MC74HC374ADTG

© Semiconductor Components Industries, LLC, 2014
October, 2017 − Rev. 15
1 Publication Order Number:
MC74HC374A/D
MC74HC374A
Octal 3-State Non-Inverting
D Flip-Flop
High−Performance Silicon−Gate CMOS
The MC74HC374A is identical in pinout to the LS374. The device
inputs are compatible with standard CMOS outputs; with pullup
resistors, they are compatible with LSTTL outputs.
Data meeting the setup time is clocked to the outputs with the rising
edge of the clock. The Output Enable input does not affect the states of
the flip−flops, but when Output Enable is high, the outputs are forced
to the high−impedance state; thus, data may be stored even when the
outputs are not enabled.
The HC374A is identical in function to the HC574A which has the
input pins on the opposite side of the package from the output. This
device is similar in function to the HC534A which has inverting
outputs.
Features
Output Drive Capability: 15 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2.0 to 6.0 V
Low Input Current: 1.0 mA
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC Standard
No. 7 A
Chip Complexity: 266 FETs or 66.5 Equivalent Gates
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
LOGIC DIAGRAM
DATA
INPUTS
D0
11
CLOCK
D1
D2
D3
D4
D5
D6
D7
18
17
14
13
8
7
4
3
1
OUTPUT ENABLE
19
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
16
15
12
9
6
5
2
PIN 20 = V
CC
PIN 10 = GND
NONINVERTING
OUTPUTS
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1
20
MARKING DIAGRAMS
SOIC−20
HC374A
AWLYYWWG
HC
374A
ALYWG
G
TSSOP−20
20
1
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G or G = Pb−Free Package
(Note: Microdot may be in either location)
FUNCTION TABLE
Inputs Output
Output
Enable Clock D Q
LHH
LLL
L L,H, X No Change
HXXZ
X = don’t care
Z = high impedance
SOIC−20
DW SUFFIX
CASE 751D
TSSOP−20
DT SUFFIX
CASE 948E
PIN ASSIGNMENT
Q2
D1
D0
Q0
OUTPUT
ENABLE
GND
Q3
D3
D2
Q1
5
4
3
2
1
10
9
8
7
6
14
15
16
17
18
19
20
11
12
13
Q6
D6
D7
Q7
V
CC
CLOCK
Q4
D4
D5
Q5
MC74HC374A
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2
MAXIMUM RATINGS
Symbol Parameter Value Unit
V
CC
DC Supply Voltage (Referenced to GND) –0.5 to +7.0 V
V
in
DC Input Voltage (Referenced to GND) –0.5 to V
CC
+ 0.5 V
V
out
DC Output Voltage (Referenced to GND) –0.5 to V
CC
+ 0.5 V
I
in
DC Input Current, per Pin ±20 mA
I
out
DC Output Current, per Pin ±35 mA
I
CC
DC Supply Current, V
CC
and GND Pins ±75 mA
P
D
Power Dissipation in Still Air, SOIC Package†
TSSOP Package†
500
450
mW
T
stg
Storage Temperature –65 to +150
_C
T
L
Lead Temperature, 1 mm from Case for 10 Seconds
(SOIC, SSOP or TSSOP Package)
260
_C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of
these limits are exceeded, device functionality should not be assumed, damage may occur and
reliability may be affected.
Derating: SOIC Package: –7 mW/_C from 65_ to 125_C
TSSOP Package: −6.1 mW/_C from 65_ to 125_C
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
V
CC
DC Supply Voltage (Referenced to GND) 2.0 6.0 V
V
in
, V
out
DC Input Voltage, Output Voltage (Referenced to GND) 0 V
CC
V
T
A
Operating Temperature, All Package Types –55 +125
_C
t
r
, t
f
Input Rise and Fall Time V
CC
= 2.0 V
(Figure 1) V
CC
= 4.5 V
V
CC
= 6.0 V
0
0
0
1000
500
400
ns
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Symbo
l
Parameter Test Conditions
V
CC
V
Guaranteed Limit
Unit
–55 to
25_C
v 85_C v 125_C
V
IH
Minimum High−Level Input Voltage V
out
= 0.1 V or V
CC
– 0.1 V
|I
out
| v 20 mA
2.0
3.0
4.5
6.0
1.50
2.10
3.15
4.20
1.50
2.10
3.15
4.20
1.50
2.10
3.15
4.20
V
V
IL
Maximum Low−Level Input Voltage V
out
= 0.1 V or V
CC
– 0.1 V
|I
out
| v 20 mA
2.0
3.0
4.5
6.0
0.50
0.90
1.35
1.80
0.50
0.90
1.35
1.80
0.50
0.90
1.35
1.80
V
V
OH
Minimum High−Level Output
Voltage
V
in
= V
IH
or V
IL
|I
out
| v 20 mA
2.0
4.5
6.0
1.90
4.40
5.90
1.90
4.40
5.90
1.90
4.40
5.90
V
V
in
= V
IH
or V
IL
|I
out
| v 2.4 mA
|I
out
| v 6.0 mA
|I
out
| v 7.8 mA
3.0
4.5
6.0
2.48
2.98
5.48
2.34
3.84
5.34
2.20
3.70
5.20
V
V
OL
Maximum Low−Level Output
Voltage
V
in
= V
IH
or V
IL
|I
out
| v 20 mA
2.0
4.5
6.0
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
V
V
in
= V
IH
or V
IL
|I
out
| v 2.4 mA
|I
out
| v 6.0 mA
|I
out
| v 7.8 mA
3.0
4.5
6.0
0.26
0.26
0.26
0.33
0.33
0.33
0.40
0.40
0.40
V
I
in
Maximum Input Leakage Current V
in
= V
CC
or GND 6.0 ±0.1 ±1.0 ±1.0
mA
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance cir-
cuit. For proper operation, V
in
and
V
out
should be constrained to the
range GND v (V
in
or V
out
) v V
CC
.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or V
CC
).
Unused outputs must be left open.
MC74HC374A
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3
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) (continued)
Symbol Unit
Guaranteed Limit
V
CC
V
Test ConditionsParameter
Symbol Unit
v 125_Cv 85_C
–55 to
25_C
V
CC
V
Test ConditionsParameter
I
OZ
Maximum Three−State
Leakage Current
Output in High−Impedance State
V
in
= V
IL
or V
IH
V
out
= V
CC
or GND
6.0 ±0.5 ±5.0 ±10
mA
I
CC
Maximum Quiescent Supply
Current (per Package)
V
in
= V
CC
or GND
I
out
= 0 mA
6.0 4 40 160
mA
AC ELECTRICAL CHARACTERISTICS (C
L
= 50 pF, Input t
r
= t
f
= 6.0 ns)
Symbo
l
Parameter
V
CC
V
Guaranteed Limit
Unit
–55 to
25_C
v 85_C v 125_C
f
max
Maximum Clock Frequency (50% Duty Cycle) 2.0
3.0
4.5
6.0
6
15
30
35
5
10
24
28
4
8
20
24
MHz
t
PLH
t
PHL
Maximum Propagation Delay, Input Clock to Q
(Figures 1 and 5)
2.0
3.0
4.5
6.0
125
80
25
21
155
110
31
26
190
130
38
32
ns
t
PLZ
t
PHZ
Maximum Propagation Delay, Output Enable to Q
(Figures 3 and 6)
2.0
3.0
4.5
6.0
150
100
30
26
190
125
38
33
225
150
45
38
ns
t
PZL
t
PZH
Maximum Propagation Delay, Output Enable to Q
(Figures 3 and 6)
2.0
3.0
4.5
6.0
150
100
30
26
190
125
38
33
225
150
45
38
ns
t
TLH
t
THL
Maximum Output Transition Time, Any Output
(Figures 1 and 5)
2.0
3.0
4.5
6.0
75
27
15
13
95
32
19
16
110
36
22
19
ns
C
in
Maximum Input Capacitance 10 10 10 pF
C
out
Maximum Three−State Output Capacitance
(Output in High−Impedance State)
15 15 15 pF
C
PD
Power Dissipation Capacitance (Per Enabled Output)*
Typical @ 25°C, V
CC
= 5.0 V
pF
34
* Used to determine the no−load dynamic power consumption: P
D
= C
PD
V
CC
2
f + I
CC
V
CC
.

MC74HC374ADTG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Flip Flops 2-6V CMOS Octal D-Type
Lifecycle:
New from this manufacturer.
Delivery:
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