DO NOT
SCALE FROM
THIS PRINT
.118 3.00
.0080
REF
0.203
.0400
REF
1.016
.1420
REF
3.607
.1600
REF
4.064
.7450 18.92
REF
.168
(SEE NOTE 10)
4.27
.1275
REF
3.24
2
MAX SWAY
(TYP)
"A"
"A"
T-1G1-01-XXX
QTE-060-01-XXX-D-EM2 SHOWN
FIG 1
C
C
C
C
SEE TABLE 1
No OF POSITIONS/20 x .7875 [20.003] REF
.7875
REF
20.003
.1550
REF
3.937
.2350 5.97
REF
(No OF POSITIONS/20 x .7875 [20.003]) + .3900 [9.906] REF
.645 16.38
REF
19 EQ SPACES
@ .0315 [.800]
.0333
REF
0.84
QTE-20-01-D-EMX-XX
01
02
C
-020, -040, -060,
**-080, **-100
(PER ROW)
**SEE NOTE 14
ROW SPECIFICATION
-D: DOUBLE (USE QTE-20-XX-D-EMX-XX)
EDGE MOUNT THICKNESS
-EM2: .064[1.63] +/-.004 PCB
(USE QTE-20-01-D-EM2-XX & T-1S42-01-X)
-F: 3µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN ON TAILS
(USE T-1S42-XX-F & T-1G1-01-F) (SEE NOTE 11)
-L: 10µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN ON TAILS
(USE T-1S42-XX-L & T-1G1-01-L)
-H: 30µ" GOLD IN CONTACT AREA, 3µ" GOLD ON TAIL
(USE T-1S42-XX-H & T-1G1-01-G)
-C: 50µ" GOLD IN CONTACT AREA, 3µ" GOLD ON TAIL
(USE T-1S42-XX-C & T-1G1-01-L)
-STL: 30µ" SELECTIVE GOLD IN CONTACT AREA, TIN/LEAD (90%/10 +/-5%) TAIL
(USE T-1S42-XX-STL & T-1G1-01-STL)
-FTL: 3µ" SELECTIVE GOLD IN CONTACT AREA, TIN/LEAD (90%/10 +/-5%) TAIL
(USE T-1S42-XX-FTL & T-1G1-01-FTL)
LEAD STYLE
-01: .1680[4.267]
No OF BANKS
-GP: GUIDE POST
(USE QTE-20-01-D-EMX-XX-GP,
SEE FIG 2, SHEET 2)
OPTION
-EM3:
(USE QTE-20-01-D-EM3-XX & T-1S42-02-X)
SEE NOTE 13
-TY: TRAY PACKAGING
QTE-XXX-01-XXX-D-EMX-XX
No OF POSITIONS
PLATING SPECIFICATION
.0150
REF
0.381
"A" REF
.2782 7.067
REF
"B"
±.0030
"B"
±0.08
(INSIDE TO
INSIDE OF PIN)
.155
±.003
3.94
±0.08
SECTION "A"-"A"
T-1S42-XX-X
C
.1200
REF
3.048
.0300
REF
0.762
"C" REF
.1750
REF
4.45
C
* = SEE NOTE 13
C
7
SHEET OF
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS ANGLES
.XX:
.01 [.3] 2
.XXX:
.005 [.13]
.XXXX:
.0020 [.051]
MATERIAL:
.8mm EDGEMOUNT HS TERMINAL ASSEMBLY
BY:
QTE-XXX-01-XXX-D-EMX-XX
DWG. NO.
DESCRIPTION:
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
DO NOT SCALE DRAWING
DEAN P
9/2/1999
2
1
SHEET SCALE: 1:0.8
INSULATOR: LCP COLOR: BLACK
TERMINAL & GROUND PLANE: PHOS BRONZE
F:\DWG\MISC\MKTG\QTE-XXX-01-X-D-EMX-XX-MKT.SLDDRW
NOTES:
1. REPRESENTS A CRITICAL DIMENSION.
2. NOTE DELETED.
3. BURR ALLOWANCE: .0015 [.03] MAX.
4. MINIMUM TERMINAL RETENTION: 6 OZ.
5. MINIMUM GROUND PLANE RETENTION: 1 LB.
6. PARTS TO BE MOLD-TO-POSITION.
7. NOTE DELETED.
8. NOTE DELETED.
9. NOTE DELETED.
10. MAX VARIANCE: .002 [.05].
11. -L PLATING CAN BE SUBSTITUTED FOR -F PLATING.
12. SEE http://www.samtec.com/processing/edgemt_tectalk/index.htm FOR INFORMATION ON
PROCESSING EDGE MOUNT PARTS TO BOARDS.
13. -EM3 IS NOT A STANDARD OFFERING; AVAILABLE AS AN ASP ONLY. PLEASE CONTACT SAMTEC
INTERCONNECT PROCESSING GROUP WITH ORDER INQUIRIES
14. FOR NEW APPLICATIONS REQUIRING THESE POSITIONS, PLEASE CONTACT SAMTEC INTERCONNECT
PROCESSING GROUP.
15. PARTS WITHOUT -TY OPTION SHALL BE PACKAGED IN TRAYS.
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733 FAX: 812-948-5047
e-Mail: info@SAMTEC.com code: 55322
REVISION AE
