Data Sheet ADN3010-11
Rev. A | Page 9 of 10
OUTLINE DIMENSIONS
Figure 11. 11-Pad Bare Die [CHIP]
(C-11-1)
Dimensions shown in millimeters
Figure 12. Tape and Reel Outline Dimensions
Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS
Table 5. Die Specifications
Parameter Value Unit
Die Size 0.835 (−0.04) × 0.675 (−0.04) mm
Saw Blade Size 0.04 mm
Die Grind Thickness 0.25 ± 0.0127 (10.0 ± 0.5 mils), 675 µm before backside grinding mm
Bond Pad 0.076 × 0.076 mm
Backside Contact Ground Not applicable
Passivation Openings 0.076 × 0.076 mm
Photodiode Diameter 0.05 mm
Table 6. Assembly Recommendations
Assembly Component Recommendation
Die Attach Ground
Bonding Method Ball or wedge
Bonding Sequence See Table 4
12-08-2010-A
0.835
0.675
0.270
0.245
0.229
SIDE VIEW
TOP VIEW
(CIRCUIT SIDE)
2
6
5
7
8
9
10
11
1
4
3
12-08-2010-A
8.30
8.00
7.90
SECTION A-A
DIRECTION OF FEED
0.27
0.25
0.23
3.55
3.50
3.45
1.85
1.75
1.65
0.37
0.32
0.27
1.00
0.95
0.90
0.84
0.79
0.74
4.10
4.00
3.90
4.10
4.00
3.90
2.05
2.00
1.95
PIN 1
A
A
