PS9601

PROPAGATION DELAY TIME
vs. FORWARD CURRENT
Propagation Delay Time, t
PHL
, t
PLH
(ns)
Forward Current, IF (mA)
Ambient Temperature, TA (°C)
Propagation Delay Time, t
PHL
, t
PLH
(ns)
ENABLE PROPAGATION DELAY TIME
vs. AMBIENT TEMPERATURE
Ambient Temperature, TA (°C)
Enable Propagation Delay Time, t
EHL
, t
ELH
(ns)
PROPAGATION DELAY TIME
vs. AMBIENT TEMPERATURE
PROPAGATION DELAY TIME
vs. LOAD RESISTANCE
Propagation Delay Time, t
PHL
, t
PLH
(ns)
Load Resistance, RL ()
Switching Time, t
r
, t
f
(ns)
Ambient Temperature, TA (°C)
SWITCHING TIME vs.
AMBIENT TEMPERATURE
TYPICAL PERFORMANCE CURVES (TA = 25 °C)
PS9601, PS9601L
V
CC
= 5 V
R
L
= 350 W
80
60
40
20
051015 20 25 30
t
PLH
t
PHL
I
F
= 7.5 mA
V
CC
= 5 V
PW = 1 µs,
duty 1/10
t
PLH
t
PHL
100
50
10
5
1
100 500 1 k 5 k 10 k 50 k
I
F
= 7.5 mA
V
CC
= 5 V
R
L
= 350
t
PLH
t
PHL
120
100
80
60
40
20
0
-50 -25 0 25 50 75 100
I
F
= 7.5 mA
V
CC
= 5 V
R
L
= 350
t
r
t
f
25
20
15
10
5
0
-50 -25 0 25 50 75 100
I
F
= 7.5 mA
V
CC
= 5 V
V
EH
= 3 V
V
EL
= 0.5 V
R
L
= 350
t
ELH
t
EHL
60
40
20
0
-50 -25 0 25 50 75 100
OUTLINE DIMENSIONS (Units in mm)
PS9601
PS9601L
85
1
4
3.8 MAX
2.8 MIN
0.65
1.34
0.50±0.10
1.27 MAX
7.62
6.5
10.16 MAX
4.55 MAX
0 to 15˚
8
5
1
4
1.34±0.10
1.27
MAX
7.62
6.5
10.16 MAX
0.9±0.25
0.05 to 0.2
3.8 MAX
2.54
9.60±0.4
PS9601, PS9601L
PIN CONNECTION (Top View)
PS9601
PIN Function
1. NC
2. Anode
3. Cathode
4. NC
5. GND
6. VO
7. VE*
8. VCC
INPUT
OUTPUT
8765
1234
V
CC
GND
*VE is pulled - up to enable operation
EXCLUSIVE NORTH AMERICAN AGENT FOR RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS
CALIFORNIA EASTERN LABORATORIES Headquarters 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 (408) 988-3500 Telex 34-6393 FAX (408) 988-0279
24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) Internet: http://WWW.CEL.COM
 08/06/2001
DATA SUBJECT TO CHANGE WITHOUT NOTICE
PS9601, PS9601L
RECOMMENDED SOLDERING CONDITIONS
INFRARED RAY REFLOW TEMPERATURE PROFILE
(1) Precautions in mounting the devices by infrared reflow soldering
Peak reflow temperature
235 ˚C or below (plastic surface temperature)
Reflow time
30 seconds or less (Time period during which the plastic surface temperature
is 210 ˚C
Number of reflows Processes
One
Flux
Rosin flux containing small amount of chlorine (The flux
with a max. chlorine content of 0.2 Wt % is recommended.)
(2) Precautions in mounting the devices in solder dip method
Temperature
260 ˚C or below
Time
10 seconds or less
Flux
Rosin group flux, where the amount of chloride component is small.
Time (s)
Package Surface Temperature T (ßC)
120 to 160
ß
C
60 to 120 s
(pre-heat)
(Actual heat)
to 10 s
to 30 s
235
ß
C Peak
210
ß
C
Peak Temperature 230 ºC
or Lower

PS9601

Mfr. #:
Manufacturer:
CEL
Description:
High Speed Optocouplers Hi-Iso Volt Hi-Speed
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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