BUK9E04-40A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 02 — 3 February 2011 6 of 14
NXP Semiconductors
BUK9E04-40A
N-channel TrenchMOS logic level FET
6. Characteristics
Table 6. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
(BR)DSS
drain-source breakdown
voltage
I
D
= 0.25 mA; V
GS
=0V; T
j
=25°C40--V
I
D
= 0.25 mA; V
GS
=0V; T
j
=-55°C36--V
V
GS(th)
gate-source threshold voltage I
D
=1mA; V
DS
=V
GS
; T
j
=2C;
see Figure 10
11.52V
I
D
=1mA; V
DS
=V
GS
; T
j
=17C;
see Figure 10
0.5--V
I
D
=1mA; V
DS
=V
GS
; T
j
=-5C;
see Figure 10
--2.3V
I
DSS
drain leakage current V
DS
=40V; V
GS
=0V; T
j
= 25 °C - 0.05 10 µA
V
DS
=40V; V
GS
=0V; T
j
= 175 °C - - 500 µA
I
GSS
gate leakage current V
GS
=10V; V
DS
=0V; T
j
= 25 °C - 2 100 nA
V
GS
=-10V; V
DS
=0V; T
j
= 25 °C - 2 100 nA
R
DSon
drain-source on-state
resistance
V
GS
=4.3V; I
D
=25A; T
j
=2C - 3.7 5.9 m
V
GS
=10V; I
D
=25A; T
j
=2C - 2.9 4 m
V
GS
=5V; I
D
=25A; T
j
= 175 °C;
see Figure 11; see Figure 12
--8.3m
V
GS
=5V; I
D
=25A; T
j
=2C;
see Figure 11; see Figure 12
-3.54.4m
Dynamic characteristics
Q
G(tot)
total gate charge I
D
=25A; V
DS
=32V; V
GS
=5V;
T
j
=2C; see Figure 13
- 128 - nC
Q
GS
gate-source charge - 13 - nC
Q
GD
gate-drain charge - 56 - nC
C
iss
input capacitance V
GS
=0V; V
DS
=25V; f=1MHz;
T
j
=2C; see Figure 14
- 6200 8260 pF
C
oss
output capacitance - 1040 1250 pF
C
rss
reverse transfer capacitance - 680 940 pF
t
d(on)
turn-on delay time V
DS
=30V; R
L
=1.2; V
GS
=5V;
R
G(ext)
=10; T
j
=2C
-62-ns
t
r
rise time - 309 - ns
t
d(off)
turn-off delay time - 365 - ns
t
f
fall time - 306 - ns
L
D
internal drain inductance from upper edge of drain mounting
base to centre of die ; T
j
=2C
-2.5-nH
from drain lead 6 mm from package
to centre of die ; T
j
=2C
-4.5-nH
L
S
internal source inductance from source lead to source bond
pad ; T
j
=2C
-7.5-nH
Source-drain diode
V
SD
source-drain voltage I
S
=40A; V
GS
=0V; T
j
=2C;
see Figure 15
- 0.85 1.2 V
t
rr
reverse recovery time I
S
=20A; dI
S
/dt = -100 A/µs;
V
GS
=-10V; V
DS
=30V; T
j
=2C
- 260 - ns
Q
r
recovered charge - 531 - nC
BUK9E04-40A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 02 — 3 February 2011 7 of 14
NXP Semiconductors
BUK9E04-40A
N-channel TrenchMOS logic level FET
Fig 5. Output characteristics: drain current as a
function of drain-source voltage; typical values
Fig 6. Drain-source on-state resistance as a function
of gate-source voltage; typical values
Fig 7. Sub-threshold drain current as a function of
gate-source voltage
Fig 8. Forward transconductance as a function of
drain current; typical values
03nd95
0
100
200
300
400
0246810
V
DS
(V)
I
D
(A)
2.2
3
4
10
6
7
8
V
GS
= 5 V
03nd94
2
3
4
5
3691215
V
GS
(V)
R
DSon
(mΩ)
03aa36
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
0123
V
GS
(V)
I
D
(A)
maxtypmin
03nd92
0
20
40
60
80
100
020406080
I
D
(A)
g
fs
(S)
BUK9E04-40A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 02 — 3 February 2011 8 of 14
NXP Semiconductors
BUK9E04-40A
N-channel TrenchMOS logic level FET
Fig 9. Transfer characteristics: drain current as a
function of gate-source voltage; typical values
Fig 10. Gate-source threshold voltage as a function of
junction temperature
Fig 11. Drain-source on-state resistance as a function
of drain current; typical values
Fig 12. Normalized drain-source on-state resistance
factor as a function of junction temperature
03nd93
0
20
40
60
80
100
01234
V
GS
(V)
I
D
(A)
T
j
= 175 °C T
j
= 25 °C
03aa33
0
0.5
1
1.5
2
2.5
-60 0 60 120 180
T
j
(
°
C)
V
GS(th)
(V)
max
typ
min
03nd96
0
2
4
6
8
10
0 100 200 300 400
I
D
(A)
R
DSon
(mΩ)
V
GS
= 3 V 4
5
3.83.63.43.2
10
03aa27
0
0.5
1
1.5
2
60 0 60 120 180
T
j
(
°
C)
a

BUK9E04-40A,127

Mfr. #:
Manufacturer:
Nexperia
Description:
MOSFET Trans MOSFET N-CH 40V 198A 3Pin(3+Tab)
Lifecycle:
New from this manufacturer.
Delivery:
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