RJK0355DSP-00#J0

REJ03G1650-0301 Rev.3.01 Apr 24, 2008
Page 1 of 6
RJK0355DSP
Silicon N Channel Power MOS FET
Power Switching
REJ03G1650-0301
Rev.3.01
Apr 24, 2008
Features
Capable of 4.5 V gate drive
Low drive current
High density mounting
Low on-resistance
R
DS(on)
= 8.5 m typ. (at V
GS
= 10 V)
Pb-free
Outline
RENESAS Package code: PRSP0008DD-D
(Package name: SOP-8<FP-8DAV>)
1, 2, 3 Source
4 Gate
5, 6, 7, 8 Drain
G
D
SSS
D
DD
4
1
23
5678
1
2
3
4
5
6
7
8
Absolute Maximum Ratings
(Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V
DSS
30 V
Gate to source voltage V
GSS
±20 V
Drain current I
D
12 A
Drain peak current I
D(pulse)
Note1
96 A
Body-drain diode reverse drain current I
DR
12 A
Avalanche current I
AP
Note 2
9 A
Avalanche energy E
AR
Note 2
8.1 mJ
Channel dissipation Pch
Note3
1.8 W
Channel to ambient thermal impedance θch-a
Note3
69.4 °C/W
Channel temperature Tch 150 °C
Storage temperature Tstg –55 to +150 °C
Notes: 1. PW 10 µs, duty cycle 1%
2. Value at Tch = 25°C, Rg 50
3. When using the glass epoxy board (FR4 40 x 40 x 1.6 mm), PW 10s
RJK0355DSP
REJ03G1650-0301 Rev.3.01 Apr 24, 2008
Page 2 of 6
Electrical Characteristics
(Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage V
(BR)DSS
30 V I
D
= 10 mA, V
GS
= 0
Gate to source leak current I
GSS
± 0.1 µA V
GS
= ±20 V, V
DS
= 0
Zero gate voltage drain current I
DSS
1 µA V
DS
= 30 V, V
GS
= 0
Gate to source cutoff voltage V
GS(off)
1.2 — 2.5 V V
DS
= 10 V,
I
D
= 1 mA
R
DS(on)
8.5 11.1 m I
D
= 6 A, V
GS
= 10 V
Note4
Static drain to source on state
resistance
R
DS(on)
12.0 16.8 m I
D
= 6 A, V
GS
= 4.5 V
Note4
Forward transfer admittance |y
fs
| — 35 — S I
D
= 6 A, V
DS
= 10 V
Note4
Input capacitance Ciss 860 pF
Output capacitance Coss 165 pF
Reverse transfer capacitance Crss 53 pF
V
DS
= 10 V
V
GS
= 0
f = 1 MHz
Gate Resistance Rg — 4.2 —
Total gate charge Qg 6.0 nC
Gate to source charge Qgs 2.3 nC
Gate to drain charge Qgd 1.4 nC
V
DD
= 10 V
V
GS
= 4.5 V
I
D
= 6 A
Turn-on delay time t
d(on)
— 6.9 — ns
Rise time t
r
— 3.5 — ns
Turn-off delay time t
d(off)
40.2 ns
Fall time t
f
— 4.8 — ns
V
GS
= 10 V, I
D
= 6 A
V
DD
10 V
R
L
= 1.67
Rg = 4.7
Body–drain diode forward voltage V
DF
0.82 1.07 V I
F
= 12 A, V
GS
= 0
Note3
Body–drain diode reverse recovery
time
t
rr
— 20 — ns
I
F
= 12 A, V
GS
= 0
di
F
/ dt = 100 A/ µs
Notes: 4. Pulse test
RJK0355DSP
REJ03G1650-0301 Rev.3.01 Apr 24, 2008
Page 3 of 6
Main Characteristics
Drain to Source Voltage V
DS
(V)
Drain Current I
D
(A)
Typical Output Characteristics
Drain Current I
D
(A)
Gate to Source Voltage V
GS
(V)
Drain to Source Saturation Voltage
V
DS (on)
(mV)
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
Gate to Source Voltage V
GS
(V)
Typical Transfer Characteristics
Drain Current I
D
(A)
Static Drain to Source on State Resistance
vs. Drain Current
20
16
12
8
4
0
246810
20
16
12
8
4
0
12 34
5
Tc = 75°C
25°C
–25°C
V
DS
= 10 V
Pulse Test
V
GS
= 2.6 V
Pulse Test
10
3
1
30 3001 10 100 1000
3
200
150
100
50
0
4 8 12 16 20
Pulse Test
I
D
= 10 A
5 A
100
30
V
GS
= 4.5 V
10 V
2.8 V
3.0 V
10 V
3.2 V
4.5 V
Pulse Test
2 A
Drain to Source on State Resistance
R
DS (on)
(m)
Channel Dissipation Pch (W)
Ambient Temperature Ta (°C)
Power vs. Temperature Derating
4.0
3.0
2.0
1.0
0
50 100 150 200
Test Condition :
When using the glass epoxy board
(FR4 40x40x1.6 mm), PW 10 s
Drain to Source Voltage V
DS
(V)
Drain Current I
D
(A)
Maximum Safe Operation Area
Note 5 : When using the glass epoxy board
(FR4 40x40x1.6 mm)
100
10
1
0.1
0.01
0.1
0.3 1 3 10 30 100
500
Ta = 25 °C
1 shot Pulse
PW = 10 ms
10 µs
100 µs
Operation in
this area is
limited by R
DS(on)
Note 5
DC Operation (PW 10 s)
1 ms

RJK0355DSP-00#J0

Mfr. #:
Manufacturer:
Renesas Electronics
Description:
MOSFET Speed Series MOSFET, 30V, SO-8, PB Free
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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