NCP120
www.onsemi.com
8
PACKAGE DIMENSIONS
XDFN6 1.20x1.20, 0.40P
CASE 711AT
ISSUE A
MOUNTING FOOTPRINT*
DIMENSIONS: MILLIMETERS
0.35
6X
0.24
6X
1.40
0.40
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
RECOMMENDED
PACKAGE
OUTLINE
1.08
0.40
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.25mm FROM TERMINAL TIPS.
4. COPLANARITY APPLIES TO THE PAD AS
WELL AS THE TERMINALS.
A
SEATING
PLANE
0.05 C
A
A1
2X
2X
0.05 C
DIM
A
MIN MAX
MILLIMETERS
0.30 0.45
A1 0.00 0.05
b 0.13 0.23
D
E
e
L
PIN ONE
REFERENCE
0.05 C
0.05 C
NOTE 3
L
e
b
3
6
6X
1
4
0.15 0.25
BOTTOM VIEW
E2
E2
0.20 0.40
TOP VIEW
B
SIDE VIEW
NOTE 4
C
6X
A
M
0.10 BC
D2
0.84 1.04
L1
1.20 BSC
1.20 BSC
0.40 BSC
0.05 REF
D2
D
E
DETAIL A
DETAIL A
DETAIL A
MOLD CMPDEXPOSED Cu
OPTIONAL
CONSTRUCTION
L1
6X
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