LTC3520
19
3520fa
Most applications require a faster transient response than
can be attained using Type I compensation in order to reduce
the size of the output capacitor. To achieve a higher loop
bandwidth, Type III compensation is required, providing
two zeros to compensate for the double pole response of
the output fi lter. Referring to Figure 7, the location of the
compensation poles and zeros are given as follows:
f
RC
Hz Hz
f
RC
POLE
P
ZERO
ZP
1
1
1
1
1
2 32000 1
0
1
2
≅≅
=
π
π
()
HHz
f
RC
Hz
f
RC
Hz
ZERO
Z
POLE
ZP
2
1
2
2
1
21
1
2
=
=
π
π
where all resistances are in ohms and all capacitances
are in farads.
PCB Layout Considerations
The LTC3520 switches large currents at high frequencies.
Special care should be given to the PCB layout to ensure
stable, noise-free operation. Figure 8 depicts the recom-
mended PCB layout to be utilized for the LTC3520. A few
key guidelines follow:
1. All circulating current paths should be kept as short
as possible. This can be accomplished by keeping the
routes to all bold components in Figure 8 as short
and as wide as possible. Capacitor ground connec-
tions should via down to the ground plane by the
shortest route possible. The bypass capacitors on
PV
IN1
, PV
IN2
, and PV
IN3
should be placed as close
to the IC as possible and should have the shortest
possible paths to ground.
2. The small signal ground pad (SGND) should have a
single-point connection to the power ground. A con-
venient way to achieve this is to short the pin directly
to the Exposed Pad as shown in Figure 8.
3. The components shown in bold and their connections
should all be placed over a complete ground plane to
reduce the cross-sectional area of circulating current
paths.
4. To prevent large circulating currents from disrupting
the output voltage sensing, the ground for each resistor
divider should be returned directly to the small signal
ground pin (SGND).
5. Use of vias in the die attach pad will enhance the ther-
mal environment of the converter especially if the vias
extend to a ground plane region on the exposed bottom
surface of the PCB.
Figure 7. Type III Compensation Network
APPLICATIONS INFORMATION
0.782V
R1
R2
3520 F07
FB1
18
V
C1
C
Z1
V
OUT
15
C
P2
+
C
P1
R
Z
LTC3520
20
3520fa
APPLICATIONS INFORMATION
Figure 8. LTC3520 Recommended PCB Layout
3520 F08
BUCK V
OUT
R
BURST
KELVIN DIRECTLY
TO PIN 16
KELVIN DIRECTLY
TO PIN 16
C
SS2
C
SS1
BUCK-BOOST
V
OUT
R
T
UNINTERRUPTED GROUND PLANE MUST EXIST UNDER ALL COMPONENTS
SHOWN IN BOLD AND UNDER TRACES CONNECTING TO THOSE COMPONENTS.
VIA TO GROUND PLANE
SV
IN
A
OUT
A
IN
R
T
PWM1
SD1
SGND
SS1
V
C1
FB2
SS2
FB1
SGND
PV
IN3
PV
IN1
SW1A
PGND1
SV1B
V
OUT1
SD2
SD3
PV
IN2
SW2
PGND2
PWM2
24 23 22 21 20 19
7 8 9 10 11 12
6
5
4
3
2
1
13
14
15
16
17
18
LTC3520
21
3520fa
TYPICAL APPLICATIONS
Sequenced Buck Converter Start-Up
3.3V at 500mA and 1.8V at 600mA Outputs
3520 TA02a
SW1A
SW1B
V
OUT1
A
OUT
A
IN
V
C1
FB1
SS1
SV
IN
PV
IN3
PV
IN2
PV
IN1
PGND2SGNDPGND1
SW2
FB2
SS2
R
T
PWM1
PWM2
SD3
SD1
SD2
C3
22μF
1M
442k
309k
15k
470pF
10k
56pF
LTC3520
V
OUT
3.3V
500mA
1A FOR V
IN
≥ 3V
V
OUT
1.8V
600mA
V
IN
2.2V TO 4.2V
C1, C2, C3: TAIYO YUDEN CERAMIC JMK212BJ226MG-T
L1: TDK RLF7030T-4R7M3R4 4.7μH
L2: TDK RLF7030T-3R3M4R 3.3μH
THE BUCK CONVERTER IS ENABLED WHEN THE
BUCK-BOOST OUTPUT VOLTAGE REACHES 3.0V.
C2
22μF
470pF
0.022μF
0.022μF
54.9k
255k
200k
301k
499k
C1
22μF
Li-Ion
L2
3.3μH
L1
4.7μH
158k
27pF
PWM
BURST
ON
OFF
Typical Waveforms During Power-Up
SD1, SD3
5V/DIV
1ms/DIV
BUCK V
OUT
1V/DIV
BUCK-BOOST
V
OUT
2V/DIV
A
OUT
5V/DIV
3520 TA02b

LTC3520IUF#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators Synchronous 600mA Buck-Boost and 400mA Buck Converters in 4mm x 4mm QFN
Lifecycle:
New from this manufacturer.
Delivery:
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