Rev Date: 11/10/2017
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This specification may be changed at any time without prior notice. marketing@seielect.com
Please confirm technical specifications before you order and/or use.
Surface Mount High Current Jumper Chip Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
Environmental Performance Characteristics
Function Performance Characteristics
Mount part to test substrate. Apply pressure in direction of arrow unit
band width reaches 0.5mm (+0.2/-0mm)(illustrated in the figure below)
and hold for 10 seconds ± 1 second.
Resistance to
Solder Heat
For 0402 size max. 0.003Ω
All other sizes max. 0.0005Ω
The part shall be immersed into the flux specified in the solder bath
260ºC ± 5ºC for 10 seconds ± 1 second
For 0402 size max. 0.003Ω
All other sizes max. 0.0005Ω
Solder shall be covered 95%
or more of the electrode area
The part shall be immersed into the flux specified in the solder bath
235ºC ± 5ºC for 2 seconds ± 0.5 seconds. It shall be immersed to a
point 10mm from its root.
(Sn96.5/Ag3.0/Cu0.5)
Short Time Overload JIS-C5202-5.5 2.5X rated current for 5 seconds
Note: Test board surface temperature shall not exceed 100ºC when applying rated current.
Storage Conditions: 5ºC ~ 35ºC. RH: 40%-75%
Part (mounted on board) is exposed, -55ºC ± 3ºC (30 min.)/
+155°C ± 2ºC (30 minutes) for 5 cycles.
The following conditions as per picture below.
Rapid Change of
Temperature
Specimens shall be placed in a chamber and subject to a relative
humidity of 90~95% and to a temperature of 40ºC ± 2ºC for
the period of 1000 hours
Part (mounted on board) is exposed in the heat chamber
125ºC ± 3ºC for 1000 hours
High Temperature
Exposure
Apply rated power at 70ºC ± 2ºC for 1000 hours with 1.5 hours ON
and 0.5 hour OFF
For 0402 size max. 0.003Ω
All other sizes max. 0.0005Ω