AD8223
Rev. 0 | Page 7 of 20
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter Rating
Supply Voltage ±12 V
Internal Power Dissipation 650 mW
Differential Input Voltage ±V
S
Output Short-Circuit Duration Indefinite
Storage Temperature Range (R, RM) −65°C to +125°C
Operating Temperature Range −40°C to +85°C
Lead Temperature (Soldering, 10 sec) 300°C
ESD (Human Body Model) 1.5 kV
ESD (Charge Device Model) 500 V
ESD (Machine Model) 100 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Specification is for the device in free air.
Table 5. Thermal Resistance
Package Type θ
JA
Unit
8-Lead SOIC (R) 155 °C/W
8-Lead MSOP (RM) 200 °C/W
ESD CAUTION