Page 12 of 16
Document Number: DS-000126
Revision: 1.1
8 PCB DESIGN AND LAND PATTERN LAYOUT
Lay out the PCB land pattern for the ICS-40212 at a 1:1 ratio to the solder pads on the microphone package (see Figure 8.) Avoid
applying solder paste to the sound hole in the PCB. Figure 9 shows a suggested solder paste stencil pattern layout.
The response of the ICS-40212 is not affected by the PCB hole size, as long as the hole is not smaller than the sound port of the micro-
phone (0.325 mm in diameter). A 0.5 mm to 1 mm diameter for the hole is recommended.
Align the hole in the microphone package with the hole in the PCB. The exact degree of the alignment does not affect the
performance of the microphone as long as the holes are not partially or completely blocked.
Figure 8. Recommended PCB Land Pattern Layout
Figure 9. Recommended Solder Paste Stencil Pattern Layout
8.1 PCB MATERIAL AND THICKNESS
The performance of the ICS-40212 is not affected by PCB thickness. The ICS-40212 can be mounted on either a rigid or flexible PCB.
A flexible PCB with the microphone can be attached directly to the device housing with an adhesive layer. This mounting method
offers a reliable seal around the sound port while providing the shortest acoustic path for good sound quality.
Ø1.025
Ø1.625
0.522x0.725(4X)
1.252
0.822
1.675
0.838
1.2520.822
1.675
0.1(4x)
Ø1.125
Ø1.625
0.422x0.625(4X)
