NL17SZ06
www.onsemi.com
6
PACKAGE DIMENSIONS
SOT−553
XV5 SUFFIX
CASE 463B
ISSUE C
e
M
0.08 (0.003) X
b
5 PL
A
c
−X−
−Y−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
D
E
Y
12 3
45
L
1.35
0.0531
0.5
0.0197
ǒ
mm
inches
Ǔ
SCALE 20:1
0.5
0.0197
1.0
0.0394
0.45
0.0177
0.3
0.0118
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
H
E
DIM
A
MIN NOM MAX MIN
MILLIMETERS
0.50 0.55 0.60 0.020
INCHES
b 0.17 0.22 0.27 0.007
c
D 1.55 1.60 1.65 0.061
E 1.15 1.20 1.25 0.045
e 0.50 BSC
L 0.10 0.20 0.30 0.004
0.022 0.024
0.009 0.011
0.063 0.065
0.047 0.049
0.008 0.012
NOM MAX
1.55 1.60 1.65 0.061 0.063 0.065
H
E
0.08 0.13 0.18
0.003 0.005 0.007
0.020 BSC
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