ZXCD1010
ISSUE 4 - AUGUST 2007
13
PACKAGE DIMENSIONS
Device Description Package T&R Suffix
ZXCD1010EQ16 Class D modulator QSOP16* TA, TC
ORDERING INFORMATION
Information on Zetex reference designs, MOSFETs and demonstration boards can be obtain by contacting Zetex
applications or by visiting www.zetex.com/audio
*This package features an exposed pad which must be soldered down.
DIM
Inches Millimeters
DIM
Inches Millimeters
Min Max Min Max Min Max Min Max
A 0.058 0.066 1.473 1.676 E2 0.062 0.070 1.575 1.778
A1 0.001 0.005 0.025 0.127 e 0.025 BSC 0.635 BSC
A2 0.055 0.061 1.397 1.549 H 0.228 0.244 5.791 6.198
b 0.008 0.012 0.203 0.305 h 0.010 0.016 0.254 0.406
c 0.007 0.010 0.178 0.254 L 0.016 0.035 0.406 0.889
D 0.189 0.196 4.801 4.978 S 0.002 0.007 0.051 0.178
D2 0.102 0.110 2.591 2.794 ␣ 0ⴗ 8ⴗ 0
8ⴗ
PACKAGE DIMENSIONS
Controlling dimensions are in inches. Approximate conversions are given in millimeters
