SCA630-EDCV1B
Murata Electronics Oy 13/14
www.muratamems.fi Doc. nr. 82 841 00 Rev.B
4.2. Reflow soldering
The SCA6X0 is suitable for Sn-Pb eutectic and Pb- free soldering process and mounting with
normal SMD pick-and-place equipment. Recommended body temperature profile during reflow
soldering:
Figure 10. Recommended body temperature profile during reflow soldering. Ref.
IPC/JEDEC J-STD-020D.
Profile feature Sn-Pb Eutectic
Assembly
Pb-free Assembly
Average ramp-up rate (T
L
to T
P
) 3 °C/second max. 3 °C/second max.
Preheat
- Temperature min (T
smin
)
- Temperature max (T
smax
)
- Time (min to max) (ts)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-180 seconds
Tsmax to T
L
- Ramp up rate
3°C/second max
Time maintained above:
- Temperature (T
L
)
- Time (t
L
)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak temperature (T
P
) 240 +0/−5 °C 250 +0/−5 °C
Time within 5 °C of actual Peak Temperature
(T
P
)
10-30 seconds 20-40 seconds
Ramp-down rate 6 °C/second max 6 °C/second max
Time 25 °C to Peak temperature 6 minutes max 8 minutes max
The Moisture Sensitivity Level of the part is 3 according to the IPC/JEDEC J-STD-020D. The
part should be delivered in a dry pack. The manufacturing floor time (out of bag) in the
customer’s end is 168 hours.
