RT8258
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DS8258-02 March 2011 www.richtek.com
Application Information
The RT8258 is an asynchronous high voltage buck converter
that can support the input voltage range from 4.5V to 24V
and the output current can be up to 1.2A.
Output Voltage Setting
The resistive voltage divider allows the FB pin to sense a
fraction of the output voltage as shown in Figure 1.
Figure 1. Output Voltage Setting
For adjustable voltage mode, the output voltage is set by
an external resistive voltage divider according to the
following equation :
⎛⎞
+
⎜⎟
⎝⎠
OUT FB
R1
V = V1
R2
OUT OUT
L
IN
VV
I = 1
fL V
⎡⎤
Δ×
⎢⎥
×
⎣⎦
Having a lower ripple current reduces not only the ESR
losses in the output capacitors but also the output voltage
ripple. High frequency with small ripple current can achieve
highest efficiency operation. However, it requires a large
inductor to achieve this goal.
For the ripple current selection, the value of ΔI
L
= 0.34(I
MAX
)
will be a reasonable starting point. The largest ripple current
occurs at the highest V
IN
. To guarantee that the ripple
current stays below the specified maximum, the inductor
value should be chosen according to the following
equation :
OUT OUT
L(MAX) IN(MAX)
VV
L = 1
fI V
⎡⎤
×−
⎢⎥
×Δ
⎣⎦
Inductor Core Selection
The inductor type must be selected once the value for L is
known. Generally speaking, high efficiency converters can
not afford the core loss found in low cost powdered iron
cores. So, the more expensive ferrite or mollypermalloy
cores will be a better choice.
The selected inductance rather than the core size for a
fixed inductor value is the key for actual core loss. As the
inductance increases, core losses decrease. Unfortunately,
increase of the inductance requires more turns of wire and
therefore the copper losses will increase.
Ferrite designs are preferred at high switching frequency
due to the characteristics of very low core losses. So,
design goals can focus on the reduction of copper loss
and the saturation prevention.
Ferrite core material saturates hard, which means that
inductance collapses abruptly when the peak design current
is exceeded. The previous situation results in an abrupt
increase in inductor ripple current and consequent output
voltage ripple.
Inductor Selection
The inductor value and operating frequency determine the
ripple current according to a specific input and output
voltage. The ripple current ΔI
L
increases with higher V
IN
and decreases with higher inductance.
RT8258
GND
FB
R1
R2
V
OUT
External Bootstrap Diode
Connect a 10nF low ESR ceramic capacitor between the
BOOT pin and PHASE pin. This capacitor provides the
gate driver voltage for the high side MOSFET.
It is recommended to add an external bootstrap diode
between an external 5V and the BOOT pin for efficiency
improvement when input voltage is lower than 5.5V or duty
ratio is higher than 65%. The bootstrap diode can be a low
cost one such as 1N4148 or BAT54.
The external 5V can be a 5V fixed input from system or a
5V output of the RT8268.
Where V
FB
is the feedback reference voltage (0.8V typ.).
Figure 2. External Bootstrap Diode
PHASE
BOOT
RT8258
10nF
5V
RT8258
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DS8258-02 March 2011www.richtek.com
C
IN
and C
OUT
Selection
The input capacitance, C
IN,
is needed to filter the trapezoidal
current at the source of the top MOSFET. To prevent large
ripple current, a low ESR input capacitor sized for the
maximum RMS current should be used. The RMS current
is given by :
OUT
IN
RMS OUT(MAX)
IN OUT
V
V
I = I 1
VV
This formula has a maximum at V
IN
= 2V
OUT
, where
I
RMS
= I
OUT
/2. This simple worst-case condition is commonly
used for design because even significant deviations do not
offer much relief.
Choose a capacitor rated at a higher temperature than
required. Several capacitors may also be paralleled to meet
size or height requirements in the design.
The selection of C
OUT
is determined by the required Effective
Series Resistance (ESR) to minimize voltage ripple.
Moreover, the amount of bulk capacitance is also a key for
C
OUT
selection to ensure that the control loop is stable.
Loop stability can be checked by viewing the load transient
response as described in a later section.
The output ripple, ΔV
OUT
, is determined by :
OUT L
OUT
1
VIESR
8fC
⎡⎤
Δ≤Δ +
⎢⎥
⎣⎦
The output ripple will be highest at the maximum input
voltage since ΔI
L
increases with input voltage. Multiple
capacitors placed in parallel may be needed to meet the
ESR and RMS current handling requirement. Dry tantalum,
special polymer, aluminum electrolytic and ceramic
capacitors are all available in surface mount packages.
Special polymer capacitors offer very low ESR value.
However, it provides lower capacitance density than other
types. Although Tantalum capacitors have the highest
capacitance density, it is important to only use types that
pass the surge test for use in switching power supplies.
Aluminum electrolytic capacitors have significantly higher
ESR. However, it can be used in cost-sensitive applications
for ripple current rating and long term reliability
considerations. Ceramic capacitors have excellent low ESR
characteristics but can have a high voltage coefficient and
audible piezoelectric effects. The high Q of ceramic
capacitors with trace inductance can also lead to significant
ringing.
Higher values, lower cost ceramic capacitors are now
becoming available in smaller case sizes. Their high ripple
current, high voltage rating and low ESR make them ideal
for switching regulator applications. However, care must
be taken when these capacitors are used at input and
output. When a ceramic capacitor is used at the input and
the power is supplied by a wall adapter through long wires,
a load step at the output can induce ringing at the input,
V
IN
. At best, this ringing can couple to the output and be
mistaken as loop instability. At worst, a sudden inrush of
current through the long wires can potentially cause a
voltage spike at V
IN
large enough to damage the part.
Do not allow the core to saturate!
Different core materials and shapes will change the size/
current and price/current relationship of an inductor.
Toroid or shielded pot cores in ferrite or permalloy materials
are small and do not radiate energy. However, they are
usually more expensive than the similar powdered iron
inductors. The rule for inductor choice mainly depends on
the price vs. size requirement and any radiated field/EMI
requirements.
Diode Selection
When the power switch turns off, the path for the current
is through the diode connected between the switch output
and ground. This forward biased diode must have a
minimum voltage drop and recovery times. Schottky diode
is recommended and it should be able to handle those
current. The reverse voltage rating of the diode should be
greater than the maximum input voltage, and current rating
should be greater than the maximum load current. For
more detail, please refer to Table 3.
Checking Transient Response
The regulator loop response can be checked by looking at
the load transient response. Switching regulators take
several cycles to respond to a step in load current. When
a load step occurs, V
OUT
immediately shifts by an amount
equal to ΔI
LOAD
(ESR) and also begins to charge or
discharge C
OUT
generating a feedback error signal for the
regulator to return V
OUT
to its steady-state value. During
this recovery time, V
OUT
can be monitored for overshoot or
ringing that would indicate a stability problem.
RT8258
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DS8258-02 March 2011 www.richtek.com
Layout Consideration
Follow the PCB layout guidelines for optimal performance
of RT8258.
` Keep the traces of the main current paths as short and
wide as possible.
` Put the input capacitor as close as possible to the device
pins (VIN and GND).
` PHASE node is with high frequency voltage swing and
should be kept at small area. Keep sensitive components
away from the PHASE node to prevent stray capacitive
noise pick-up.
` Place the feedback components to the FB pin as close
as possible.
` Connect the GND to a ground plane for noise reduction
and thermal dissipation.
Thermal Considerations
For continuous operation, do not exceed the maximum
operation junction temperature 125°C. The maximum power
dissipation depends on the thermal resistance of IC
package, PCB layout, the rate of surroundings airflow and
temperature difference between junction to ambient. The
maximum power dissipation can be calculated by following
formula :
P
D(MAX)
= (T
J(MAX)
T
A
) / θ
JA
where T
J(MAX)
is the maximum operation junction
temperature, T
A
is the ambient temperature and the θ
JA
is
the junction to ambient thermal resistance.
For recommended operating conditions specification of the
RT8258, the maximum junction temperature of the die is
125°C. The junction to ambient thermal resistance θ
JA
is
layout dependent. For T/SOT-23-6 package, the thermal
resistance θ
JA
is 250°C/W on standard JEDEC 51-3 single
layer thermal test board. The maximum power dissipation
at T
A
= 25°C can be calculated by following formula :
P
D(MAX)
= (125°C 25°C) / (250°C/W) = 0.4W for
T/SOT-23-6 package
The maximum power dissipation depends on operating
ambient temperature for fixed T
J(MAX)
and thermal resistance
θ
JA
. For RT8258 package, the Figure 3 of derating curve
allows the designer to see the effect of rising ambient
temperature on the maximum power dissipation allowed.
Figure 3. Derating Curve for RT8258 Package
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0255075100125
Ambient Temperature (°C)
Maximum Power Dissipation (W)
T/SOT-23-6
Single Layer PCB
Figure 4. PCB Layout Guide
BOOT
GND
FB
EN
VIN
PHASE
4
2
3
5
61
V
OUT
C
B
R2
R1
C
IN
V
OUT
L
C
OUT
GND
D1

RT8258GE

Mfr. #:
Manufacturer:
Description:
IC REG BUCK ADJ 1.2A SOT23-6
Lifecycle:
New from this manufacturer.
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