3
Absolute Maximum Ratings Thermal Information
V
CC
to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) <V
CC
< 6V
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . (V
CC
-0.3V) <V+ < 12V
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V)
Input Voltages
T
IN
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < V
IN
< (V+ +0.3V)
R
IN
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V
Output Voltages
T
OUT
. . . . . . . . . . . . . . . . . . . .(V- -0.3V) < V
TXOUT
< (V+ +0.3V)
R
OUT
. . . . . . . . . . . . . . . . . (GND -0.3V) < V
RXOUT
< (V+ +0.3V)
Short Circuit Duration
T
OUT
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
R
OUT
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
ESD Classification . . . . . . . . . . . . . . . . . . . . See Specification Table
Thermal Resistance (Typical, Note 1)
θ
JA
(
o
C/W)
16 Ld SOIC (N) Package . . . . . . . . . . . . . . . . . . . . . 105
16 Ld SOIC (W) Package. . . . . . . . . . . . . . . . . . . . . 110
16 Ld PDIP Package*. . . . . . . . . . . . . . . . . . . . . . . . 85
Maximum Junction Temperature (Plastic Package) . . . . . .150
o
C
Maximum Storage Temperature Range. . . . . . . . . . -65
o
C to 150
o
C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300
o
C
(SOIC - Lead Tips Only)
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
Operating Conditions
Temperature Range
HIN232ACX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0
o
C to 70
o
C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θ
JA
is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications Test Conditions: V
CC
= +5V ±10%, C1-C4 = 0.1µF; T
A
= Operating Temperature Range
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
SUPPLY CURRENTS
Power Supply Current, I
CC
No Load, T
A
= 25
o
C-510mA
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS
Input Logic Low, V
lL
T
IN
--0.8V
Input Logic High, V
lH
T
IN
2.0 - - V
Transmitter Input Pullup Current, I
P
T
IN
= 0V - 15 200 µA
TTL/CMOS Receiver Output Voltage Low, V
OL
I
OUT
= 3.2mA - 0.1 0.4 V
TTL/CMOS Receiver Output Voltage High, V
OH
I
OUT
= -1mA 3.5 4.6 - V
RECEIVER INPUTS
RS-232 Input Voltage Range, V
IN
-30 - +30 V
Receiver Input Impedance, R
IN
V
IN
= ±3V, T
A
= 25
o
C 3.0 5.0 7.0 kΩ
Receiver Input Low Threshold, V
IN
(H-L) V
CC
= 5V, T
A
= 25
o
C-1.2-V
Receiver Input High Threshold, V
IN
(L-H) V
CC
= 5V, T
A
= 25
o
C-1.72.4V
Receiver Input Hysteresis, V
HYST
V
CC
= 5V 0.2 0.5 1.0 V
TIMING CHARACTERISTICS
Transmitter, Receiver Propagation Delay, t
PD
-0.510µs
Transition Region Slew Rate, SR
T
R
L
= 3kΩ, C
L
= 1000pF, Measured from +3V to
-3V or -3V to +3V, (Note 2) 1 Transmitter Switching
32045V/µs
TRANSMITTER OUTPUTS
Output Voltage Swing, T
OUT
Transmitter Outputs, 3kΩ to Ground ±5 ±9 ±10 V
Output Resistance, T
OUT
V
CC
= V+ = V- = 0V, V
OUT
= ±2V 300 - - Ω
RS-232 Output Short Circuit Current, I
SC
T
OUT
Shorted to GND - ±10 - mA
ESD PERFORMANCE
RS-232 Pins
(T
OUT
, R
IN
)
Human Body Model - ±15 - kV
IEC1000-4-2 Contact Discharge - ±8-kV
IEC1000-4-2 Air Gap (Note 3) - ±15 - kV
All Other Pins Human Body Model - ±2-kV
NOTES:
2. Guaranteed by design.
3. Meets level 4.
HIN232A
