NCP1090, NCP1091, NCP1092
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Table 1. PIN DESCRIPTION
Name
Pin No.
Type Description
NCP1090 NCP1091 NCP1092
INRUSH 1 1 1 Output Current limit programming pin. Connect a resistor between
INRUSH and VPORTN.
CLASS 2 2 2 Output Classification current programming pin. Connect a resistor
between CLASS and VPORTN.
DET 3 3 3 Output,
Open Drain
Detection pin. Connect a 24.9 kW resistor between DET and
VPORTP for a valid PD detection signature.
VPORTN 4 4 4 Ground Negative input power. Connected to the source of the internal
pass−switch
RTN 5 5 5 Ground DC−DC controller power return. Connected to the drain of the
internal pass−switch
PGOOD 6 6 6 Output,
Open Drain
Open Drain Power Good Indicator. Pin is in HZ mode when the
power good signal is active.
NC 7 − − − No connection
UVLO − 7 − Input Under−voltage lockout input. Voltage with respect to VPORTN.
Connect a resistor−divider from VPORTP to UVLO to
VPORTNx to set an external UVLO threshold.
AUX − − 7 Input Auxiliary Pin. When this pin is pulled up, the Pass Switch is
disabled and allows a supply transition from PSE to the rear
auxiliary supply connected between VPORTP and RTN.
VPORTP 8 8 8 Input Positive input power. Voltage with respect to VPORTN.
Operating Conditions
Table 2. ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Min Max Units Conditions
VPORTP Input power supply −0.3 72 V Voltage with respect to VPORTN
RTN Analog ground supply 2 −0.3 72 V Pass−switch in off−state (voltage with respect to VPORTN)
CLASS Analog output −0.3 72 V Voltage with respect to VPORTN
INRUSH Analog output −0.3 3.6 V Voltage with respect to VPORTN
AUX Analog input −0.3 72 V Voltage with respect to VPORTN
UVLO Analog input −0.3 3.6 V Voltage with respect to VPORTN
PGOOD Analog output −0.3 72 V Voltage with respect to RTN
Ta Ambient temperature −40 85 °C
Tj Junction temperature − 125 °C
Tj−TSD Junction temperature
(Note 1)
− 175 °C Thermal shutdown condition
T
stg
Storage Temperature −55 150 °C
TθJA Thermal Resistance,
Junction to Air (Note 2)
150
160
240
260
°C/W SOIC−8
TSSOP−8
ESD−HBM Human Body Model 2 kV per EIA−JESD22−A114 standard
ESD−CDM Charged Device Model 500 V per ESD−STM5.3.1 standard
ESD−MM Machine Model 200 V per EIA−JESD22−A115−A standard
LU Latch−up ±100 mA per JEDEC Standard JESD78
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Tj−TSD allowed during error conditions only. It is assumed that this maximum temperature condition does not occur more than 1 hour
cumulative during the useful life for reliability reasons.
2. Low qJA is obtained with 2S2P test board (2 signal − 2 plane). High qJA is obtained with double sideboard with minimum pad area and natural
convection. Refer to Jedec JESD51 for details.
