MC74LVX139DTR2G Datasheet MC74LVX139DR2G, MC74LVX139DTR2G | P4-P6

MC74LVX139

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4

DC CHARACTERISTICS (Voltages Referenced to GND)

V

CC

T

A

= 25°C −40°C ≤ T

A

≤ 85°C

Symbol Parameter Condition (V) Min Typ Max Min Max Unit

V

IH

Minimum High−Level

Input Voltage

2.0

3.0

3.6

0.75 V

CC

0.7 V

CC

0.7 V

CC

−

0.75 V

CC

0.7 V

CC

0.7 V

CC

−

V

IL

Maximum Low−Level

Input Voltage

2.0

3.0

3.6

−

0.25 V

CC

0.3 V

CC

0.3 V

CC

−

0.25 V

CC

0.3 V

CC

0.3 V

CC

V

OH

High−Level Output

Voltage

I

OH

= −50 mA

I

OH

= −50 mA

I

OH

= −4 mA

2.0

3.0

1.9

2.9

2.58

2.0

3.0

−

1.9

2.9

2.48

−

V

OL

Low−Level Output

Voltage

I

OL

= 50 mA

I

OH

= 50 mA

I

OH

= 4 mA

2.0

3.0

−

0.0 0.1

0.1

0.36

−

0.1

0.44

V

I

IN

Input Leakage Current V

IN

= 5.5 V or GND 0 to 3.6 − − ±0.1 − ±1.0

mA

I

CC

Maximum Quiescent

Supply Current

(per package)

V

IN

= V

CC

or GND 3.6 1.0 1.0 2.0 − −

mA

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

AC ELECTRICAL CHARACTERISTICS Input t

r

= t

f

= 3.0 ns

T

A

= 25°C −40°C ≤ T

A

≤ 85°C

Symbol Parameter Test Conditions Min Typ Max Min Max Unit

t

PLH

,

t

PHL

Maximum Propagation

Delay, A to Y

V

CC

= 2.7 V C

L

= 15 pF

C

L

= 50 pF

−

8.5

11.0

15.0

16.5

1.0

17.8

18.0

ns

V

CC

= 3.3 V ± 0.3 V C

L

= 15 pF

C

L

= 50 pF

−

6.0

8.5

10.0

13.0

1.0

12.0

15.0

t

PLH

,

t

PHL

Maximum Propagation

Delay, E

to Y

V

CC

= 2.7 V C

L

= 15 pF

C

L

= 50 pF

−

8.0

10.0

13.0

16.5

1.0

15.5

18.0

ns

V

CC

= 3.3 V ± 0.3 V C

L

= 15 pF

C

L

= 50 pF

−

5.5

7.5

8.2

13.0

1.0

10.0

15.0

C

IN

Maximum Input

Capacitance

− 4 10 − 10 pF

C

PD

Power Dissipation Capacitance (Note 5)

Typical @ 25°C, V

CC

= 3.3 V

pF

26

5. C

PD

is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.

Average operating current can be obtained by the equation: I

CC(OPR

)

= C

PD

 V

CC

 f

in

+ I

CC

/2 (per decoder). C

PD

is used to determine the

no−load dynamic power consumption; P

D

= C

PD

 V

CC

2

 f

in

+ I

CC

 V

CC

.

Figure 5. Switching Waveform

50%

t

PHL

t

PLH

V

CC

GND

Y

50% V

CC

A

V

CC

GND

t

PHL

t

PLH

Y

E

50% V

CC

50%

Figure 6. Switching Waveform

MC74LVX139

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5

*Includes all probe and jig capacitance

Figure 7. Test Circuit

C

L

*

TEST POINT

DEVICE

UNDER

TEST

OUTPUT

ORDERING INFORMATION

Device Package Shipping

†

MC74LVX139DR2G SOIC−16

(Pb−Free)

2500 Tape & Reel

MC74LVX139DTR2G TSSOP−16

(Pb−Free)

2500 Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

EMBOSSED CARRIER DIMENSIONS (See Notes 6 and 7)

Tape

Size

B

1

Max

D D

1

E F K P P

0

P

2

R T W

8 mm 4.35 mm

(0.179”)

1.5 mm

+ 0.1

−0.0

(0.059”

+0.004

−0.0)

1.0 mm

Min

(0.179”)

1.75 mm

±0.1

(0.069

±0.004”)

3.5 mm

±0.5

(1.38

±0.002”)

2.4 mm

Max

(0.094”)

4.0 mm

±0.10

(0.157

±0.004”)

4.0 mm

±0.1

(0.157

±0.004”)

2.0 mm

±0.1

(0.079

±0.004”)

25 mm

(0.98”)

0.6 mm

(0.024)

8.3 mm

(0.327)

12 mm 8.2 mm

(0.323”)

1.5 mm

Min

(0.060)

5.5 mm

±0.5

(0.217

±0.002”)

6.4 mm

Max

(0.252”)

4.0 mm

±0.10

(0.157

±0.004”)

8.0 mm

±0.10

(0.315

±0.004”)

30 mm

(1.18”)

12.0 mm

±0.3

(0.470

±0.012”)

16 mm 12.1 mm

(0.476”)

7.5 mm

±0.10

(0.295

±0.004”)

7.9 mm

Max

(0.311”)

4.0 mm

±0.10

(0.157

±0.004”)

8.0 mm

±0.10

(0.315

±0.004”)

12.0 mm

±0.10

(0.472

±0.004”)

16.3 mm

(0.642)

24 mm 20.1 mm

(0.791”)

11.5 mm

±0.10

(0.453

±0.004”)

11.9 mm

Max

(0.468”)

16.0 mm

±0.10

(0.63

±0.004”)

24.3 mm

(0.957)

6. Metric Dimensions Govern−English are in parentheses for reference only.

7. A

0

, B

0

, and K

0

are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to

0.50 mm max. The component cannot rotate more than 10° within the determined cavity

MC74LVX139

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6

PACKAGE DIMENSIONS

TSSOP−16

CASE 948F

ISSUE B

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A 4.90 5.10 0.193 0.200

B 4.30 4.50 0.169 0.177

C −−− 1.20 −−− 0.047

D 0.05 0.15 0.002 0.006

F 0.50 0.75 0.020 0.030

G 0.65 BSC 0.026 BSC

H 0.18 0.28 0.007 0.011

J 0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K 0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L 6.40 BSC 0.252 BSC

M 0 8 0 8

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD

FLASH. PROTRUSIONS OR GATE BURRS.

MOLD FLASH OR GATE BURRS SHALL NOT

EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION SHALL

NOT EXCEED 0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08

(0.003) TOTAL IN EXCESS OF THE K

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

____

SECTION N−N

SEATING

PLANE

IDENT.

PIN 1

1

8

16

9

DETAIL E

J

J1

B

C

D

A

K

K1

H

G

DETAIL E

F

M

L

2X L/2

−U−

S

U0.15 (0.006) T

S

U0.15 (0.006) T

S

U

M

0.10 (0.004) V

S

T

0.10 (0.004)

−T−

−V−

−W−

0.25 (0.010)

16X REFK

N

7.06

16X

0.36

16X

1.26

0.65

DIMENSIONS: MILLIMETERS

1

PITCH

SOLDERING FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

MC74LVX139DTR2G

MC74LVX139DTR2G

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