IPD40N03S4L08ATMA1

IPD40N03S4L-08
OptiMOS
®
-T2 Power-Transistor
Features
• N-channel - Enhancement mode
• Automotive AEC Q101 qualified
• MSL1 up to 260°C peak reflow
• 175°C operating temperature
• Green product (RoHS compliant)
• 100% Avalanche tested
Maximum ratings, at T
j
=25 °C, unless otherwise specified
Parameter Symbol Conditions Unit
Continuous drain current
I
D
T
C
=25°C, V
GS
=10V
1)
40 A
T
C
=100°C, V
GS
=10V
2)
38
Pulsed drain current
2)
I
D,pulse
T
C
=25°C
160
Avalanche energy, single pulse
2)
E
AS
I
D
=40A
23 mJ
Avalanche current, single pulse
I
AS
-
40 A
Gate source voltage
V
GS
- ±16 V
Power dissipation
P
tot
T
C
=25°C
42 W
Operating and storage temperature
T
j
, T
stg
- -55 ... +175 °C
IEC climatic category; DIN IEC 68-1 - - 55/175/56
-
Value
V
DS
30
V
R
DS(on),max
8.3
mW
I
D
40 A
Product Summary
PG-TO252-3-11
Type Package Marking
IPD40N03S4L-08 PG-TO252-3-11 4N03L08
Rev. 1.1 page 1 2010-10-05
IPD40N03S4L-08
Parameter Symbol Conditions Unit
min. typ. max.
Thermal characteristics
2)
Thermal resistance, junction - case
R
thJC
- - - 3.6 K/W
SMD version, device on PCB
R
thJA
minimal footprint - - 62
6 cm
2
cooling area
3)
- - 40
Electrical characteristics, at T
j
=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V
(BR)DSS
V
GS
=0V, I
D
= 1mA
30 - - V
Gate threshold voltage
V
GS(th)
V
DS
=V
GS
, I
D
=13µA
1.0 1.5 2.2
Zero gate voltage drain current
I
DSS
V
DS
=30V, V
GS
=0V,
T
j
=25°C
- 0.1 1 µA
V
DS
=30V, V
GS
=0V,
T
j
=125°C
2)
- 10 100
Gate-source leakage current
I
GSS
V
GS
=16V, V
DS
=0V
- - 100 nA
Drain-source on-state resistance
R
DS(on)
V
GS
=4.5V, I
D
=20A
- 9.7 13.0
mW
V
GS
=10V, I
D
=40A
- 7.2 8.3
Values
Rev. 1.1 page 2 2010-10-05
IPD40N03S4L-08
Parameter Symbol Conditions Unit
min. typ. max.
Dynamic characteristics
2)
Input capacitance
C
iss
- 1170 1520 pF
Output capacitance
C
oss
- 320 420
Reverse transfer capacitance
C
rss
- 11 22
Turn-on delay time
t
d(on)
- 3 - ns
Rise time
t
r
- 1 -
Turn-off delay time
t
d(off)
- 12 -
Fall time
t
f
- 5 -
Gate Charge Characteristics
2)
Gate to source charge
Q
gs
- 4 5 nC
Gate to drain charge
Q
gd
- 2 4
Gate charge total
Q
g
- 15 20
Gate plateau voltage
V
plateau
- 3.4 - V
Reverse Diode
Diode continous forward current
2)
I
S
- - 30 A
Diode pulse current
2)
I
S,pulse
- - 120
Diode forward voltage
V
SD
V
GS
=0V, I
F
=40A,
T
j
=25°C
0.6 0.95 1.3 V
Reverse recovery time
2)
t
rr
V
R
=30V, I
F
=I
S
,
di
F
/dt =100A/µs
- 12 - ns
Reverse recovery charge
2)
Q
rr
- 10 - nC
T
C
=25°C
Values
V
GS
=0V, V
DS
=15V,
f =1MHz
V
DD
=15V, V
GS
=10V,
I
D
=40A, R
G
=1.6W
V
DD
=24V, I
D
=40A,
V
GS
=0 to 10V
2)
Defined by design. Not subject to production test.
3)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm
2
(one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
1)
Current is limited by bondwire; with an R
thJC
= 3.6K/W the chip is able to carry 54A at 25°C.
Rev. 1.1 page 3 2010-10-05

IPD40N03S4L08ATMA1

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET N-CH TO252-3
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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