12
FN6409.0
December 18, 2006
ISL54206
Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN)
6
B
E
A
D
0.10 C
2X
2
0.10 M C A B
0.05 M C
(ND-1) X e
C
0.05 C
A
0.10 C
A1
SEATING PLANE
e
INDEX AREA
PIN #1 ID
3
5
(DATUM A)
(DATUM B)
N-1
1
N
NX L
NX b
21
N
TOP VIEW
BOTTOM VIEW
SIDE VIEW
NX (b)
SECTION "C-C"
FOR ODD TERMINAL/SIDE
e
CC
5
C
L
TERMINAL TIP
(A1)
L
DETAIL “A” PIN 1 ID
L
0.05 MIN
0.10 MIN
0.10 C
2X
4xk
b
L10.2.1x1.6A
10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC
PACKAGE
SYMBOL
MILLIMETERS
NOTESMIN NOMINAL MAX
A 0.45 0.50 0.55 -
A1 - - 0.05 -
A3 0.127 REF -
b 0.15 0.20 0.25 5
D 2.05 2.10 2.15 -
E 1.55 1.60 1.65 -
e 0.50 BSC -
k0.20
---
L 0.35 0.40 0.45 -
N102
Nd 4 3
Ne 1 3
0-12
4
Rev. 3 6/06
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on D and E side,
respectively.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Maximum package warpage is 0.05mm.
8. Maximum allowable burrs is 0.076mm in all directions.
9. Same as JEDEC MO-255UABD except:
No lead-pull-back, "A" MIN dimension = 0.45 not 0.50mm
"L" MAX dimension = 0.45 not 0.42mm.
10. For additional information, to assist with the PCB Land Pattern
Design effort, see Intersil Technical Brief TB389.
2.00
0.80
1.75
0.25
0.50
0.275
2.50
LAND PATTERN
10
