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TL1L3-DW0,L

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16
TL1L3-DW0,L
10
9.
9.
9.
9. Packing
Packing
Packing
Packing
9.1.
9.1.
9.1.
9.1. Moisture-Proof Packing
Moisture-Proof Packing
Moisture-Proof Packing
Moisture-Proof Packing
These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid
moisture absorption. The optical characteristics of the device may be affected by exposure to moisture in the air
before soldering and the device should therefore be stored under the following conditions:
• This moisture proof bag may be stored unopened within 12 months at the following conditions.
Temperature: 5 to 30
Humidity: 90 % (max)
• After opening the moisture proof bag, the device should be assembled within 4 weeks in an environment of
5 to 30 /60 % RH or below.
• If upon opening, the moisture indicator card shows humidity 30 % or above (Color of indication changes to
pink) or the expiration date has passed, the device should be baked in taping with reel.
After baking, use the baked device within 72 hours, but perform baking only once.
Baking conditions: 60 ± 5 , for 12 to 24 hours.
Expiration date: 12 months from sealing date, which is imprinted on the label affixed.
• Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.
Furthermore, prevent the devices from being destructed against static electricity for baking of it.
• If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not
throw or drop the packed devices.
10.
10.
10.
10. Mounting
Mounting
Mounting
Mounting
10.1.
10.1.
10.1.
10.1. Mounting Precautions
Mounting Precautions
Mounting Precautions
Mounting Precautions
• Do not apply mechanical stress to the resin body at high temperature.
The time taken for a device to return to the room temperature after reflow soldering depends on the
mounting board and environmental conditions.
• The resin body is easily scratched. Avoid friction against hard materials.
• When installing an assembled board into equipment, ensure that the devices on the board do not contact
with other components.
2014-09-04
Rev.2.0
TL1L3-DW0,L
11
10.2.
10.2.
10.2.
10.2. Soldering
Soldering
Soldering
Soldering
Following show examples of reflow soldering.
• Temperature Profile (see following figures.)
Fig.
Fig.
Fig.
Fig. 10.2.1
10.2.1
10.2.1
10.2.1 Temperature Profile for
Temperature Profile for
Temperature Profile for
Temperature Profile for
Lead(Pb)-free Soldering (example)
Lead(Pb)-free Soldering (example)
Lead(Pb)-free Soldering (example)
Lead(Pb)-free Soldering (example)
Table 10.2.1 Temperature Profile for
Table 10.2.1 Temperature Profile for
Table 10.2.1 Temperature Profile for
Table 10.2.1 Temperature Profile for
Lead(Pb)-free Soldering (example)
Lead(Pb)-free Soldering (example)
Lead(Pb)-free Soldering (example)
Lead(Pb)-free Soldering (example)
• The product is evaluated using above reflow soldering conditions. No additional test is performed exceed
the condition as a evaluation. Please perform reflow soldering under the above conditions.
• Please perform the first reflow soldering with reference to the above temperature profile and within 4
weeks of opening the package.
• If a second reflow process is necessary, reflow soldering should be performed within 168 h of the first
reflow under the above conditions. Storage conditions before the second reflow soldering: 30 , 60 % RH
(max)
• Do not perform wave soldering.
• When any soldering corrections are made manually, a hot-plate should be used.
(only once at each soldering point)
10.3.
10.3.
10.3.
10.3. Land Pattern Dimensions (for reference only)
Land Pattern Dimensions (for reference only)
Land Pattern Dimensions (for reference only)
Land Pattern Dimensions (for reference only)
Heat sink pin of this product is the same electric potential as anode electrode. Please do not connect to other
electrical potentials or GND.
Fig.
Fig.
Fig.
Fig. 10.3.1
10.3.1
10.3.1
10.3.1 (Unit: mm)
(Unit: mm)
(Unit: mm)
(Unit: mm)
2014-09-04
Rev.2.0
TL1L3-DW0,L
12
11.
11.
11.
11. Cleaning
Cleaning
Cleaning
Cleaning
Flux cleaning should be completed free of residual reactive ion such as Na, Cl, etc. Organic solvent acts upon
water and generates corrosive gas such as hydrogen chloride. There are some cases where the device
is degraded.
Effective solvent seriously affects package and resin, and may cause inferior device. In actually using it, please
sufficiently check whether there is nothing inferior on the device.
Ultrasonic cleaning that provides effective cleaning for short time much affects on the device. so coherence
between resin and lead metal is degraded by cleaning solvent during long ultrasonic cleaning. We recommend
to take ultrasonic cleaning for the device at a minimum range. The influences on a device is occurred by
the output of an ultrasonic wave and set board, please sufficiently check whether there is nothing inferior
on the device.
12.
12.
12.
12. Tape Specifications
Tape Specifications
Tape Specifications
Tape Specifications
12.1.
12.1.
12.1.
12.1. Product Naming Conventions
Product Naming Conventions
Product Naming Conventions
Product Naming Conventions
The type of package used for shipment is denoted by a symbol suffix after the part number. The method of
classification is as below. (this method, however does not apply to products whose electrical characteristics differ
from standard Toshiba specifications)
Example: TL1L3-DW0,L
Toshiba part number: TL1L3-DW0
Packing type: L (Taping)
12.2.
12.2.
12.2.
12.2. Handling Precautions
Handling Precautions
Handling Precautions
Handling Precautions
(1) The tape is antistatic-coated. However, if the tape is charged with excess static electricity, devices might
cling to the tape or waggle in the tape when the cover tape peeled off. Be aware of the following to avoid
this:
Use an ionizer to neutralize the ions when utilizing an automatic mounter.
For transport and temporary storage of devices, use containers (boxes, jigs, bags) that are made with
antistatic materials or materials that dissipate static electricity.
12.3.
12.3.
12.3.
12.3. Tape Dimensions
Tape Dimensions
Tape Dimensions
Tape Dimensions
Table
Table
Table
Table 12.3.1
12.3.1
12.3.1
12.3.1 Tape Dimensions (Unit: mm)
Tape Dimensions (Unit: mm)
Tape Dimensions (Unit: mm)
Tape Dimensions (Unit: mm)
Dimensions
Tolerance
D
1.5
+0.1/-0
E
1.75
±0.1
P
0
4.0
±0.1
t
0.3
±0.05
F
5.5
±0.05
D
1
1.7
±0.1
P
2
2.0
±0.05
W
12.0
±0.2
P
8.0
±0.1
A
0
3.8
±0.1
B
0
3.8
±0.1
K
0
2.65
±0.1
2014-09-04
Rev.2.0
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16

TL1L3-DW0,L

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Description:
High Power LEDs - White LED WHITE 1W to 2W; Phase 3
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