4
FN9077.6
December 29, 2004
Absolute Maximum Ratings Thermal Information
Supply Voltage, V
DD
(Note 1) . . . . . . . . . . . . . . . . . . . -0.3V to 16V
LI and HI Voltages (Note 1) . . . . . . . . . . . . . . . . -0.3V to V
DD
+0.3V
Voltage on HS (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to 80V
Voltage on HB (Note 1) . . . . . . . . . . . . . . . . V
HS
-0.3V to V
HS
+V
DD
Voltage on LO (Note 1) . . . . . . . . . . . . . . . . . V
SS
-0.3 to V
DD
+0.3V
Voltage on HO (Note 1) . . . . . . . . . . . . . . . . V
HS
-0.3V to V
HB
+0.3V
Phase Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20V/ns
Maximum Recommended Operating Conditions
Supply Voltage, V
DD
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9V to 15V
Voltage on HS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to 75V
Voltage on HS (Note 2) . . . . . . . . . .(Repetitive Transient) -1V to 80V
Voltage on HB . . . . . . . . . . . . . . . . . . . . . . . . . . V
HS
+7.5V to V
HS
+V
DD
Thermal Resistance (Typical) θ
JA
(°C/W) θ
JC
(°C/W)
SOIC (Note 3) . . . . . . . . . . . . . . . . . . . 95 N/A
QFN (Note 4) . . . . . . . . . . . . . . . . . . . . 49 7
Max Power Dissipation at 25°C in Free Air (SOIC, Note 3). 1.316W
Max Power Dissipation at 25°C in Free Air (QFN, Note 4) . .2.976W
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Maximum Junction Temperature Range . . . . . . . . . -40°C to +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . +300°C
(SOIC - Lead Tips Only)
For Recommended soldering conditions see Tech Brief TB389.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the recommended operating conditions of this specification is not implied.
NOTES:
1. All voltages referenced to V
SS
unless otherwise specified.
2. Based on V
DD
=15V. The magnitude of the allowable negative transient on the HS pin is a function of the V
DD
supply voltage. V
HS
<15.6V-
V
DD
+V
F
, where V
HS
is the magnitude of the allowable negative transient and V
F
is the forward voltage drop of the bootstrap diode.
3. θ
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
4. θ
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. θ
JC
,
the
“case temp” is measured at the center of the exposed metal pad on the package underside. See Tech Brief TB379.
Electrical Specifications V
DD
= V
HB
= 12V, V
SS
= V
HS
= 0V, No Load on LO or HO, Unless Otherwise Specified
PARAMETERS SYMBOL TEST CONDITIONS
T
J
= 25°C
T
J
= -40°C TO
125°C
UNITSMIN TYP MAX MIN MAX
SUPPLY CURRENTS & UNDERVOLTAGE PROTECTION
V
DD
Quiescent Current I
DD
LI = 0 or V
DD
- 1.9 2.2 - 2.4 mA
V
DD
Operating Current I
DDO
f = 50kHz - 2.0 2.2 - 2.5 mA
V
DD
Operating Current I
DDO
f = 500kHz - 2.5 3.0 - 4.0 mA
HB Off Quiescent Current I
HBL
HI = 0 - 1.25 1.5 - 1.8 mA
HB On Quiescent Current I
HBH
HI = V
DD
- 170 240 - 250 µA
HB Operating Current I
HBO
f = 50kHz, C
L
= 1000pF - 1.45 1.8 - 2.0 mA
HB Operating Current I
HBO
f = 500kHz, C
L
= 1000pF - 2.4 2.8 - 3.0 mA
HS Leakage Current I
HLK
V
HS
= 80V
V
HB
= 96V
--1-1µA
V
DD
Rising Undervoltage Threshold V
DDUV+
6.8 7.6 8.25 6.5 8.5 V
V
DD
Falling Undervoltage Threshold V
DDUV-
6.5 7.1 7.8 6.25 8.1 V
Undervoltage Hysteresis UVHYS 0.17 0.45 0.75 0.15 0.90 V
HB Undervoltage Threshold VHBUV Referenced to HS 4.8 5.3 6.5 4.0 7.5 V
INPUT PINS: LI and HI
Low Level Input Voltage V
IL
Full Operating Conditions 0.8 1.6 - 0.8 - V
High Level Input Voltage V
IH
Full Operating Conditions - 1.7 2.2 - 2.2 V
Input Voltage Hysteresis - 100 - - - mV
Low Level Input Current I
IL
V
IN
= 0V, Full Operating Conditions -70 -60 -30 -80 -30 µA
High Level Input Current I
IH
V
IN
= 5V, Full Operating Conditions 30 115 130 30 145 µA
ISL6700
