Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Ceramic Resonators, Chip Type
– EC171 –
E F O 4004
Product Code
Ceramic
Resonators
EFO
Nominal Oscillation
Frequency
4004
Frequency
Tolerance
±1.0 %
±0.3 %
±0.5 %
0
3
5
Design No.
Packaging Style
B
E
Bulk Pack
Embossed
Taping
Type
Chip Type with 2-terminals
PM
LM
PS
DM
4to13MHz
16 to 20 MHz
30 to 50 MHz
4to13MHz
12 to 20 MHz
4.00 MHz
(Example)
123456789101112
1695
4005
16.93 MHz
40.0 MHz
E F O 3584
Product Code
Ceramic
Resonators
EFO
Frequency
Tolerance
±1.0 %
±0.3 %
±0.5 %
0
3
5
Design No.
Packaging Style
B
E
Bulk Pack
Embossed
Taping
123456789101112
Nominal Oscillation
Frequency
3584
Type
Chip Type with 2-terminals
P
D
2to13MHz
13.1 to 20 MHz
3.58 MHz
(Example)
1695 16.93 MHz
■ Recommended Applications
● Clock generator for microprocessors
● Carrier circuit between telecommunication equipment
(Telephone to telephone, personal computer to printer)
Ceramic Resonators, Chip Type
(2 Array Type)
Type:
EFOP
Type:
EFOD
Type:
EFOPS
Type:
EFOPM
Type:
EFODM
Type:
EFOLM
■ Features
● Encased in a ceramic package
● High reliability against soldering heat and mechanical
stress
● Moisture-proof sealing
● 1.2 mm maximum in thickness (PS/PM/DM/LM)
● Designed for refl ow soldering
● Flat-bottom plate for better mounting
● RoHS compliant
■ Handling Precautions
(See Page 175 to 176)
■ Explanation of Part Numbers
Part Number
Frequency range
(MHz)
Frequency Temperature Characteristics
(–20 to +80 °C)
Attached Capacitors
(Reference)
EFOP
2.00 to 8.39 ±0.3 %
33 pF
8.40 to 13.0 ±1.0 %
EFOD
13.1 to 20.0 ±1.0 % 33 pF
EFOPS
4.00 to 8.39 ±0.6 %
21 pF
8.40 to 13.0 ±1.0 %
EFOPM
4.00 to 8.39 ±0.3 %
33 pF
8.40 to 13.0 ±1.0 %
EFODM
12.0 to 20.0 ±1.0 % 18 pF
EFOLM
16.0 to 20.0 ±1.0 %
10 pF
30.0 to 50.0 ±0.3 %
■ Packaging Specifi cations
See Page 174, 177
00 Sep. 2008