Data Sheet ADG819
Rev. A | Page 13 of 16
Figure 27. 6-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-6-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Notes Temperature Range Package Description
Package
Option
Branding
2
ADG819BCBZ-REEL
3
–40°C to +85°C 6-Ball Wafer Level Chip Package [WLCSP] CB-6-1 SBC
ADG819BCBZ-REEL7
3
–40°C to +85°C 6-Ball Wafer Level Chip Package [WLCSP] CB-6-1 SBC
ADG819BRM
–40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SNB
ADG819BRM-REEL
–40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SNB
ADG819BRMZ
–40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SBC
ADG819BRMZ-REEL7
3
–40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SBC
ADG819BRT-500RL7
3
–40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 SNB
ADG819BRT-REEL7
3
–40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 SNB
ADG819BRTZ-500RL7
3
–40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 SBC
ADG819BRTZ-REEL
3
–40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 SBC
ADG819BRTZ-REEL7
3
–40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 SBC
1
Z = RoHS Compliant Part.
2
Branding on these packages is limited to three characters due to space constraints.
3
Contact factory for availability.
0.50
0.32 NOM
0.32
0.59
2.38
2.18
1.98
1.34
1.14
0.94
0.67
0.57
0.47
0.50
BALL PITCH
0.24 MAX
COPLANARITY
0.44
0.36
0.28
BALL A1
IDENTIFIER
TOP VIEW
(BALL SIDE DOWN)
BOTTOM VIEW
(BALL SIDE UP)
SEATING
PLANE
A
12
B
C
02-03-2012-A
