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HMC-XDB112

P1-P3P4-P4
FREQUENCY MULTIPLIERS - PASSIVE - CHIP
2
2 - 68
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 10 - 15 GHz INPUT
v00.0907
General Description
Features
Functional Diagram
Conversion Loss: 13 dB
Passive: No DC Bias Required
Input Drive: +13 dBm
High Fo Isolation: 30 dB
Die Size: 2.2 x 0.65 x 0.1 mm
Electrical Speci cations*, T
A
= 25 °C, Pin = +13 dBm
Typical Applications
This HMC-XDB112 is ideal for:
• Point-to-Point Radios
• VSAT
• Test Instrumentation
• Military & Space
• Clock Generation
The HMC-XDB112 is a monolithic Passive Frequency
Doubler which utilizes GaAs Heterojunction Bipolar
Transistor (HBT) technology, and is targeted to high
volume applications where frequency doubling of a
lower frequency is more economical than directly
generating a higher frequency. All bond pads and
the die backside are Ti/Au metallized and the HBT
devices are fully passivated for reliable operation. The
HMC-XDB112 Passive Doubler MMIC is compatible
with conventional die attach methods, as well as
thermocompression and thermosonic wire bonding,
making it ideal for MCM and hybrid microcircuit
applications. All data shown herein is measured with
the chip in a 50 Ohm environment and contacted with
RF probes.
HMC-XDB112
Parameter Min. Typ. Max. Units
Frequency Range Input 10 - 15 GHz
Frequency Range Output 20 - 30 GHz
Conversion Loss 13 dB
Fo Isolation with respect to output 30 dB
*Unless otherwise indicated, all measurements are from probed die
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
FREQUENCY MULTIPLIERS - PASSIVE - CHIP
2
2 - 69
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Output Power
Conversion Loss
HMC-XDB112
v00.0907
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 10 - 15 GHz INPUT
-20
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
10 11 12 13 14 15
CONVERSION LOSS (dB)
FREQUENCY (GHz)
-50
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
5
10 11 12 13 14 15
Fin
2xFin
OUTPUT POWER (dBm)
INPUT FREQUENCY (GHz)
Outline Drawing
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. TYPICAL BOND PAD IS .004” SQUARE.
3. BACKSIDE METALLIZATION: GOLD.
4. BACKSIDE METAL IS GROUND.
5. BOND PAD METALLIZATION: GOLD.
6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
7. OVERALL DIE SIZE
±
.002”
Die Packaging Information
[1]
Standard Alternate
WP-4 (Waffle Pack) [2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
FREQUENCY MULTIPLIERS - PASSIVE - CHIP
2
2 - 70
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Pad Number Function Description Interface Schematic
1 RFIN This pad is AC coupled and matched to 50 Ohms.
2 RFOUT This pad is AC coupled and matched to 50 Ohms.
Die Bottom GND Die Bottom must be connected to RF/DC ground.
Pad Descriptions
HMC-XDB112
v00.0907
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 10 - 15 GHz INPUT
Assembly Diagram
Note 1: Best performance obtained from use of <10 mil (long) by 3 by 0.5 mil ribbons on input and output.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
P1-P3P4-P4

HMC-XDB112

Mfr. #:
Buy HMC-XDB112
Manufacturer:
Analog Devices Inc.
Description:
Signal Conditioning GaAs MMIC x2 Active freq mult 10-15 GHz
Lifecycle:
New from this manufacturer.
Delivery:
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