LT8471
25
8471fd
For more information www.linear.com/8471
Figure 5. Suggested Component Placement for a Buck and Single-Inductor Inverting Converter (TSSOP Package)
applicaTions inForMaTion
8471 F05
1L INV
CHANNEL 2
BUCK
CHANNEL 1
GND
D1
L1
L2
L3
SHOUT
C3
D2
V
OUT2
V
CC
CV
CC
V
OUT1
C
VOUT1
C
VOUT2
C
VIN1
C
VIN2
C
VCC
C
VCC
C1
E1
V
IN1
C2
E2
V
IN2
21
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
VIAS TO GROUND PLANE REQUIRED
TO IMPROVE THERMAL PERFORMANCE
VIAS TO V
IN1
VIAS TO V
CC
SKYHOOK
the switching pins to keep the stray capacitance on the
switching pins small.
Board layout also has a significant effect on thermal re
-
sistance. The exposed package ground pad is the copper
plate that runs under the LT8471 die. This is a good thermal
path for conducting heat out of the package. Soldering the
pad onto the board reduces die temperature and increases
the power capability of the LT8471. Provide as much
copper area as possible around this pad. Adding multiple
feedthroughs around the pad to the ground plane will also
help. Figure 5, Figure 6, Figure 7 and Figure 8 show the
recommended component placement for various DC/DC
converter topologies.
