STPS3H100UF

Characteristics STPS3H100
4/9 Doc ID 16776 Rev 1
Figure 7. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMB)
Figure 8. Relative variation of thermal
impedance junction to lead
versus pulse duration (SMB flat)
Z/R
th(j-a) th(j-a)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
SMB
t (s)
p
Z/R
th(j-l) th(j-l)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
Single pulse
SMB flat
t (s)
p
Figure 9. Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 10. Junction capacitance versus
reverse voltage applied
(typical values)
I (µA)
R
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
0 20 40 60 80 100
T
j
=150 °C
T
j
=125 °C
T
j
=25 °C
T
j
=100 °C
T
j
=75 °C
T
j
=50 °C
V (V)
R
C(pF)
10
100
1 10 100
F=1 MHz
V
OSC
=30 mV
RMS
T
j
=25 °C
V (V)
R
STPS3H100 Characteristics
Doc ID 16776 Rev 1 5/9
Figure 13. Thermal resistance junction to ambient versus copper surface under each lead
(SMBflat)
Figure 11. Forward voltage drop versus
forward current
Figure 12. Thermal resistance junction to
ambient versus copper surface
under each lead (SMB)
I (A)
FM
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
T
j
=25 °C
(Maximum values)
T
j
=125 °C
(Maximum values)
T
j
=125 °C
(Maximum values)
T
j
=125 °C
(Typical values)
T
j
=125 °C
(Typical values)
V (V)
FM
R (°C/W)
th(j-a)
0
10
20
30
40
50
60
70
80
90
100
110
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SMB
S (cm²)
CU
R (°C/W)
th(j-a)
0
10
20
30
40
50
60
70
80
90
100
110
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SMB flat
S (cm²)
CU
Package Information STPS3H100
6/9 Doc ID 16776 Rev 1
2 Package Information
Epoxy meets UL94, V0
Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Figure 14. SMB footprint (dimensions in mm)
Table 5. SMB dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 1.95 2.20 0.077 0.087
c 0.15 0.40 0.006 0.016
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.159 0.181
D 3.30 3.95 0.130 0.156
L 0.75 1.50 0.030 0.059
E
C
L
E1
D
A1
A2
b
2.60
5.84
1.62
2.18
1.62

STPS3H100UF

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Schottky Diodes & Rectifiers Power Schottky REC 3A IF 100V Vrrm .68V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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