1N5767

1N5719, 1N5767, 5082-3001, 5082-3039,
5082-3077, 5082-3080/81, 5082-3188, 5082-3379
PIN Diodes for RF Switching and Attenuating
Data Sheet
Description/Applications
These general purpose switching diodes are intended for
low power switching applications such as RF duplexers,
antenna switching matrices, digital phase shifters, and time
multiplex lters. The 5082-3188 is optimized for VHF/UHF
bandswitching.
The RF resistance of a PIN diode is a function of the current
owing in the diode. These current controlled resistors are
specied for use in control applications such as variable RF
attenuators, automatic gain control circuits, RF modula-
tors, electrically tuned lters, analog phase shifters, and
RF limiters.
Outline 15 diodes are available on tape and reel. The tape
and reel specication is patterned after RS-296-D.
Outline 15
Maximum Ratings
Junction Operating and
Storage Temperature Range .........................-65°C to +150°C
Power Dissipation 25°C ................................................. 250 mW
(Derate linearly to zero at 150°C)
Peak Inverse Voltage (PIV) ......................................same as V
BR
Maximum Soldering Temperature ............... 260°C for 5 sec
Features
Low Harmonic Distortion
Large Dynamic Range
Low Series Resistance
Low Capacitance
0.41 (.016)
0.36 (.014)
25.4 (1.00)
MIN.
25.4 (1.00)
MIN.
1.93 (.076)
1.73 (.068)
CATHODE
DIMENSIONS IN MILLIMETERS AND (INCHES).
4.32 (.170)
3.81 (.150)
2
Mechanical Specications
The Avago Outline 15 package has a glass hermetic seal with
dumet leads. The lead nish is 95-5 tin-lead (SnPb) for all
PIN diodes. The leads on the Outline 15 package should be
restricted so that the bend starts at least 1/16 inch (1.6 mm)
from the glass body. Typical package inductance and ca-
pacitance are 2.5 nH and 0.13 pF, respectively. Marking is
by digital coding with a cathode band.
General Purpose Diodes
Electrical Specications at T
A
= 25°C
Maximum Minimum Maximum
Part Total Breakdown Residual Series Eective Carrier Reverse Recovery
Number Capacitance Voltage Resistance Lifetime Time
5082- C
T
(pF) V
BR
(V) R
S
() τ (ns) t
rr
(ns)
General Purpose Switching and Attenuating
3001 0.25 200 1.0 100 (min.) 100 (typ.)
3039 0.25 150 1.25 100 (min.) 100 (typ.)
1N5719 0.3** 150 1.25 100 (min.) 100 (typ.)
3077 0.3 200 1.5 100 (min.) 100 (typ)
Band Switching
3188 1.0* 35 0.6** 70 (typ.)* 12 (typ.)
Test V
R
= 50 V V
R
= V
BR
I
F
=100 mA I
F
= 50 mA I
F
= 20 mA
Conditions *V
R
= 20 V Measure *I
F
= 20 mA I
R
= 250 mA V
R
= 10 V
**V
R
= 100 V I
R
≤ 10 µA **I
F
= 10 mA *I
F
= 10 mA 90% Recovery
f = 1 MHz f = 100 MHz *I
R
= 6 mA
Notes:
Typical CW power switching capability for a shunt switch in a 50Ω system is 2.5 W.
RF Current Controlled Resistor Diodes
Electrical Specications at T
A
= 25°C
Max.
Max. High Low Dierence
Eective Min. Residual Max. Resistance Resistance in
Carrier Breakdown Series Total Limit, R
H
() Limit, R
L
() Resistance
Part Lifetime Voltage Resistance Capacitance vs. Bias
Number τ (ns) V
BR
(V) R
S
() C
T
(pF) Min. Max. Min. Max. Slope, Dc
5082-3080 1300 (typ.) 100 2.5 0.4 1000 8**
1N5767* 1300 (typ.) 100 2.5 0.4 1000 8**
5082-3379 1300 (typ.) 50 0.4 8**
5082-3081 2500 (typ.) 100 3.5 0.4 1500 8**
Test I
F
= 50 mA V
R
= V
BR
, I
F
= 100 mA V
R
= 50 V I
F
= 0.01 mA I
F
= 1.0 mA Batch
Conditions I
R
= 250 mA Measure f = 100 MHz f = 1 MHz f = 100 MHz I
F
= 20 mA** Matched at
I
R
≤ 10 µA f = 100 MHz I
F
= 0.01 mA
and 1.0 mA
f = 100 MHz
*The 1N5767 has the additional specications: τ = 1.0 msec minimum
I
R
= 1 µA maximum at V
R
= 50 V
V
F
= 1 V maximum at I
F
= 100 mA.
3
Typical Parameters at T
A
= 25°C (unless otherwise noted)
I
F
– FORWARD BIAS CURRENT (mA)
Figure 2. Typical RF Resistance vs.
Forward Bias Current.
10,000
1000
100
10
1
0.1
RF RESISTANCE (OHMS)
0.001 0.01 0.1
1
10 100
5082-3001
5082-3039
5082-3077
IN5719
100
10
1
0.1
0.01
0 0.2 0.4 0.6 0.8 1.0 1.2
I
F
– FORWARD CURRENT (mA)
V
F
– FORWARD VOLTAGE (V)
Figure 1. Forward Current vs. Forward
Voltage.
5082-3001, 3039,
3077, 3080
IN5719
125°C
25°C
–60°C
Figure 3. Typical RF Resistance vs.
Forward Bias Current.
I
F
– FORWARD BIAS CURRENT (mA)
100,000
10,000
1000
100
10
1
RF RESISTANCE (OHMS)
0.001 0.01 0.1
1
10 100
5082-3080
5082-3379
5082-3081
REVERSE VOLTAGE (V)
Figure 4. Typical Capacitance vs.
Reverse Voltage.
1.0
.5
0
CAPACITANCE (pF)
0 10 20
30
40 50 60 70
Figure 5. Typical Capacitance vs.
Reverse Voltage.
5082-3001
3039
3077
IN5719
5082-3039
IN5719
5082-3001
REVERSE VOLTAGE (V)
2.5
.5
1.0
1.5
2.0
0
CAPACITANCE (pF)
0 10 20
30
40 50 60 70
5082-3080
5082-3081
5082-3379
5082-3188
Figure 7. Typical Second Order
Intermodulation Distortion.
FREQUENCY (MHz)
0
80
60
40
20
100
BELOW FIRST ORDER (dB)
0 10 20
30
40 50 60 8070
10 dB Bridged Tee Attenuator
40 dB mV Output Levels
One Input Frequency Fixed 100 MHz
5082-3081
Figure 6. Typical Reverse Recovery Time
vs. Forward Current for Various Reverse
Driving Voltages.
FORWARD CURRENT (mA)
REVERSE RECOVERY TIME (ns)
0 10 20 30
V
R
= 5V
V
R
= 10V
V
R
= 20V
1000
100
10
5082-3080
5082-3379
Figure 8. Typical Cross Intermodulation
Distortion.
MODULATED FREQUENCY (MHz)
10
70
60
50
40
30
20
80
BELOW FIRST ORDER (dB)
0 10 20
30
40 50 60 8070
PIN Diode Cross Modulation
10 dB Bridged Tee Attenuator
Unmodulated Frequency 100 MHz
100% Modulation 15 kHz
40 dB mV Output Levels
5082-3081
5082-3080
5082-3379

1N5767

Mfr. #:
Manufacturer:
Microchip / Microsemi
Description:
PIN Diodes MICROWAVE PIN DIODE
Lifecycle:
New from this manufacturer.
Delivery:
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