RB521S30T1G, NSVRB521S30T1G, RB521S30T5G
www.onsemi.com
3
PACKAGE DIMENSIONS
CASE 502
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-
TRUSIONS, OR GATE BURRS.
E
D
−X−
−Y−
b
2X
M
0.08 X Y
A
H
c
DIM MIN NOM MAX
MILLIMETERS
D 1.10 1.20 1.30
E 0.70 0.80 0.90
A 0.50 0.60 0.70
b 0.25 0.30 0.35
c 0.07 0.14 0.20
L 0.30 REF
H 1.50 1.60 1.70
12
E
E
TOP VIEW
SIDE VIEW
2X
BOTTOM VIEW
L2
L
2X
L2 0.15 0.20 0.25
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
RECOMMENDED
2X
0.48
0.40
2X
1.80
DIMENSION: MILLIMETERS
PACKAGE
OUTLINE
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
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