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MC34064P-5RAG

P1-P3P4-P6P7-P9P10-P11
MC34064, MC33064, NCV33064
www.onsemi.com
7
V3064
ALYW5
G
SOIC−8
D SUFFIX
CASE 751
x = 3 or 4
y = C or I
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = Pb−Free Package
MARKING DIAGRAMS
Micro8
DM SUFFIX
CASE 846A
1
8
TO−92
P SUFFIX
CASE 29
123
TSOP−5
SN SUFFIX
CASE 483
1
5
SRB AYWG
G
MC3x0
64P−5
ALYWG
G
123
NCV30
64P−5
ALYWG
G
(Note: Microdot may be in either location)
1
5
SSN AYWG
G
MC34064 MC33064
1
8
3x064
ALYW5
G
1
8
Ly50
AYW G
G
1
8
VI50
AYW G
G
MC34064, MC33064, NCV33064
www.onsemi.com
8
PACKAGE DIMENSIONS
SOIC−8
D SUFFIX
CASE 751−07
ISSUE AK
SEATING
PLANE
1
4
58
N
J
X 45
_
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
B
S
D
H
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.053 0.069
D 0.33 0.51 0.013 0.020
G 1.27 BSC 0.050 BSC
H 0.10 0.25 0.004 0.010
J 0.19 0.25 0.007 0.010
K 0.40 1.27 0.016 0.050
M 0 8 0 8
N 0.25 0.50 0.010 0.020
S 5.80 6.20 0.228 0.244
−X−
−Y−
G
M
Y
M
0.25 (0.010)
−Z−
Y
M
0.25 (0.010) Z
S
X
S
M
____
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
ǒ
mm
inches
Ǔ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
MC34064, MC33064, NCV33064
www.onsemi.com
9
PACKAGE DIMENSIONS
Micro8
DM SUFFIX
CASE 846A−02
ISSUE J
S
B
M
0.08 (0.003) A
S
T
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
b
e
PIN 1 ID
8 PL
0.038 (0.0015)
−T−
SEATING
PLANE
A
A1
c
L
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DIM
A
MIN NOM MAX MIN
MILLIMETERS
−− −− 1.10 −−
INCHES
A1 0.05 0.08 0.15 0.002
b 0.25 0.33 0.40 0.010
c 0.13 0.18 0.23 0.005
D 2.90 3.00 3.10 0.114
E 2.90 3.00 3.10 0.114
e 0.65 BSC
L 0.40 0.55 0.70 0.016
−− 0.043
0.003 0.006
0.013 0.016
0.007 0.009
0.118 0.122
0.118 0.122
0.026 BSC
0.021 0.028
NOM MAX
4.75 4.90 5.05 0.187 0.193 0.199
H
E
H
E
DD
E
8X
0.48
0.65
PITCH
5.25
8X
0.80
DIMENSION: MILLIMETERS
RECOMMENDED
P1-P3P4-P6P7-P9P10-P11

MC34064P-5RAG

Mfr. #:
Buy MC34064P-5RAG
Manufacturer:
ON Semiconductor
Description:
Supervisory Circuits 4.59V UnderVoltage Sensing Circuit
Lifecycle:
New from this manufacturer.
Delivery:
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