1
2
mlcc_prec-P2
mlcc_prec_e-01
PRECAUTIONS
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer Ceramic Capacitors
2. PCB Design
Technical
consider-
ations
Pattern
configurationsCapacitor layout on PCBs
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any possible mechanical stresses from board warp or de-
flection.
Items Not recommended Recommended
Deflection of board
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from
least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB, split methods as well as chip location.
3. Mounting
Precautions
Adjustment of mounting machine
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2.Maintenance and inspection of mounting machines shall be conducted periodically.
Selection of Adhesives
1. W
hen chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the following factors are appro-
priately checked
: size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, please contact us for further
information.
Technical
consider-
ations
Adjustment of mounting machine
1.
W
hen the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid this, the following points
shall be considerable.
1
T
he bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.
2
The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
3
To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be used on the other side of the
PCB. The following diagrams show some typical examples of good and bad pick-up nozzle placement:
Items Not recommended Recommended
Single-sided
mounting
Double-sided
mounting
2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical impact on the capacitors.
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of the pin shall be conducted
periodically.
Selection of Adhesives
Some a
dhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in stresses on the capaci-
tors and
lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect components. Therefore, the following precautions
shall be noted in the application of adhesives.
1
Require
d adhesive characteristics
a. The adhesive shall be str
ong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have suf
ficient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency
.
d. The adhesive shall be used during its pr
escribed shelf life.
e. The adhesive shall har
den rapidly.
f
. The adhesive shall have corrosion resistance.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no ef
fect on the human body.
2
The recommended amount of adhesives is as follows;
Recommended condition
Figure 212/316 case sizes as examples
a 0.3mm min
b 100 to 120 μm
c Adhesives shall not contact land
  
1
2
mlcc_prec-P3
mlcc_prec_e-01
PRECAUTIONS
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer Ceramic Capacitors
4. Soldering
Precautions
Selection of Flux
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
1
Flux used shall be less than or equal to 0.1 wt% in CI equivalent of halogenated content. Flux having a strong acidity content shall not be applied.
2
When shall capacitors are soldered on boar
ds, the amount of flux applied shall be controlled at the optimum level.
3When water-soluble flux is used, special care shall be taken to pr
operly clean the boards.
Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability
.
Please contact us prior to usage of Sn-Zn solder.
Te
chnical
consider-
ations
Selection of Flux
1-1.
W
hen too much halogenated substance Chlorine,
etc. content is used to activate ux, or highly acidic ux is used, it may lead to corrosion of terminal elec-Chlorine, etc. content is used to activate ux, or highly acidic ux is used, it may lead to corrosion of terminal elec-Chlorine, etc. content is used to activate ux, or highly acidic ux is used, it may lead to corrosion of terminal elec- content is used to activate ux, or highly acidic ux is used, it may lead to corrosion of terminal elec- content is used to activate flux, or highly acidic flux is used, it may lead to corrosion of terminal elec-
trodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux
is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted and may adversely affect
the solderability. To minimize the amount of flux applied, it is r
ecommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high humidity conditions may cause
a degradation
of insulation resistance and reliability of the capacitors. Therefore, the cleaning methods and the capability of the machines used shall also be
considered car
efully when water-soluble flux is used.
Soldering
Ceramic chip capacitors are
susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
Ther
efore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock.
Pr
eheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within 100 to 130.
Cooling : The temperatur
e differ
ence between the capacitors and cleaning process shall not be greater than 100.
Reflow soldering
Recommended conditions for eutectic soldering
Recommended condition for Pb-free soldering
Temperature(℃)
0
100
200
300
230
Within 10 sec.
60sec.
Min.
60sec.
Min.
Slow cooling
Preheating
Temperature (℃)
0
100
200
300
Temperature (℃)
0
100
200
300
Temperature (℃)
Temperature (℃)
0
100
200
300
Peak 260 Max.
Within 10sec.
Heating above
230
40sec. Max.
Slow
cooling
Preheating 150
60sec. Min.
230250
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260 Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150
0
100
200
300
400
230280
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature (℃)
0
100
200
300
400
Temperature (℃)
0
100
200
300
400
Peak 350 Max.
Within 3sec.
Peak 280 Max.
Within 3sec.
Slow cooling
Slow cooling
T
T
Preheating
150 Min.
60sec. Min.
Preheating
150 Min.
60sec. Min.
Caution
The ideal condition is to have solder mass fillet controlled to 1/2 to 1/3 of the thickness of a capacitor.
Capacitor
PC board
T
Solder
Because excessive dwell times can adversely affect solderability, soldering duration shall be kept as
close to recommended times as possible.
Wave soldering
Recommended conditions for eutectic soldering
Recommended condition for Pb-free soldering
Temperature (℃)
0
100
200
300
Temperature (℃)
0
100
200
300
Temperature (℃)
Temperature (℃)
0
100
200
300
Peak 260 Max.
Within 10sec.
Heating above
230
40sec. Max.
Slow
cooling
Preheating 150
60sec. Min.
230250
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260 Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150
0
100
200
300
400
230280
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature (℃)
0
100
200
300
400
Temperature (℃)
0
100
200
300
400
Peak 350 Max.
Within 3sec.
Peak 280 Max.
Within 3sec.
Slow cooling
Slow cooling
T
T
Preheating
150 Min.
60sec. Min.
Preheating
150 Min.
60sec. Min.
Temperature (℃)
0
100
200
300
Temperature (℃)
0
100
200
300
Temperature (℃)
Temperature (℃)
0
100
200
300
Peak 260 Max.
Within 10sec.
Heating above
230
40sec. Max.
Slow
cooling
Preheating 150
60sec. Min.
230250
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260 Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150
0
100
200
300
400
230280
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature (℃)
0
100
200
300
400
Temperature (℃)
0
100
200
300
400
Peak 350 Max.
Within 3sec.
Peak 280 Max.
Within 3sec.
Slow cooling
Slow cooling
T
T
Preheating
150 Min.
60sec. Min.
Preheating
150 Min.
60sec. Min.
Caution
Wave soldering must not be applied to capacitors designated as for reflow soldering only.
Hand soldering
Recommended conditions for eutectic soldering
Recommended condition for Pb-free soldering
Temperature (℃)
0
100
200
300
Temperature (℃)
0
100
200
300
Temperature (℃)
Temperature (℃)
0
100
200
300
Peak 260 Max.
Within 10sec.
Heating above
230
40sec. Max.
Slow
cooling
Preheating 150
60sec. Min.
230250
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260 Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150
0
100
200
300
400
230280
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature (℃)
0
100
200
300
400
Temperature (℃)
0
100
200
300
400
Peak 350 Max.
Within 3sec.
Peak 280 Max.
Within 3sec.
Slow cooling
Slow cooling
T
T
Preheating
150 Min.
60sec. Min.
Preheating
150 Min.
60sec. Min.
Temperature (℃)
0
100
200
300
Temperature (℃)
0
100
200
300
Temperature (℃)
Temperature (℃)
0
100
200
300
Peak 260 Max.
Within 10sec.
Heating above
230
40sec. Max.
Slow
cooling
Preheating 150
60sec. Min.
230250
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260 Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150
0
100
200
300
400
230280
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature (℃)
0
100
200
300
400
Temperature (℃)
0
100
200
300
400
Peak 350 Max.
Within 3sec.
Peak 280 Max.
Within 3sec.
Slow cooling
Slow cooling
T
T
Preheating
150 Min.
60sec. Min.
Preheating
150 Min.
60sec. Min.
Temperature (℃)
0
100
200
300
Temperature (℃)
0
100
200
300
Temperature (℃)
Temperature (℃)
0
100
200
300
Peak 260 Max.
Within 10sec.
Heating above
230
40sec. Max.
Slow
cooling
Preheating 150
60sec. Min.
230250
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260 Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150
0
100
200
300
400
230280
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature (℃)
0
100
200
300
400
Temperature (℃)
0
100
200
300
400
Peak 350 Max.
Within 3sec.
Peak 280 Max.
Within 3sec.
Slow cooling
Slow cooling
T
T
Preheating
150 Min.
60sec. Min.
Preheating
150 Min.
60sec. Min.
T
316type or less
T150
T
325type or more
T130
Caution
Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
The soldering ir
on shall not directly touch capacitors.
1
2
mlcc_prec-P4
mlcc_prec_e-01
PRECAUTIONS
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer Ceramic Capacitors
5. Cleaning
Precautions
Cleaning conditions
1. W
hen PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use of the cleaning.e.g.
to
remove soldering flux or other materials from the production process.
2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning pr
ocess does not affect capacitor's characteristics.
Technical
consider-
ations
1. T
he use of inappr
opriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate their outer coating, resulting in
a degradation of the capacitor's electrical properties especially insulation r
esistance.
2. Inappropriate cleaning conditions insuf
ficient or excessive cleaning may adversely affect the performance of the capacitors.
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the cracking of capacitors or the soldered
portion, or decrease the terminal electrodes' str
ength. Therefore, the following conditions shall be carefully checked;
Ultrasonic output : 20 W/ or less
Ultrasonic frequency : 40 kHz or less
Ultrasonic washing period : 5 min. or less
6. Resin coating and mold
Precautions
1. With
some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal stor-
age conditions resulting in the deterioration of the capacitor's performance.
2. When
a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat may lead to damage or
destruction of capacitors.
T
he use of such r
esins, molding materials etc. is not recommended.
7. Handling
Precautions
Splitting of PCB
1.
W
hen PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.
2. Boar
d separation shall not be done manually, but by using the appropriate devices.
Mechanical considerations
Be car
eful not to subject capacitors to excessive mechanical shocks.
1
If ceramic capacitors are dropped onto a floor or a har
d surface, they shall not be used.
2Please be careful that the mounted components do not come in contact with or bump against other boards or components.
8.
Storage conditions
Precautions
Storage
1.
To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control temperature and humidity in
the storage area. Humidity should especially be kept as low as possible.
Recommended conditions
A
mbient temperature : Below 30
Humidity : Below 70% RH
The
ambient temperature must be kept below 40.
Even under ideal storage conditions, solderability of capacitor is deteriorated as time passes, so capaci-
tors shall be used within 6 months from the time of delivery.
Ceramic chip capacitors shall be kept wher
e no chlorine or sulfur exists in the air.
2.
The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, o car
e shall be taken to design circuits . Even if
capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150
for 1hour.
Technical
consider-
ations
If c
apacitors
are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and quality loss of taping/
packaging materials. For
this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the above period, please check solderability be-
fore using the capacitors.
RCR-2335B
Safety Application Guide for fixed ceramic capacitors for use in electronic equipmentis published by JEIT
A.
 Please check the guide regarding pr
ecautions for deflection test, soldering by spot heat, and so on.

UMK105CH331JV-F

Mfr. #:
Manufacturer:
Taiyo Yuden
Description:
Multilayer Ceramic Capacitors MLCC - SMD/SMT 0402 50V 330pF 5% C0H
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union