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TC7129CLW713

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P28
2002-2012 Microchip Technology Inc. DS21459E-page 19
TC7129
40-Lead Plastic Dual In-line (P) – 600 mil Body (PDIP)
1510515105
Mold Draft Angle Bottom
1510515105
Mold Draft Angle Top
17.2716.5115.75.680.650.620eBOverall Row Spacing §
0.560.460.36.022.018.014BLower Lead Width
1.781.270.76.070.050.030B1Upper Lead Width
0.380.290.20.015.012.008
c
Lead Thickness
3.433.303.05.135.130.120LTip to Seating Plane
52.4552.2651.942.0652.0582.045DOverall Length
14.2213.8413.46.560.545.530E1Molded Package Width
15.8815.2415.11.625.600.595EShoulder to Shoulder Width
0.38.015A1Base to Seating Plane
4.063.813.56.160.150.140
A2
Molded Package Thickness
4.834.454.06.190.175.160ATop to Seating Plane
2.54.100
p
Pitch
4040
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
A2
1
2
D
n
E1
c
eB
E
p
L
B
B1
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MO-011
Drawing No. C04-016
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
TC7129
DS21459E-page 20 2002-2012 Microchip Technology Inc.
44-Lead Plastic Leaded Chip Carrier (LW) – Square (PLCC)
CH2 x 45 CH1 x 45
10501050
Mold Draft Angle Bottom
10501050
Mold Draft Angle Top
0.530.510.33.021.020.013B
0.810.740.66.032.029.026B1Upper Lead Width
0.330.270.20.013.011.008
c
Lead Thickness
1111n1Pins per Side
16.0015.7514.99.630.620.590D2Footprint Length
16.0015.7514.99.630.620.590
E2
Footprint Width
16.6616.5916.51.656.653.650D1Molded Package Length
16.6616.5916.51.656.653.650E1Molded Package Width
17.6517.5317.40.695.690.685DOverall Length
17.6517.5317.40.695.690.685EOverall Width
0.250.130.00.010.005.000
CH2Corner Chamfer (others)
1.271.141.02.050.045.040CH1Corner Chamfer 1
0.860.740.61.034.029.024A3Side 1 Chamfer Height
0.51.020A1Standoff §
A2Molded Package Thickness
4.574.394.19.180.173.165AOverall Height
1.27.050
p
Pitch
4444
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
A2
c
E2
2
D
D1
n
#leads=n1
E
E1
1
p
A3
A
35
B1
B
D2
A1
.145 .153 .160 3.68 3.87 4.06
.028 .035 0.71 0.89
Lower Lead Width
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-048
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc. DS21459E-page 21
TC7129
44-Lead Plastic Quad Flatpack (KW) 10x10x2.0 mm Body, 1.95/0.25 mm Lead Form (PQFP)
CHAMFER VARIES
D
E1
E
p
c
B
D1
n
L
2
1
F
A1
A
A2
1.95 REF..077 REF.FFootprint
Units INCHES MILLIMETERS
*
Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins
n
44 44
Pitch
p
.031 BSC 0.80 BSC
Overall Height A - - .096 - - 2.45
Molded Package Thickness A2 .077 .079 .083 1.95 2.00 2.10
Standoff
§
A1 .010 - - 0.25 - -
Foot Length L .029 .035 .041 0.73 0.88 1.03
Foot Angle
0° 3.5° 7° 0° 3.5° 7°
Overall Width E .547 BSC 13.90 BSC
Overall Length D .547 BSC 13.90 BSC
Molded Package Width E1 .394 BSC 10.00 BSC
Molded Package Length D1 .394 BSC 10.00 BSC
Lead Thickness
c
.004 - .009 0.11 - 0.23
Lead Width B .012 - .018 0.30 - 0.45
Mold Draft Angle Top
5° - 16° 5° - 16°
Mold Draft Angle Bottom
5° - 16° 5° - 16°
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
Notes:
JEDEC Equivalent: MO-112 AA-1
Revised 07-21-05
*
Controlling Parameter
§
Significant Characteristic
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
See ASME Y14.5M
Drawing No. C04-119
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P28

TC7129CLW713

Mfr. #:
Buy TC7129CLW713
Manufacturer:
Microchip Technology
Description:
LCD Drivers w/LCD Driver
Lifecycle:
New from this manufacturer.
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