IDT71256L25YI8

4
IDT71256S/L
CMOS Static RAM 256K (32K x 8-Bit) Military, Commercial, and Industrial Temperature Ranges
AC Test Conditions
*Includes scope and jig capacitances
Figure 2. AC Test Load
(for tCLZ, tOLZ, tCHZ, tOHZ, tOW, and tWHZ)
Figure 1. AC Test Load
Input Pulse Levels
Input Rise/Fall Times
Input Timing Reference Levels
Output Reference Levels
AC Test Load
GND to 3.0V
5ns
1.5V
1.5V
See Figures 1 and 2
2946 tbl 09
2946drw 04
480
255
30pF*
D
ATA
OUT
5V
,
2946drw 05
480
255
5pF*
D
ATA
OUT
5V
,
DC Electrical Characteristics (VCC = 5.0V ± 10%)
Data Retention Characteristics Over All Temperature Ranges
(L Version Only) (VLC = 0.2V, VHC = VCC - 0.2V)
NOTES:
1. TA = +25°C.
2. tRC = Read Cycle Time.
3. This parameter is guaranteed by device characterization, but is not production tested.
Symbol Parameter Test Conditions
IDT71256S IDT71256L
UnitMin. Typ. Max. Min. Typ. Max.
|I
LI
|
Input Leakage Current
V
CC
= Max.,
V
IN
=
GND to V
CC
MIL.
COM"L & IND.
____
____
____
____
10
5
____
____
____
____
5
2
µA
|I
LO
| Output Leakage Current V
CC
= Max., CS = V
IH
,
V
OUT
= GND to V
CC
MIL.
COM"L & IND.
____
____
____
____
10
5
____
____
____
____
5
2
µA
V
OL
Output Low Voltage
I
OL
= 8mA, V
CC
= Min.
____ ____
0.4
____ ____
0.4
V
I
OL
= 10mA, V
CC
= Min.
____ ____
0.5
____ ____
0.5
V
OH
Output High Voltage I
OH
= -4mA, V
CC
= Min. 2.4
____ ____
2.4
____ ____
V
2946 tbl 10
Typ.
(1 )
V
CC
@
Max.
V
CC
@
Symbol Parameter Test Condition Min. 2.0V 3.0V 2.0V 3.0V Unit
V
DR
V
CC
for Data Retention
____
2.0
____ ____ ____ ____
V
I
CCDR
Data Retention Current MIL.
COM'L. & IND.
____
____
____
____
____
____
500
120
800
200
µA
t
CDR
Chip Deselect to Data
Retention Time
CS >
V
HC
0
____ ____ ____ ____
ns
t
R
(3)
Operation Recovery Time
t
RC
(2)
____ ____ ____ ____
ns
2946 tbl 11
6.42
IDT71256S/L
CMOS Static RAM 256K (32K x 8-Bit) Military, Commercial, and Industrial Temperature Ranges
5
AC Electrical Characteristics (VCC = 5.0V ± 10%, All Temperature Ranges)
Low VCC Data Retention Waveform
2946 drw 06
D
A
A
RETENTION
MODE
4.5V
4.5V
V
DR
2V
V
IH
V
IH
t
R
t
CDR
V
CC
CS
V
DR
NOTES:
1. 0° to +70°C temperature range only.
2. This parameter is guaranteed by device characterization, but is not production tested.
3. –55°C to +125°C temperature range only.
Symbol Parameter
71256L20
(1)
71256S25
71256L25
71256S35
71256L35
71256S45
(3 )
71256L45
(3 )
Unit
Min. Max. Min. Max. Min. Max. Min. Max.
Read Cycle
t
RC
Read Cycle Time 20
____
25
____
35
____
45
____
ns
t
AA
Address Access Time
____
20
____
25
____
35
____
45 ns
t
ACS
Chip Select Access Time
____
20
____
25
____
35
____
45 ns
t
CL Z
(2 )
Chip Select to Output in Low-Z 5
____
5
____
5
____
5
____
ns
t
CHZ
(2)
Chip Deselect to Output in High-Z
____
10
____
11
____
15
____
20 ns
t
OE
Output Enable to Output Valid
____
10
____
11
____
15
____
20 ns
t
OLZ
(2)
Output Enable to Output in Low-Z 2
____
2
____
2
____
0
____
ns
t
OHZ
(2 )
Output Disable to Output in High-Z 2 8 2 10 2 15
____
20 ns
t
OH
Output Hold from Address Change 5
____
5
____
5
____
5
____
ns
Write Cycle
t
WC
Write Cycle Time 20
____
25
____
35
____
45
____
ns
t
CW
Chip Select to End-of-Write 15
____
20
____
30
____
40
____
ns
t
AW
Address Valid to End-of-Write 15
____
20
____
30
____
40
____
ns
t
AS
Address Set-up Time 0
____
0
____
0
____
0
____
ns
t
WP
Write Pulse Width 15
____
20
____
30
____
35
____
ns
t
WR
Write Recovery Time 0
____
0
____
0
____
0
____
ns
t
DW
Data to Write Time Overlap 11
____
13
____
15
____
20
____
ns
t
WHZ
(2)
Write Enable to Output in High-Z
____
10
____
11
____
15
____
20 ns
t
DH
Data Hold from Write Time 0
____
0
____
0
____
0
____
ns
t
OW
(2)
Output Active from End-of-Write 5
____
5
____
5
____
5
____
ns
2946 tbl 12
6
IDT71256S/L
CMOS Static RAM 256K (32K x 8-Bit) Military, Commercial, and Industrial Temperature Ranges
AC Electrical Characteristics (VCC = 5.0V ± 10%, Military Temperature Ranges)
NOTES:
1. -55° to +125°C temperature range only.
2. This parameter is guaranteed by device characterization, but is not production tested.
Symbol Parameter
71256S55
(1 )
71256L55
(1)
71256S70
(1 )
71256L70
(1 )
71256S85
(1 )
71256L85
(1 )
71256S100
(1 )
71256L100
(1 )
Unit
Min. Max. Min. Max. Min. Max. Min. Max.
Read Cycle
t
RC
Read Cycle Time 55
____
70
____
85
____
100
____
ns
t
AA
Address Access Time
____
55
____
70
____
85
____
100 ns
t
ACS
Chip Select Access Time
____
55
____
70
____
85
____
100 ns
t
CL Z
(2 )
Chip Select to Output in Low-Z 5
____
5
____
5
____
5
____
ns
t
CHZ
(2)
Chip Deselect to Output in High-Z
____
25
____
30
____
35
____
40 ns
t
OE
Output Enable to Output Valid
____
25
____
30
____
35
____
40 ns
t
OLZ
(2)
Output Enable to Output in Low-Z 0
____
0
____
0
____
0
____
ns
t
OHZ
(2 )
Output Disable to Output in High-Z 0 25 0 30
____
35
____
40 ns
t
OH
Output Hold from Address Change 5
____
5
____
5
____
5
____
ns
Write Cycle
t
WC
Write Cycle Time 55
____
70
____
85
____
100
____
ns
t
CW
Chip Select to End-of-Write 50
____
60
____
70
____
80
____
ns
t
AW
Address Valid to End-of-Write 50
____
60
____
70
____
80
____
ns
t
AS
Address Set-up Time 0
____
0
____
0
____
0
____
ns
t
WP
Write Pulse Width 40
____
45
____
50
____
55
____
ns
t
WR
Write Recovery Time 0
____
0
____
0
____
0
____
ns
t
DW
Data to Write Time Overlap 25
____
30
____
35
____
40
____
ns
t
WHZ
(2)
Write Enable to Output in High-Z
____
25
____
30
____
35
____
40 ns
t
DH
Data Hold from Write Time (WE)0
____
0
____
0
____
0
____
ns
t
OW
(2)
Output Active from End-of-Write 5
____
5
____
5
____
5
____
ns
2946 tbl 13

IDT71256L25YI8

Mfr. #:
Manufacturer:
Description:
IC SRAM 256K PARALLEL 28SOJ
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New from this manufacturer.
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