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SFH 3716

P1-P3P4-P6P7-P9P10-P12
2016-02-29 4
Version 1.3 SFH 3716
Directional Characteristics
1) page 11
S
rel
= f(ϕ)
Package Outline
Dimensions in mm.
OHF01402
90
80
70
60
50
40 30 20 10
20 40 60 80 100 1200.40.60.81.0
ϕ
0.2
0.4
0.6
0.8
1.0
100
0
0
0
Version 1.3 SFH 3716
2016-02-29 5
Pinning
Pin Description
1 Collector
2 Emitter
Approximate Weight:
3.76 mg
Recommended Solder Pad
Dimensions in mm.
OHFP2578
3.2
1.25
1
Component location on pad
Bauteil positioniert
2016-02-29 6
Version 1.3 SFH 3716
Reflow Soldering Profile
Product complies to MSL Level 3 acc. to JEDEC J-STD-020D.01
0
0
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
OHA04612
Profile Feature
Profil-Charakteristik
Ramp-up rate to preheat*
)
25 °C to 150 °C
2 3 K/s
Time t
S
T
Smin
to T
Smax
t
S
t
L
t
P
T
L
T
P
100 12060
10 20 30
80 100
217
2 3
245 260
3 6
Time
25 °C to T
P
Time within 5 °C of the specified peak
temperature T
P
- 5 K
Ramp-down rate*
T
P
to 100 °C
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
Ramp-up rate to peak*
)
T
Smax
to T
P
Liquidus temperature
Peak temperature
Time above liquidus temperature
Symbol
Symbol
Unit
Einheit
Pb-Free (SnAgCu) Assembly
Minimum MaximumRecommendation
K/s
K/s
s
s
s
s
°C
°C
480
P1-P3P4-P6P7-P9P10-P12

SFH 3716

Mfr. #:
Buy SFH 3716
Manufacturer:
OSRAM Opto Semiconductors
Description:
Phototransistors Light Sensor ChipLED
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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