16
1732FS–ATARM–12-Apr-06
AT91R40008
10. Soldering Profile
10.1 LQFP Package Soldering Profile (Green)
Table 10-1 gives the recommended soldering profile from J-STD-020C.
Note: The package is certified to be backward compatible with Pb/Sn soldering profile.
A maximum of three reflow passes is allowed per component.
Table 10-1. Soldering Profile Green Compliant Package
Profile Feature Green Package
Average Ramp-up Rate (217°C to Peak) 3°C/sec. max.
Preheat Temperature 175°C ±25°C 180 sec. max.
Temperature Maintained Above 217°C 60 sec. to 150 sec.
Time within 5°C of Actual Peak Temperature 20 sec. to 40 sec.
Peak Temperature Range 260 +0 °C
Ramp-down Rate 6°C/sec. max.
Time 25°C to Peak Temperature 8 min. max.
17
1732FS–ATARM–12-Apr-06
AT91R40008
11. Ordering Information
Table 11-1. Ordering Information
Ordering Code Package Package Type Operation Range
AT91R40008-66AU LQFP 100 Green
Industrial
(-40°C to 85°C)
18
1732FS–ATARM–12-Apr-06
AT91R40008
Revision History
Doc. Rev Date Comments
Change
Request
Ref.
1732AS Jun-01 First issue
1732BS Jul-01 Updated
1732CS 29-Jan-02
pg. 9 Added information to Internal Memories
pg. 14 Changed Table 4
pg. 16 Added Table 6, Package Weight
pg. 17 Added section, Soldering Profile
1732DS 17-Mar-04
pg. 1 Features: Fully Static Operation; frequency changed
pg. 16 Added Table 8, 100-Lead LQFP Package Characteristics
1732ES 14-Jun-05
Global
New corporate format numbering
package reference TQFP changed to LQFP
pg. 17 added 10.1 ”LQFP Package Soldering Profile (Green)”
CSR 05-328
pg. 18 new package info inserted in 11. ”Ordering Information”
1732FS 12-Apr-06
page 16
page 17
10. ”Soldering Profile” and
11. ”Ordering Information”
AT91R40006-66AI LQFP 100, Sn/Pb package ref. removed.
#2601

AT91R40008-66AU-999

Mfr. #:
Manufacturer:
Microchip Technology / Atmel
Description:
ARM Microcontrollers - MCU Ind. Temp Green
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union