RA2450-D06

4 Specifications are subject to change without notice (28.04.2015)
RA 24.. .. 06, RA 44.. .. 08, RA 48.. .. 12
Heatsink Dimensions (load current versus ambient temperature)
Power
dissipation [W]
2 1.7 1.4 1 0.71 0.40 32
2.5 2.1 1.8 1.4 1 0.66 27
3.1 2.7 2.3 1.9 1.4 1 23
4. 3.5 3 2.5 2 1.4 20
4.9 4.3 3.7 3.1 2.5 1.9 16
6.2 5.4 4.6 3.9 3.1 2.3 13
8.1 7.1 6.1 5.1 4310
11.3 9.9 8.5 7.1 5.6 4.2 7
- 15.6 13.3 11.1 8.9 6.7 5
----18.7 14 2
20 30 40 50 60 70
25
22.5
20
17.5
15
12.5
10
7.5
5
2.5
T
A
Ambient temp. [°C]
Load
current [A]
RA ..50 .. ..
T
A
Ambient temp. [°C]
50
45
40
35
30
25
20
15
10
5
Power
dissipation [W]
Thermal resistance
[K/W]
Load
current [A]
Thermal resistance
[K/W]
0.92 0.76 0.60 0.45 0.29 - 63
1.2 0.99 0.80 0.62 0.44 0.26 55
1.5 1.3 1.1 0.85 0.63 0.42 47
1.9 1.6 1.4 1.1 0.89 0.63 40
2.4 2.1 1.8 1.5 1.2 0.91 33
3 2.7 2.3 1.9 1.5 1.1 26
3.9 3.5 3 2.5 2 1.5 20
5.5 4.8 4.1 3.4 2.7 2.1 15
8.6 7.5 6.4 5.4 4.3 3.2 9
17.9 15.6 13.4 11.2 8,9 6.7 4
20 30 40 50 60 70
Thermal resistance
[K/W]
Load
current [A]
Power
dissipation [W]
RA ..90 .. ..
T
A
Ambient temp. [°C]
0.63 0.53 0.42 0.32 --97
0.81 0.69 0.57 0.45 0.33 - 84
1 0.89 0.75 0.61 0.47 0.33 71
1.3 1.2 1 0.83 0.66 0.49 59
1.7 1.5 1.3 1.1 0.85 0.64 47
2.2 1.9 1.7 1.4 1.1 0.83 36
3.1 2.7 2.3 1.9 1.5 1.2 26
4.8 4.2 3.6 3 2.4 1.8 17
10 8.8 7.5 6.3 5 3.8 8
20 30 40 50 60 70
90
80
70
60
50
40
30
20
10
RA ..25 .. ..
Specifications are subject to change without notice (28.04.2015) 5
Applications
Thermal characteristics
The thermal design of Solid
State Relays is very impor-
tant. It is essential that the user
makes sure that cooling is ad-
equate and that the maximum
junction temperature of the re-
lay is not exceeded.
This relay is designed for use
in applications in which it is
exposed to high surge condi-
tions. Care must be taken to
ensure proper heatsinking
when the relay is to be used at
high sustained currents. Ade-
quate electrical connection
between relay terminals and
cable must be ensured.
RA 24.. .. 06, RA 44.. .. 08, RA 48.. .. 12
Heat flow
Heatsink
temperature
R
th
j-c
R
th
c-s
R
th
s-a
Junction
temperature
Case
temperature
Ambient
temperature
Thermal resistance:
R
th
j-c = junction to case
Direct bonding
In the design of the output
power semiconductor direct
bonding of the copper layer
and the ceramic substrate has
been applied. This is to en-
sure uninhibited heat transfer
and high thermal fatigue
strength.
The relay has been designed
for applications requiring lar-
ge numbers of load cycles.
Power dissipation
The power dissipation for in-
termittent use is calculated ac-
cording to the following for-
mula:
t
on
t
off
OFF
ON
I
rms
=
I
ON
2
x t
ON
t
ON
+ t
OFF
Ex: RA 24 50 -D 06:
Load current = 45 A
t
ON
= 30 s
t
OFF
= 15 s
I
rms
=
45
2
x 30
30 + 15
The rms current will be
36.7 A.
If the heatsink is placed in a
small closed room, control
panel or the like, the power
dissipation can cause the
ambient temperature to rise.
The heatsink is to be cal-
culated on the basis of the
ambient temperature and the
increase in temperature.
R
th
c-s = case to heatsink
R
th
s-a = heatsink to ambient
Heatsinks and fans
5.40
o
C/W to 0.12
o
C/W thermal resistance
DIN, panel or thru wall mounting
Single or multiple SSR mounting
Heatsink Selection
Heatsink Range Overview:
http://www.productselection.net/PDF/UK/ssr_accessories.pdf
Heatsink Selector Tool:
http://www.productselection.net/heatsink/heatsinkselector.php?LANG=UK
Ordering Key
RHS..

RA2450-D06

Mfr. #:
Manufacturer:
Description:
SSR RELAY SPST-NO 50A 24-280V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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