20 LED Control IC W2RG012RN
Precautions for Use
■ Correct Use
• The absolute maximum rating is the limit value which should not be
exceeded even momentarily. Exceeding this value can cause dete-
rioration of the characteristics or complete failure of the IC.
• Check the operation at the communication frequency to be used
before using the device.
• Sufficiently take into consideration the static electricity, chattering
and voltage of the input to be connected when determining each
input circuit.
• Although the device contains an ESD protection circuit, static elec-
tricity that exceeds the function may damage the device. When
handling the device, exercise due caution by, for example, ground-
ing the body of the handler.
• Execute thermal design providing for a sufficient margin, by consid-
ering allowable dissipation in the actual operating condition. If a
high voltage is applied to IC (e.g. due to a small number of driven
series LEDs), heating of the IC can be controlled by inserting a
resistance to disperse power dissipation.
• A thermal shutdown circuit is built in this IC. If chip temperature has
risen abnormally, this circuit works to open output terminals. The
original condition is restored when chip temperature has decreased
to a normal level. As this circuit is provided as protection in the
event of emergency, do not use it on a regular basis.
• Due to potential damage, do not use product that has been
dropped or that has come into contact with water.
■ Cautions on Mounting
Mounting on a Flexible Substrate
When mounting the product on a flexible substrate, a reed may be
detached after mounting due to stress transmitted through the sub-
strate. Therefore, it is recommended to use, for mounting, a rein-
forced substrate or an underfill, etc.
Reworking with a Soldering Iron
The user is strictly admonished against the use of soldering iron for
rework. Such a use may cause mold cracking or open terminals.
■ Recommended Reflow
Conditions
Allowable Temperature Profile Conditions
Product mounting method should be by Reflow and we recommend
the following temperature profile. Reflow no more than twice.
Storage Conditions before Mounting
Moisture absorption by the plastic package will increase the possibil-
ity of faults, such as cracks; therefore, take enough care for storage.
Recommended Drying Conditions
If the allowable storage period after opening a moisture-proof package
has been exceeded, dry the products under the following conditions
before mounting them:
■ RoHS Directive Compliance
Models that are indicated as being RoHS compliant do not exceed
the threshold value for the following six substances.
Lead: 1,000 ppm max.
Mercury: 1,000 ppm max.
Cadmium: 100 ppm max.
Hexavalent chromium: 1,000 ppm max.
PBB: 1,000 ppm max.
PBDE: 1,000 ppm max.
■ Lot Code Indication
Flexible substrate
Underfill
Reinforcing plate
Storage Conditions Period
Before moisture-proof
package is opened
5 to 30°C, 40 to 70%RH 1 Year
After moisture-proof
package is opened
5 to 30°C, 40 to 70%RH 168 hours
Temperature Time Frequency
60°C 72 hours Once or twice
Time
Package surface temperature
10s (max)
250°C
260°C (max)
60~120s
140°C
200°C
220°C
60s (max)
Control Code: Three
alphanumeric characters
Production year: The last
digit of the calendar year
Production week: Serial numbers
(01~) from the week including
January1
