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LP T656-M2P1-25-Z
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
2006-12
-05
10
LG T656, LP T656
Empfohlenes Lötpaddesign
8) 9)
Seite
15
IR-Reflow Löten
Recommended Solder Pad
8) 9)
page
15
IR Reflow Soldering
Empfohlenes Lötpaddesign
verwendbar für TOPLED
®
und Power TOPLED
®
IR Reflow Löten
8)
Seite
15
Recommended Solder Pad
useable for TOPLED
®
and Power TOPLED
®
IR Reflow Soldering
8)
page
15
OHLPY970
4.5 (0.177)
2.6 (0.102)
1.5 (0.059)
Cu-area > 16 mm
Cu-Fläche > 16 mm
2
2
Solder resist
Lötstopplack
4.5 (0.177)
1.5 (0.059)
2.6 (0.102)
Padgeometrie für
improved heat dissipation
verbesserte Wärmeableitung
Paddesign for
OHLPY440
Padgeometrie für
verbesserte Wärmeableitung
improved heat dissipation
Paddesign for
Lötstoplack
Solder resist
0.8 (0.031)
3.7 (0.146)
1.1 (0.043)
2.3 (0.091)
3.3 (0.130)
1.5 (0.059)
11.1 (0.437)
Cu Fläche /
16 mm per pad
2
Cu-area
_
<
3.3 (0.130)
Kathode/
Cathode
Anode
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
0.7 (0.028)
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
LG T656, LP T656
2006-12
-05
11
Lötbedingungen
Vorbehandlung nach
JEDEC Level 2
Soldering Conditions
Preconditioning
acc. to JEDEC Level 2
IR-Reflow Lötprofil für bleifreies Löten
(nach J-STD-020B)
IR
Reflow
Soldering Profile for lead free soldering
(acc. to
J-STD-020B
)
Wellenlöten (TTW)
(nach CECC 00802)
TTW Soldering
(acc. to CECC 00802)
OHLA0687
0
0
T
t
˚C
s
120 s max
50
100
150
200
250
300
Ramp Up
100 s max
50
100
150
200
250
300
Ramp Down
6 K/s (max)
3 K/s (max)
25 ˚C
30 s max
260 ˚C
+0 ˚C
-5 ˚C
245 ˚C
±5 ˚C
240 ˚C
255 ˚C
217 ˚C
Maximum Solder Profile
Recommended Solder Profile
235 ˚C
-0 ˚C
+5 ˚C
Minimum Solder Profile
10 s min
OHLY0598
0
0
50
100
150
200
250
50
100
150
200
250
300
T
t
C
s
235
C
10 s
C
... 260
1. Welle
1. wave
2. Welle
2. wave
5 K/s
2 K/s
ca 200 K/s
CC
... 130
100
2 K/s
Zwangskühlung
forced cooling
Normalkurve
standard curve
Grenzkurven
limit curves
2006-12
-05
12
LG T656, LP T656
Barcode-Produkt-Etikett (BPL)
Barcode-Product-Label (BPL)
Gurtverpackung
Tape and Reel
Tape dime
nsion
s in mm (inch)
W
P
0
P
1
P
2
D
0
E
F
4
±
0.1
(0.157
±
0.004)
8
±
0.1
(0.315
±
0.004)
2
±
0.05
(0.079
±
0.00
2)
1.5
+
0.1
(0.059
+
0.004
)
1.75
±
0.1
(0.069
±
0.004)
5.5
±
0.
05
(0.217
±
0.002)
Reel dimen
sions in m
m (inch)
A
W
N
min
W
1
W
2 max
330 (13)
12 (0.
472)
60 (2.362)
12.4 + 2 (0.488
+
0.079)
18.4
(0
.7
24)
Sample
OHA12043
X - X - X
(G) GROUP:
Lot Number
(1T) LOT NO:
(9D) D/C: Date Code
(X) PROD NO:
Product Code
(6P) BATCH NO: Batch Number
Lx xxxx
Product Name
RoHS Compliant
Bin1: Bin Information Color 1
Bin2:
Bin3:
ML
2
Temp ST
260 C RT
Additional TEXT
R077
DEMY
PACKVAR:
Packing Type
Product Quantity per Reel
(Q)QTY:
Semiconductors
OSRAM Opto
Wavelength Group
Forward Voltage Group
Brightness Group
Bar Code
Bar Code
Bar Code
D
0
2
P
P
0
1
P
W
FE
Direction of unreeling
N
W
1
2
W
A
OHAY0324
Label
Gurtvorlauf:
Leader:
Trailer:
Gurtende:
13.0
Direction of unreeling
±0.25
160 mm
160 mm
400 mm
400 mm
12
+
0.
3
–
0.
1
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
LP T656-M2P1-25-Z
Mfr. #:
Buy LP T656-M2P1-25-Z
Manufacturer:
OSRAM Opto Semiconductors
Description:
Standard LEDs - SMD Pure Green 560nm
Lifecycle:
New from this manufacturer.
Delivery:
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EMS
Payment:
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Products related to this Datasheet
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LP T656-M2P1-25-Z
LP T656-N2Q1-25-Z