10©2016 Integrated Device Technology, Inc. Revision B, January 20, 2016
843252 Datasheet
LVCMOS to XTAL Interface
The XTAL_IN input can accept a single-ended LVCMOS signal
through an AC coupling capacitor. A general interface diagram is
shown in Figure 3. The XTAL_OUT pin can be left floating. The input
edge rate can be as slow as 10ns. For LVCMOS inputs, it is
recommended that the amplitude be reduced from full swing to half
swing in order to prevent signal interference with the power rail and
to reduce noise. This configuration requires that the output
impedance of the driver (Ro) plus the series resistance (Rs) equals
the transmission line impedance. In addition, matched termination at
the crystal input will attenuate the signal in half. This can be done in
one of two ways. First, R1 and R2 in parallel should equal the
transmission line impedance. For most 50 applications, R1 and R2
can be 100. This can also be accomplished by removing R1 and
making R2 50.
Figure 3. General Diagram for LVCMOS Driver to XTAL Input Interface
Termination for 3.3V LVPECL Outputs
The clock layout topology shown below is a typical termination for
LVPECL outputs. The two different layouts mentioned are
recommended only as guidelines.
The differential outputs are low impedance follower outputs that
generate ECL/LVPECL compatible outputs. Therefore, terminating
resistors (DC current path to ground) or current sources must be
used for functionality. These outputs are designed to drive 50
transmission lines. Matched impedance techniques should be used
to maximize operating frequency and minimize signal distortion.
Figures 4A and 4B show two different layouts which are
recommended only as guidelines. Other suitable clock layouts may
exist and it would be recommended that the board designers
simulate to guarantee compatibility across all printed circuit and
clock component process variations.
Figure 4A. 3.3V LVPECL Output Termination Figure 4B. 3.3V LVPECL Output Termination
XTAL_IN
XTAL_OUT
Ro Rs
Zo = Ro + Rs
50Ω
0.1µf
R1
R2
V
DD
V
DD
R1
84
R2
84
3.3V
R3
125
R4
125
Z
o
= 50
Z
o
= 50
Input
3.3V
3.3V
+
_
11©2016 Integrated Device Technology, Inc. Revision B, January 20, 2016
843252 Datasheet
Schematic Example
Figure 5 shows an example of 843252 application schematic. In
this example, the device is operated at V
CC
= 3.3V. The 18pF
parallel resonant 25MHz crystal is used. The C1 = 22pF and C2 =
22pF are recommended for frequency accuracy. For different
board layouts, the C1 and C2 may be slightly adjusted for
optimizing frequency accuracy. Two examples of LVPECL
terminations are shown in this schematic. Additional termination
approaches are shown in the LVPECL Termination Application
Note.
Figure 5. 843252 Schematic Example
X1
25MHz
To Logic
Input
pins
VCCA
R8
50
+
-
VCCO_B
C40.1u
Optional
LVPECL
Y-Termination
3.3V
QA
VCCO_A
QA
R1
133
R5
10
RU2
Not Install
nQA
QB
SELB1
C3
0.1u
Logic Input Pin Examples
Zo = 50 Ohm
R9
50
C1
22pF
To Logic
Input
pins
+
-
Zo = 50 Ohm
nQA
R3
82.5
V CCO_A =3.3V
RU1
1K
C5
0.1u
FB_SEL
R4
82.5
C2
22pF
Zo = 50 Ohm
nQB
Set Logic
Input to
'0'
VCC
RD1
Not Install
VCC
R7
50
Zo = 50 Ohm
QB
nQB
SELA0
V CCO_B=3.3V
U1
1
2
3
4
5
6
7
8 9
10
11
12
13
14
15
16
nQB
QB
VCCO_B
SELB1
SELB0
VCCO_A
QA
nQA FB_SEL
VCCA
VCC
SELA0
SELA1
VEE
XTA L_OU T
XTA L_I N
RD2
1K
VCC=3.3V
Set Logic
Input to
'1'
VCC
SELA1
C70.1u
C6
10u
VCC
SELB0
R2
133
12©2016 Integrated Device Technology, Inc. Revision B, January 20, 2016
843252 Datasheet
Power Considerations
This section provides information on power dissipation and junction temperature for the 843252.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the 843252 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC
= 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
CC_MAX
* I
EE_MAX
= 3.465V * 145mA = 502.43mW
Power (outputs)
MAX
= 30mW/Loaded Output pair
If all outputs are loaded, the total power is 2 * 30mW = 60mW
Total Power_
MAX
(3.3V, with all outputs switching) = 502.43mW + 60mW = 562.43mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device. The
maximum recommended junction temperature for devices is 125°C.
The equation for Tj is as follows: Tj =
JA
* Pd_total + T
A
Tj = Junction Temperature
JA
= Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A
= Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
JA
must be used. Assuming no air flow and
a multi-layer board, the appropriate value is 92.4°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.562W * 92.4°C/W = 121.9°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 7. Thermal Resistance
JA
for 16 Lead TSSOP, Forced Convection
JA
vs. Air Flow
Meters per Second 012.5
Multi-Layer PCB, JEDEC Standard Test Boards 92.4°C/W 88.0°C/W 85.9°C/W

843252AGLFT

Mfr. #:
Manufacturer:
IDT
Description:
Clock Generators & Support Products 2 LVPECL OUT SYNTHESIZER
Lifecycle:
New from this manufacturer.
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