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UMK105CH271JV-F

P1-P3P4-P6P7-P9P10-P12P13-P15
1
2
mlcc_reli-R3
mlcc_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
13. Resistance to Soldering
Specified
Value
Temperatur
e Compensating
（Class 1
）
Standard
Appearance: No abnormality
Capacitance change: Within ±2.5% or ±0.25pF, whichever is lar
ger.
Q: Initial value
Insulation resistance: Initial value
Withstanding voltage （between terminals）: No abnormality
High Fr
equency Type
Appearance: No abnormality
Capacitance change: Within ±2.5%
Q: Initial value
Insulation r
esistance: Initial value
Withstanding voltage （between terminals）: No abnormality
High Permittivity （Class 2）　
Note 1
Appearance: No abnormality
Capacitance change: Within ±7.5% （BJ, B7, C6, C7
）
Within ±20% （F
）
Dissipation factor: Initial value
Insulation resistance: Initial value
Withstanding voltage （between terminals）: No abnormality
【T
est Methods and Remarks】
Class 1
042, 063 Type
105 Type
Array（096, 110 Type）
Preconditioning None
Preheating
150℃, 1 to 2 min. 80 to 100℃, 2 to 5 min.
150 to 200℃, 2 to 5 min.
Solder temp. 270±5℃
Duration 3±0.5 sec.
Recovery 6 to 24 hrs （Standard condition） Note 5
　
Class 2
042、063 Type
105, 107, 212 Type
Array（096, 110,212 Type）
316, 325 Type
Preconditioning Thermal treatment （at 150℃ for 1 hr） Note 2
Preheating
150℃, 1 to 2 min. 80 to 100℃, 2 to 5 min.
150 to 200℃, 2 to 5 min.
80 to 100℃, 5 to 10 min.
150 to 200℃, 5 to 10 min.
Solder temp. 270±5℃
Duration 3±0.5 sec.
Recovery 24±2 hrs （Standard condition） Note 5
14. Temperature Cycle (Thermal Shock）
Specified
Value
Temperatur
e Compensating
（Class 1
）
Standard
Appearance: No abnormality
Capacitance change: Within ±2.5% or ±0.25pF, whichever is lar
ger.
Q: Initial value
Insulation resistance: Initial value
Withstanding voltage （between terminals）: No abnormality
High Fr
equency Type
Appearance: No abnormality
Capacitance change:
Within ±0
.25pF
Q: Initial value
Insulation r
e
sistance: Initial value
Withstanding voltage （between terminals）: No abnormality
High Permittivity （Class 2）　
Note 1
Appearance: No abnormality
Capacitance change: Within ±7.5% （BJ, B7, C6, C7
）
Within ±20% （F
）
Dissipation factor: Initial value
Insulation re
sistance: Initial value
Withstanding voltage （between terminals）: No abnormality
【T
est Methods and Remarks】
Class 1 Class 2
Preconditioning None Thermal treatment （at 150℃ for 1 hr） Note 2
1 cycle
Step Temperature（℃） Time（min.）
1 Lowest operating temperature ＋0/－3 30±3
2 Normal temperature 2 to 3
3 Highest operating temperature ＋0/－3 30±3
4 Normal temperature 2 to 3
Number of cycles 5 times
Recovery 6 to 24 hrs （Standard condition） Note 5 24±2 hrs （Standard condition） Note 5
15. Humidity （Steady State）
Specified
Value
Temperatur
e Compensating
（Class 1
）
Standard
Appearance: No abnormality
Capacitance change: Within ±5
% or ±0.5pF, whichever is lar
ger.
Q： C＜10pF： Q≧200＋10C　
10≦C＜30pF： Q≧2
75＋2.5C
C≧30pF： Q≧350 （
C：Nominal capacitance
）
Insulation resistance: 1000 MΩ min.
High Frequency T
ype
Appearance: No abnormality
Capacitance change:
Within ±0.5pF,
Insulation resistance: 1000 MΩ min.
High Permittivity （Class 2）　
Note 1
Appearance: No abnormality
Capacitance change: Within ±12.5%（BJ, B7, C6, C7
）
Within ±30%（F
）
Dissipation factor： 5.0% max. （BJ, B7, C6, C7）
11.0% max.（
F）
Insulation r
esistance:
50 MΩμF or 1000 MΩ whichever is smaller.
【Test Methods and Remarks】
Class 1
Standard High Frequency Type
Preconditioning None
Temperature 40±2℃ 60±2℃
Humidity 90 to 95％RH
Duration 500＋24/ー0 hrs
Recovery 6 to 24 hrs （Standard condition） Note 5
　
Class 2
All items
Preconditioning Thermal treatment （at 150℃ for 1 hr）　Note 2
Temperature 40±2℃
Humidity 90 to 95％RH
Duration 500＋24/ー0 hrs
Recovery 24±2 hrs （Standard condition） Note 5
1
2
mlcc_reli-R4
mlcc_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
16. Humidity Loading
Specified
Value
Temperatur
e Compensating
（Class 1
）
Standard
Appearance: No abnormality
Capacitance change: W
ithin ±7.5% or ±0.75pF, whichever is lar
ger.
Q： C＜30pF：Q≧100＋10C/3
C≧30pF：Q≧200 （C：Nominal capacitance
）
Insulation resistance: 500 MΩ min.
High Fr
equency Type
Appearance: No abnormality
Capacitance change:
C≦2
pF：Within ±0.4 pF
C＞2pF：Within ±0.75 pF （C：Nominal capacitance
）
Insulation resistance: 500 MΩ min.
High Permittivity （Class 2）　
Note 1
Appearance: No abnormality
Capacitance change: Within ±12.5% （BJ, B7, C6, C7
）
Within ±30%（F
）
Dissipation factor： 5.0% max. （BJ, B7, C6, C7）
11.0% max.（
F）
Insulation re
sistance: 25 MΩ
μF or 500 MΩ, whichever is smaller.
【Test Methods and Remarks】
Class 1
Standard High Frequency Type
Preconditioning None
Temperature 40±2℃ 60±2℃
Humidity 90 to 95％RH
Duration 500＋24/ー0 hrs
Applied voltage Rated voltage
Charge/discharge current 50mA max.
Recovery 6 to 24 hrs （Standard condition） Note 5
　
Class 2
All items
Preconditioning Voltage treatment
（Rated voltage are applied for 1 hour at 40℃） Note 3
Temperature 40±2℃
Humidity 90 to 95％RH
Duration 500＋24/ー0 hrs
Applied voltage Rated voltage
Charge/discharge current 50mA max.
Recovery 24±2 hrs （Standard condition） Note 5
17. High Temperature Loading
Specified
Value
Temperatur
e Compensating
（Class 1
）
Standard
Appearance: No abnormality
Capacitance change: Within ±3
% or ±0.3pF, whichever is lar
ger.
Q： C＜10pF： Q≧200＋10C
10≦C＜30pF： Q≧275＋2.5C
C≧30pF： Q≧350 （C：Nominal capacitance
）
Insulation resistance: 1000 MΩ min.
High Frequency T
ype
Appearance: No abnormality
Capacitance change:
Within ±3% or ±0.3pF, whichever is larger.
Insulation resistance: 1000 MΩ min.
High Permittivity （Class 2）　
Note 1
Appearance: No abnormality
Capacitance change: Within ±12.5%（BJ, B7, C6, C7
）
Within ±30%（F
）
Dissipation factor： 5.0% max.（BJ, B7, C6, C7
）
11.0% max.（F
）
Insulation resistance: 50 MΩ
μF or 1000 MΩ, whichever is smaller.
【Test Methods and Remarks】
Class 1
Standard High Frequency Type
Preconditioning None
Temperature 125±3℃
Duration 1000＋48/ー0 hrs
Applied voltage Rated voltage×2
Charge/discharge current 50mA max.
Recovery 6 to 24hr （Standard condition） Note 5
　
Class 2
BJ, F C6 B7, C7
Preconditioning Voltage treatment （Twice the rated voltage shall be
applied for 1 hour at 85℃, 105℃ or 125℃） Note 3, 4
Temperature 85±2℃ 105±3℃ 125±3℃
Duration 1000＋48/ー0 hrs
Applied voltage Rated voltage×2　Note 4
Charge/discharge current 50mA max.
Recovery 24±2 hrs （Standard condition） Note 5
Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail.
Note 2 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperatur
e for 24±2hours.
Note 3 Voltage treatment :
Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in the test conditions, and
kept at room temperature for 24±2hours.
Note 4 150% of rated voltage is applicable to some items. Please r
efer to their specifications for further information.
Note 5 Standar
d condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressur
e: 86 to 106kPa
When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted under the following condi-
tion.
Te
mperatur
e: 20±2℃, Relative humidity: 60 to 70 % RH, Air pr
essure: 86 to 106kPa
Unless otherwise specified, all the tests are conducted under the "standard condition".
1
2
mlcc_prec-P1
mlcc_prec_e-01
■ PRECAUTIONS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
1. Circuit Design
Precautions
◆Verification of operating environment, electrical rating and performance
1. A malfunction of equipment in fields such as medical, aer
ospace, nuclear control, etc. may cause serious harm to human life or have severe social ramifications.
Ther
efore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general pur-
pose applications.
◆Operating V
o
ltage （V
erification of Rated voltage）
1. The operating voltage for capacitors must always be their rated voltage or less.
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.
For a cir
cuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.
2. Even
if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage
having rapid rise time is used in a circuit.
2. PCB Design
Precautions
◆Pattern configurations （Design of Land-patter
ns）
1. When capacitors are mounted on PCBs, the amount of solder used （size
of fillet） can directly affect the capacitor performance. Therefore, the following items must
be carefully considered in the design of land patterns:
（1
）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Ther
efore, please consider appropriate land-patterns for proper
amount of solder.
（2）When more
than one component are jointly solder
ed onto the same land, each component's soldering point shall be separated by solder-resist.
◆Pattern configurations（Capacitor layout on PCBs
）
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （PCB
cutting, board inspection,
mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land pattern configurations and positions of capacitors
shall be car
efully considered to minimize str
esses.
Technical
consider-
ations
◆Patter
n
configurations （Design of Land-patter
ns）
The following diagrams and tables show some examples of recommended land patterns to pr
event excessive solder amounts.
（1）Recommended land dimensions for typical chip capacitors
●M
ultilayer Ceramic Capacitors : Recommended land dimensions （unit: mm
）
　Wave-soldering
Land patterns for PCBs
Type 107 212 316 325
Size
L 1.6 2.0 3.2 3.2
W 0.8 51.25 1.6 2.5
A 0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5
B 0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7
C 0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5
Solder-resist
Chip capacitor
L
L
W
B
C
B
A
W
LWDC
Land
Chip capacitor
Reflow-soldering
Type 042 063 105 107 212 316 325 432
Size
L 0.4 0.6 1.0 1.6 2.0 3.2 3.2 4.5
W 0.2 0.3 0.5 0.8 51.25 1.6 2.5 3.2
A
0.15 to 0.25 0.20 to 0.30 0.45 to 0.55
0.8 to 1.0 0.8 to 1.2 1.8 to 2.5 1.8 to 2.5 2.5 to 3.5
B
0.15 to 0.20 0.20 to 0.30 0.40 to 0.50
0.6 to 0.8 0.8 to 1.2 1.0 to 1.5 1.0 to 1.5 1.5 to 1.8
C
0.15 to 0.30 0.25 to 0.40 0.45 to 0.55
0.6 to 0.8 0.9 to 1.6 1.2 to 2.0 1.8 to 3.2 2.3 to 3.5
Note：Recommended land size might be different according to the allowance of the size of the product.
●LWDC: Recommended land dimensions for reflow-soldering（unit: mm
）
Type 105 107 212
Size
L 0.52 50.8 1.25
W 1.0 1.6 2.0
A 0.18 to 0.22 0.25 to 0.3 0.5 to 0.7
B 0.2 to 0.25 0.3 to 0.4 0.4 to 0.5
C 0.9 to 1.1 1.5 to 1.7 1.9 to 2.1
●Array type: Recommended land dimensions for reflow-soldering （unit: mm）
2 circuits 4 circuits
Type 096（2 circuits）110（2 circuits）212（2 circuits） 212（4 circuits）
Size
L 0.9 1.37 2.0 2.0
W 0.6 1.0 1.25 1.25
a 0.25 to 0.35 0.35 to 0.45 0.5 to 0.6 0.5 to 0.6
b 0.15 to 0.25 0.55 to 0.65 0.5 to 0.6 0.5 to 0.6
c 0.15 to 0.25 0.3 to 0.4 0.5 to 0.6 0.2 to 0.3
d 0.45 0.64 1.0 0.5
Chip capacitor
a
a
b
d
c
Land
c
d
a
a
b
（2）Examples of good and bad solder application
Items Not recommended Recommended
Mixed mounting of
SMD and leaded
components
Component
placement close to
the chassis
Hand-soldering
of leaded
components
near mounted
components
Horizontal
component
placement
Precautions on the use of Multilayer Ceramic Capacitors
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P1-P3P4-P6P7-P9P10-P12P13-P15

UMK105CH271JV-F

Mfr. #:
Buy UMK105CH271JV-F
Manufacturer:
Taiyo Yuden
Description:
Multilayer Ceramic Capacitors MLCC - SMD/SMT 50volts 270pF C0H 5% 0402 HiCV
Lifecycle:
New from this manufacturer.
Delivery:
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