3
V
T
(
V
)
I
T
(
A
)
(
1
)
(
2
)
(
3
)
V
o
= 1.26 V; R
s
= 0.0378 Ω
(1) T
j
= 125 °C; typical values
(2) T
j
= 125 °C; maximum values
(3) T
j
= 25 °C; maximum values
Fig. 10. On-state current as a function of on-state
voltage

BT236X-600G,127

Mfr. #:
Manufacturer:
WeEn Semiconductors
Description:
Triacs RAIL-THYR AND TRIACS
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New from this manufacturer.
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