TC1107
DS21356C-page 4 2002-2012 Microchip Technology Inc.
3.0 DETAILED DESCRIPTION
The TC1107 is a precision regulator available in fixed
voltages. Unlike bipolar regulators, the TC1107’s
supply current does not increase with load current. In
addition, V
OUT
remains stable and within regulation
over the entire 0mA to I
OUTMAX
operating load current
range, (an important consideration in RTC and CMOS
RAM battery back-up applications).
Figure 3-1 shows a typical application circuit. The
regulator is enabled any time the shutdown input
(SHDN
) is at or above V
IH
, and shutdown (disabled)
when SHDN
is at or below V
IL
. SHDN may be
controlled by a CMOS logic gate, or I/O port of a
microcontroller. If the SHDN input is not required, it
should be connected directly to the input supply. While
in shutdown, supply current decreases to 0.05A
(typical), V
OUT
falls to zero.
FIGURE 3-1: TYPICAL APPLICATION
CIRCUIT
3.1 Output Capacitor
A 1F (min) capacitor from V
OUT
to ground is required.
The output capacitor should have an effective series
resistance greater than 0.1 and less than 5.0. A 1F
capacitor should be connected from V
IN
to GND if there
is more than 10 inches of wire between the regulator
and the AC filter capacitor, or if a battery is used as the
power source. Aluminum electrolytic or tantalum
capacitor types can be used. (Since many aluminum
electrolytic capacitors freeze at approximately -30°C,
solid tantalums are recommended for applications
operating below -25°C.) When operating from sources
other than batteries, supply-noise rejection and
transient response can be improved by increasing the
value of the input and output capacitors and employing
passive filtering techniques.
3.2 Bypass Input
A 470pF capacitor connected from the Bypass input to
ground reduces noise present on the internal
reference, which in turn significantly reduces output
noise. If output noise is not a concern, this input may be
left unconnected. Larger capacitor values may be
used, but results in a longer time period to rated output
voltage when power is initially applied.
TC1107
1
2
3
4
5
6
7
8
V
OUT
V
OUT
C
BYPASS
Shutdown Control
(from Power Control Logic)
C2
1μF
GND
NC
Bypass
V
IN
NC
NC
SHDN
C1
1μF
Battery
+
++
470pF
(Optional)
2002-2012 Microchip Technology Inc. DS21356C-page 5
TC1107
4.0 THERMAL CONSIDERATIONS
4.1 Thermal Shutdown
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 150°C.
The regulator remains off until the die temperature
drops to approximately 140°C.
4.2 Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
EQUATION 4-1:
The maximum allowable power dissipation (Equation
4-2) is a function of the maximum ambient temperature
(T
A
MAX
), the maximum allowable die temperature
(T
JMAX
) and the thermal resistance from junction-to-air
(
JA
). The 8-Pin SOIC package has a
JA
of
approximately 160°C/Watt, while the 8-Pin MSOP
package has a
JA
of approximately 200°C/Watt.
EQUATION 4-2:
Equation 4-1 can be used in conjunction with Equation
4-2 to ensure regulator thermal operation is within
limits. For example:
Given:
V
INMAX
= 3.0V + 10%
V
OUTMIN
= 2.7V – 2.5%
I
LOADMAX
= 250mA
T
JMAX
= 125°C
T
AMAX
= 55°C
8-Pin MSOP Package
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
P
D
(V
INMAX
– V
OUTMIN
)I
LOADMAX
= [(3.0 x 1.1) – (2.7 x .975)]250 x 10
–3
= 167mW
Maximum allowable power dissipation:
In this example, the TC1107 dissipates a maximum of
167mW; below the allowable limit of 318mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits.
4.3 Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
supply bus lines combine to lower
JA
and therefore
increase the maximum allowable power dissipation
limit.
Where:
P
D
(V
INMAX
– V
OUTMIN
)I
LOADMAX
P
D
V
INMAX
V
OUTMIN
I
LOADMAX
= Worst case actual power dissipation
= Minimum regulator output voltage
= Maximum output (load) current
= Maximum voltage on V
IN
P
DMAX
= (T
JMAX
– T
AMAX
)
JA
= (125 – 55)
220
= 318mW
TC1107
DS21356C-page 6 2002-2012 Microchip Technology Inc.
5.0 TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Output Noise
FREQUENCY (kHz)
NOISE (μV/HZ)
10.0
1.0
0.01
0.01 1
10
100 1000
0.1
0.0
R
LOAD
= 50Ω
C
OUT
= 1μF
0.012
0.010
0.008
0.004
0.002
0.000
-0.002
-0.004
0.006
-40° -20°
0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (
°
C)
Line Regulation
LINE REGULATION (%)
2.00
1.80
1.60
1.20
1.00
0.80
0.60
0.40
0.20
0.00
1.40
-40° -20° 0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (
°
C)
Load Regulation
LOAD REGULATION (%)
1 to 300mA
1 to 50mA
1 to 100mA
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
0
50
100
150
200 250 300
LOAD CURRENT (mA)
DROPOUT VOLTAGE (V)
100.0
90.0
70.0
80.0
50.0
40.0
60.0
-40° -20°
0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (°C)
Supply Current
SUPPLY CURRENT (μA)
3.075
3.025
2.925
2.975
-40° -20°
0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (°C)
V
OUT
vs. Temperature
V
OUT
(V)
12
5
°
C
8
85
°
C
C
7
0
°
C
2
5
°
C
0
°
C
C
-4
0
°
C
V
IN
= 4V
I
LOAD
= 100μA
C
LOAD
= 3.3μF
Power Supply Rejection Ratio
FREQUENCY (Hz)
-30dB
-35dB
-40dB
-45dB
-50dB
-55dB
-60dB
-65dB
-70dB
-75dB
-80dB
100
1K
10K10
1M
100K
V
OUT
= 5V
R
LOAD
= 50Ω
V
INAC
= 50mV p-p
C
OUT
= 1
μ
F
PSRR (dB)

TC1107-2.5VUATR

Mfr. #:
Manufacturer:
Microchip Technology
Description:
LDO Voltage Regulators 300mA LDO w/Shdn
Lifecycle:
New from this manufacturer.
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