74LVC244A
Document number: DS35888 Rev. 1 - 2
5 of 10
www.diodes.com
July 2014
© Diodes Incorporated
74LVC244A
NEW PRODUCT
Switching Characteristics
Symbol Parameter
Test
Conditions
V
CC
T
A
= +25°C
T
A
= -40° to
+85°C
T
A
= -40° to
+125°C
Unit
Min Typ Max Min Max Min Max
t
PD
Propagation
Delay A
N
to Y
N
1.5V 1 7 16.9 1 18.9 1 20.4
ns
Figure 1
1.8V ± 0.15V 1 6.0 11.4 1 11.3 1 12.4
2.5V ± 0.2V 1 3.9 7.4 1 8.0 1 10.0
2.7V 1 4.2 7.7 1 8.5 1 8.8
3.3V ± 0.3 1.5 3.8 7.3 1.5 7.7 1.5 7.9
t
EN
Enable Time
OE to Y
N
1.5V 1 12.4 18.3 1 19.8 1 25.4
ns
Figure 1
1.8V ± 0.15V 1 6.4 12.1 1 12.6 1 14.1
2.5V ± 0.2V 1 4.6 9.1 1 9.6 1 11.7
2.7V 1 5 8.4 1 8.6 1 10.3
3.3V ± 0.3 1.5 4.5 7.4 1.5 7.6 1.5 9.4
t
DIS
Disable Time
OE to Y
N
1.5V 1 7.2 15.6 1 16.1 1 17.6
ns
Figure 1
1.8V ± 0.15V 1 5.8 11.6 1 12.1 1 13.6
2.5V ± 0.2V 1 3.7 7.3 1 7.8 1 9.9
2.7V 1 3.8 6.6 1 6.8 1 8.6
3.3V ± 0.3 1.5 3.8 6.3 1.5 6.5 1.5 8
t
sk(0)
Output Skew
Time
3.3V ± 0.3 — — 1.0 — — — 1.5 ns
Operating Characteristics
T
A
= +25°C
Symbol Parameter Test Conditions
V
CC
Typ Unit
C
pd
Power dissipation
capacitance per gate
F= 10 MHz
Outputs Enabled
1.8V± 0.15V 9.9
pF
2.5V± 0.2V 10.2
3.3V± 0.3V 10.6
Package Characteristics
Symbol Parameter Package Test Conditions Min Typ Max Unit
JA
Thermal Resistance
Junction-to-Ambient
TSSOP-20 (Note 9) — 74 — °C/W
JC
Thermal Resistance
Junction-to-Case
TSSOP-20 (Note 9) — 15 — °C/W
JA
Thermal Resistance
Junction-to-Ambient
V-QFN4525-20 (Note 9) — 67 — °C/W
JC
Thermal Resistance
Junction-to-Case
V-QFN4525-20 (Note 9) — 20 — °C/W
Note: 9. Test conditions for TSSOP-20 and V-QFN4525-20: Devices mounted on 4 layer FR-4 substrate PC board, 2oz copper, with minimum recommended
pad layout per JESD 51-7.
