SI3430DV-T1-GE3

Si3430DV
www.vishay.com
Vishay Siliconix
S15-2974-Rev. D, 21-Dec-15
1
Document Number: 71235
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
N-Channel 100 V (D-S) MOSFET
Ordering Information:
Si3430DV-T1-E3 (Lead (Pb)-free)
Si3430DV-T1-GE3 (Lead (Pb)-free and halogen-free)
FEATURES
High-efficiency PWM optimized
100 % R
g
tested
Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
Note
a. Surface mounted on 1" x 1" FR4 board.
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
()I
D
(A)
100
0.170 at V
GS
= 10 V 2.4
0.185 at V
GS
= 6 V 2.3
Top View
TSOP-6 Single
1
D
2
D
3
G
D
6
D
5
S
4
Available
(1, 2, 5, 6) D
(3) G
(4) S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL 5 s STEADY STATE UNIT
Drain-Source Voltage V
DS
100
V
Gate-Source Voltage V
GS
± 20
Continuous Drain Current (T
J
= 175 °C)
a
T
A
= 25 °C
I
D
2.4 1.8
A
T
A
= 85 °C 1.7 1.3
Pulsed Drain Current I
DM
8
Avalanche Current
L = 0.1 mH
I
AR
6
Repetitive Avalanche Energy (Duty cycle 1 %) E
AR
1.8 mJ
Continuous Source Current (Diode conduction)
a
I
S
1.7 1 A
Maximum Power Dissipation
a
T
A
= 25 °C
P
D
21.14
W
T
A
= 85 °C 1 0.59
Operating Junction and Storage Temperature Range T
J
, T
stg
-55 to 150 °C
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TYPICAL MAXIMUM UNIT
Maximum Junction-to-Ambient
a
t 5 s
R
thJA
45 62.5
°C/WSteady State 90 110
Maximum Junction-to-Foot (Drain) Steady State Rt
hJF
25 30
Si3430DV
www.vishay.com
Vishay Siliconix
S15-2974-Rev. D, 21-Dec-15
2
Document Number: 71235
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes
a. Pulse test; pulse width 300 μs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Output Characteristics Transfer Characteristics
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Gate Threshold Voltage V
GS(th)
V
DS
= V
DS
, I
D
= 250 μA 2 - 4.2 V
Gate-Body Leakage I
GSS
V
DS
= 0 V, V
GS
= ± 20 V - - ± 100 nA
Zero Gate Voltage Drain Current I
DSS
V
DS
= 80 V, V
GS
= 0 V - - 1
μA
V
DS
= 80 V, V
GS
= 0 V, T
J
= 85 °C - - 25
On-State Drain Current
a
I
D(on)
V
DS
5 V, V
GS
= 10 V 8 - - A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= 10 V, I
D
= 2.4 A - 0.148 0.170
V
GS
= 6 V, I
D
= 2.3 A - 0.160 0.185
Forward Transconductance
a
g
fs
V
DS
= 15 V, I
D
= 2.4 A - 7 - S
Diode Forward Voltage
a
V
SD
I
S
= 1.7 A, V
GS
= 0 V - 0.8 1.2 V
Dynamic
b
Total Gate Charge Q
g
V
DS
= 50 V, V
GS
= 10 V, I
D
= 2.4 A
-5.56.6
nCGate-Source Charge Q
gs
-1.5-
Gate-Drain Charge Q
gd
-1.4-
Gate Resistance R
g
1-4
Turn-On Delay Time t
d(on)
V
DD
= 50 V, R
L
= 50
I
D
1 A, V
GEN
= 10 V, R
g
= 6
-920
ns
Rise Time t
r
-1120
Turn-Off Delay Time t
d(off)
-1630
Fall Time t
f
-920
Gate Resistance R
g
V
GS
= 0.1 V, f = 5 MHz - 2.8 -
Source-Drain Reverse Recovery Time t
rr
I
F
= 1.7 A, dI/dt = 100 A/μs - 50 80 ns
0
2
4
6
8
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
V
GS
= 10 V thru 6 V
4
V
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)I
D
5
V
0
2
4
6
8
012345
T
C
= 125 °C
25 °C
V
GS
- Gate-to-Source Voltage (V)
- Drain Current (A)I
D
-55 °C
6
Si3430DV
www.vishay.com
Vishay Siliconix
S15-2974-Rev. D, 21-Dec-15
3
Document Number: 71235
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
On-Resistance vs. Drain Current
Gate Charge
Source-Drain Diode Forward Voltage
Capacitance
On-Resistance vs. Junction Temperature
On-Resistance vs. Gate-to-Source Voltage
- On-Resistance ()R
DS(on)
0.00
0.05
0.10
0.15
0.20
0.25
02468
I
D
- Drain Current (A)
V
GS
= 10 V
V
GS
= 6.0 V
0
2
4
6
8
10
0
123456
V
DS
= 50 V
I
D
= 2.4 A
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
0.0 0.2 0.4 0.6 0.8 1.0 1.2
T
J
= 150 °C
T
J
= 25 °C
10
1
V
SD
- Source-to-Drain Voltage (V)
- Source Current (A)I
S
0
100
200
300
400
500
0 1020304050
V
DS
- Drain-to-Source Voltage (V)
rss
C
oss
C
iss
C - Capacitance (pF)
C
60
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
-50 -25 0 25 50 75 100 125 150
V
GS
= 10 V
I
D
= 2.4 A
T
J
- Junction Temperature (°C)
(Normalized)- On-Resistance R
DS(on)

SI3430DV-T1-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET 100V 2.4A 2.0W 170mohm @ 10V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet