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LO T776-S1T1-24-Z
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P19
2013-0
6-28
10
Version 1.0 (Replacemen
t in due course)
LO T776
Package Out
line
9)
page
18
Maß
zeic
hnung
9)
Seite 18
Approx
imate We
ight:
34 m
g
Gew
ich
t:
34 m
g
Mar
k:
be
ve
lle
d edge
(Ca
tho
d
e)
M
arkie
rung
:
abgesc
hrägte Ecke (Kath
ode)
Corr
osi
on robu
stne
ss:
Tes
t condi
tions
: 40
°C
/ 90
% r
h /
15
ppm H
2
S /
336
h
= Str
icter
th
an IEC
60068
-2
-43
(H
2
S) [2
5°C / 75
% rh
/
10 ppm H
2
S / 2
1 days
]
= Regard
ing rele
vant gas (H
2
S)
st
ri
cte
r t
ha
n
EN
60068
-2-
60 (me
th
od 4) [25 °C
/ 75 % rh / 200
ppb
SO
2
, 200 pp
b NO
2,
10 ppb
Cl
2
/ 21
day
s]
K
orrosi
onsfes
tigk
eit
:
Test
Konditio
n: 40°C /
90 % rh
/ 15
ppm H
2
S /
336
h
= Bes
ser als
IEC 6006
8-2
-43 (H
2
S) [2
5°C / 75 %
rh /
10 p
pm
H
2
S / 21
Ta
ge]
= Bezo
gen auf da
s Gas (H
2
S) bess
er al
s
EN
60068
-2-
60 (me
thod
4
) [25°
C / 75 % rh / 200p
pb
SO
2
, 200p
pb NO
2,
10pp
b Cl
2
/ 21 Tag
e]
GPLY6899
0...0.1 (0.004)
Cathode marking
4˚±1
3.0 (0.118)
2.6 (0.102)
2.3 (0.091)
2.1 (0.083)
3.4 (0.134)
3.0 (0.118)
(2.4 (0.094))
2.1 (0.083)
1.7 (0.067)
5.4 (0.213)
5.0 (0.197)
0.6 (0.024)
0.4 (0.016)
0.3 (0.012) min
0.3 (0.012) max
1.0 (0.039)
0.9 (0.035)
A
C
Version 1.0 (Replacemen
t in due course)
LO T776
2013-0
6-28
11
Recomm
ended Solder Pad
9)
page 18
Reflow
sold
erin
g
Empfo
hlen
es Lö
tpadde
si
gn
9)
Seite 18
Refl
ow-L
öt
en
OHLPY977
1.2 (0.047)
6 (0.236)
2.6 (0.102)
heat dissipation
Cu-area > 16 mm
Cu-Fläche > 16 mm
2
for improved
Wärmeableitung
für verbesserte
Padgeometrie
Paddesign
2
Solder resist
Lötstopplack
6 (0.236)
1.2 (0.047)
2.6 (0.102)
Hole on PCB
2.8 (0.110)
2.4 (0.094)
2013-0
6-28
12
Version 1.0 (Replacemen
t in due course)
LO T776
Ref
low So
lder
ing Pro
file
Ref
low
-Lö
tpr
ofil
P
recon
diti
onin
g: JE
DEC Lev
el 2 ac
c. to JE
DEC J
-STD-
020
D.01
0
0
s
OHA04525
50
100
150
200
250
3
00
50
100
150
200
250
3
00
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
OHA04612
Profile Feature
Profil-Charakteristik
R
a
mp-
u
p r
a
te to prehe
a
t
*
)
25 °C
to
150 °C
2
3
K/
s
Time t
S
T
S
min
to T
S
m
a
x
t
S
t
L
t
P
T
L
T
P
100
120
60
10
20
3
0
8
0
100
217
2
3
245
260
3
6
Time
25 °C
to
T
P
Time within 5 °C of the
s
pecified pe
a
k
temper
a
t
u
re T
P
- 5 K
R
a
mp-down r
a
te
*
T
P
to
100 °C
All temper
a
t
u
re
s
refer to the center of the p
a
ck
a
ge, me
asu
red on the top of the component
*
s
lope c
a
lc
u
l
a
tion
D
T/
D
t:
D
t m
a
x. 5
s
; f
u
lfillment for the whole T-r
a
nge
R
a
mp-
u
p r
a
te to pe
a
k
*
)
T
S
m
a
x
to
T
P
Liq
u
id
us
temper
a
t
u
re
Pe
a
k temper
a
t
u
re
Time
ab
ove liq
u
id
us
temper
a
t
u
re
Symbol
Symbol
Unit
Einheit
Pb-Free (SnAgCu) Assembly
Minimum
Maximum
Recommendation
K/
s
K/
s
s
s
s
s
°C
°C
4
8
0
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P19
LO T776-S1T1-24-Z
Mfr. #:
Buy LO T776-S1T1-24-Z
Manufacturer:
Description:
Standard LEDs - SMD Orange, 606nm 355mcd, 20mA
Lifecycle:
New from this manufacturer.
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